Abstract: In a facility state monitoring system, a sensor node includes a sensor that outputs, as sensor data, data indicating the state of a facility as a monitoring target, a communication unit, and a power supply unit that supplies power to the sensor and the communication unit. The sensor node is commonly used by multiple monitoring targets. A receiver receives the sensor data transmitted from the communication unit. A state detection unit receives the sensor data received by the receiver, and learns, as learning data, normal states of the monitoring targets based on normal sensor data corresponding to normal operations of the monitoring targets. In response to the receiver receiving the sensor data transmitted from the sensor node after learning, the state detection unit compares states of the monitoring targets indicated by the sensor data with the learning data to detect an abnormality occurrence or symptom in the monitoring targets.

Abstract: A piezoelectric element includes a support and a vibration unit disposed on the support. The vibration unit includes a piezoelectric film and an electrode film connected to the piezoelectric film to extract charges generated by deformation of the piezoelectric film. The vibration unit has a support region supported on the support, and a vibration region connected to the support region and floating from the support. The vibration unit outputs a pressure detection signal based on the charges. The vibration region includes a plurality of slits extending from a support region side toward a center of the vibration region and is in a state of being supported at both ends with respect to the support region.

Abstract: A piezoelectric element includes a support member and a vibrating portion. The vibrating portion has a support region supported by the support member, and a plurality of vibration regions, one end portion side of which is supported by the support region, and the other end portion side of which is opposite to the one end portion is floating from the support member. A first vibration region in which a mass on the one end portion side is heavier than the mass on the other end portion side serves as a pressure detection section outputting a first detection signal based on the charge of the piezoelectric film. A second vibration region in which a mass on the other end portion side is heavier than the mass on one end portion side serves as an acceleration detection section outputting a second detection signal based on the charge of the piezoelectric film.

Abstract: A sensing section has a support member having a recess formed thereon, and a floating region disposed on the support member and formed by a recess. The sensing section has a slit through which the medium to be measured passes is formed in a portion exposed to the medium to be measured. A protective film made of a material having higher liquid repellency than that of the sensing section or more lyophilic than the sensing section is provided in the slit while maintaining a state in which the medium to be measured passes.

Abstract: A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.

Abstract: A piezoelectric element includes a plurality of vibration regions that are separated from each other by a slit, and the slit is formed to have a tapered portion that is tapered from a first surface of the vibration regions on an opposite side to a support to a second surface opposite to the first surface. An electrode film is positioned inside than the slit when being viewed from a normal direction orthogonal to the first surface, and an angle formed by a side surface of the tapered portion in the vibration region and a surface parallel to the first surface is in a range of 39 to 81 degrees.

Abstract: A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.

Abstract: A raindrop recognition device is configured to recognize a raindrop on a transparent panel. The raindrop recognition device includes a storage unit, an image input unit, and an image recognition unit. The storage unit stores a trained model that is a machine learning model trained using, as training data, images of the transparent panel with adhered raindrops and images of the transparent panel without adhered raindrops. Image data of the transparent panel taken by a camera is input to the input unit. The image recognition unit is configured to calculate a value representing a raindrop likeness of an object on the transparent panel in the image data by inputting the image data to the trained model. The trained model is trained by training data including images of the transparent panel with uniform background and images of the transparent panel with light source.

Abstract: A device includes: a chip; a support member; an adhesive layer disposed on the support member; and a wire electrically connected to the sensor chip on a side face of the sensor chip. Herein the adhesive layer includes a material exhibiting a dilatancy property in which a shear stress increases in a multi-dimensional function as a shear rate increases.

Abstract: A piezoelectric element includes: a vibration unit that outputs a pressure detection signal according to a pressure; a support member; and an improvement unit for improving a detection accuracy of the pressure detection signal. The vibration unit on the support member includes a piezoelectric film and an electrode film in a support region and vibration regions. Each vibration region has one end portion as a fixed end and an other end portion as a free end. A part of each vibration region on a one end portion side is a first region, and another part of each vibration region on an other end portion side is a second region. The electrode film is disposed in the first region.

Abstract: A semiconductor device includes a semiconductor element, an electronic component electrically connected to the semiconductor element, a connection member electrically connecting the electronic component to the semiconductor element, and a sealing resin portion having a first surface and a second surface opposite to the first surface and integrally holding the semiconductor element, the electronic component, and the connection member in a state where a semiconductor top surface as a surface of the semiconductor element and a component surface as a surface of the electronic component are exposed from the sealing resin portion on a side adjacent to the first surface.

Abstract: A server including a storage and a controller is communicably connected with a communication terminal. The storage is configured to store a processing data and an analysis data for each of a plurality of analysis targets. The processing data relates to a processing condition for forming a concavo-convex structure on a detection substrate to be used in performing a spectroscopic analysis. The analysis data is used to analyze the analysis target from a spectroscopic spectrum of the analysis target obtained by the spectroscopy analysis. Upon receiving a signal requesting the processing data, the controller is configured to select the processing data corresponding to the analysis target and transmit the selected processing data to the communication terminal. Upon receiving a spectroscopic spectrum, the controller is configured to use the analysis data to analyze the spectroscopic spectrum.

Abstract: A semiconductor device includes: a substrate; a semiconductor chip disposed adjacent to a front surface of the semiconductor substrate; an adhesive fixing a back surface of the semiconductor chip to the front surface of the substrate; and a plurality of spacers disposed to regulate a distance between the substrate and the semiconductor chip. The spacers are bonded to the front surface of the substrate or the back surface of the semiconductor chip, and are located on respective vertexes of a polygon surrounding a center of gravity of the semiconductor chip.

Abstract: A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.

Abstract: A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.

Abstract: A bonded body includes a first metal piece, a second metal piece, and a spacer. The first metal piece has a first surface and a protrusion protruding on the first surface. The second metal piece has a second surface, and the second surface of the second metal piece is bonded to the first surface of the first metal piece at the protrusion. The spacer has an electrically insulating property. The spacer is provided on the first surface of the first metal piece, and located between the first metal piece and the second metal piece. The first metal piece and the second metal piece are arranged to face each other such that a portion of the first surface of the first metal piece outside of the spacer is exposed from the second metal piece.

Abstract: A pressure sensor detects a pressure of a pressure transmitting medium. The pressure sensor includes a sensor substrate and a protection film. The sensor substrate includes a recess recessed relative to a periphery thereof and a thin portion thinner than the periphery due to the recess. The protection film is provided on a bottom surface of the recess that is one side of the thin portion and a part of a lateral surface of the recess, and the protection film suppresses an adhesion of a contamination contained in the pressure transmitting medium. The pressure sensor includes an adhesion suppressing portion that includes an uneven section formed in at least a part of the lateral surface, and a liquid repellent film repellent to liquid in the pressure transmitting medium and provided as the protection film on the uneven section to exhibit a lotus effect.

Abstract: A raindrop recognition device is configured to recognize a raindrop on a transparent panel. The raindrop recognition device includes a storage unit, an image input unit, and an image recognition unit. The storage unit stores a trained model that is a machine learning model trained using, as training data, images of the transparent panel with adhered raindrops and images of the transparent panel without adhered raindrops. Image data of the transparent panel taken by a camera is input to the input unit. The image recognition unit is configured to calculate a value representing a raindrop likeness of an object on the transparent panel in the image data by inputting the image data to the trained model. The trained model is trained by training data including images of the transparent panel with uniform background and images of the transparent panel with light source.

Abstract: A device includes: a chip; a support member; an adhesive layer disposed on the support member; and a wire electrically connected to the sensor chip on a side face of the sensor chip. Herein the adhesive layer includes a material exhibiting a dilatancy property in which a shear stress increases in a multi-dimensional function as a shear rate increases.

Abstract: A semiconductor device includes a semiconductor element, an electronic component electrically connected to the semiconductor element, a connection member electrically connecting the electronic component to the semiconductor element, and a sealing resin portion having a first surface and a second surface opposite to the first surface and integrally holding the semiconductor element, the electronic component, and the connection member in a state where a semiconductor top surface as a surface of the semiconductor element and a component surface as a surface of the electronic component are exposed from the sealing resin portion on a side adjacent to the first surface.