Patents by Inventor Kazuaki Kitaoka

Kazuaki Kitaoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9463587
    Abstract: A method of RTM molding includes placing a reinforcing fiber substrate in a mold, placing resin distribution media exhibiting a resin flow resistance lower than a resin flow resistance of said reinforcing fiber substrate on both surfaces of said reinforcing fiber substrate, and after pressure in said mold is reduced by evacuation, injecting a resin into said mold through said resin distribution media to impregnate said reinforcing fiber substrate with said resin injected, wherein resin flow resistance of a first resin distribution medium placed on a first surface of said reinforcing fiber substrate is lower than resin flow resistance of a second resin distribution medium placed on a second surface of said reinforcing fiber substrate, and said evacuation is carried out through said second resin distribution medium while said resin is injected into said first resin distribution medium to impregnate said reinforcing fiber substrate with said resin injected.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: October 11, 2016
    Assignees: Toray Industries, Inc., Mitsubishi Heavy Industries, Ltd.
    Inventors: Toshihide Sekido, Kazuaki Kitaoka, Hiroshi Odani, Shigeru Nishiyama, Masahiko Shimizu
  • Patent number: 9120253
    Abstract: A method of RTM molding including laminating a plurality of reinforcing fiber materials in a mold to form a reinforcing fiber material laminate, and impregnating a resin into said reinforcing fiber material laminate by injecting a resin in a direction from an end surface of said reinforcing fiber material laminate along a laminate surface while reducing pressure in said mold by evacuation.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: September 1, 2015
    Assignees: Toray Industries, Inc., Mitsubishi Heavy Industries, Ltd.
    Inventors: Toshihide Sekido, Kazuaki Kitaoka, Hiroshi Odani, Shigeru Nishiyama, Masahiko Shimizu
  • Publication number: 20130228956
    Abstract: A method of RTM molding including placing a reinforcing fiber substrate in a mold, placing a resin distribution medium having a resin flow resistance lower than a resin flow resistance of said reinforcing fiber substrate on a surface of said reinforcing fiber substrate opposite said mold, providing a degasification medium comprising a gas permeation film and a gas permeable substrate between said reinforcing fiber substrate and said mold, and injecting a resin into said mold through said resin distribution medium after pressure in said mold is reduced by evacuation, whereby the injected resin is impregnated into said reinforcing fiber substrate by evacuating said resin injected from a degasification space formed between said gas permeation film and said mold.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 5, 2013
    Applicants: Mitsubishi Heavy Industries, Ltd., Toray Industries, Inc.
    Inventors: Toshihide Sekido, Kazuaki Kitaoka, Hiroshi Odani, Shigeru Nishiyama, Masahiko Shimizu
  • Patent number: 8420002
    Abstract: A method of RTM molding wherein a reinforcing fiber substrate is placed in a mold, each of a first and a second resin distribution media exhibiting a resin flow resistance lower than the resistance of the reinforcing fiber substrate is placed on each surface of the reinforcing fiber substrate, and the inside of the mold is evacuated and a resin is injected into the mold to thereby impregnate the reinforcing fiber substrate with the resin injected, characterized in that the first resin distribution medium exhibits a resin flow resistance lower than that of the second resin distribution medium, and the evacuation is carried out through the second resin distribution medium while the resin is injected through the first resin distribution medium. The method can be advantageously employed for producing, in particular, FRP structure which is thick and excellent in designability, lightweight property and/or strength.
    Type: Grant
    Filed: October 9, 2003
    Date of Patent: April 16, 2013
    Assignees: Toray Industries, Inc., Mitsubishi Heavy Industries, Ltd.
    Inventors: Toshihide Sekido, Kazuaki Kitaoka, Hiroshi Odani, Shigeru Nishiyama, Masahiko Shimizu
  • Publication number: 20060125155
    Abstract: A method of RTM molding wherein a reinforcing fiber substrate is placed in a mold, each of a first and a second resin distribution media exhibiting a resin flow resistance lower than the resistance of the reinforcing fiber substrate is placed on each surface of the reinforcing fiber substrate, and the inside of the mold is evacuated and a resin is injected into the mold to thereby impregnate the reinforcing fiber substrate with the resin injected, characterized in that the first resin distribution medium exhibits a resin flow resistance lower than that of the second resin distribution medium, and the evacuation is carried out through the second resin distribution medium while the resin is injected through the first resin distribution medium. The method can be advantageously employed for producing, in particular, FRP structure which is thick and excellent in designability, lightweight property and/or strength.
    Type: Application
    Filed: October 9, 2003
    Publication date: June 15, 2006
    Applicant: Toray industries, Inc.
    Inventors: Toshihide Sekido, Kazuaki Kitaoka, Hiroshi Odani, Shigeru Nishiyama, Masahiko Shimizu