Patents by Inventor Kazuharu Kanezaki

Kazuharu Kanezaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5434220
    Abstract: A polyphenylene ether resin composition containing (A) 100 parts by weight of a polyphenylene-ether-base resin composed of 100-60 wt. % of a polyphenylene ether resin and 0-40 wt. % of a polystyrene resin and (B) 1-40 parts by weight of a dicarboxylic acid ester copolymer obtained from a vinyl monomer and an unsaturated dicarboxylic acid ester as copolymerizable components. The dicarboxylic acid ester copolymer has a weight average molecular weight not greater than 60,000. The polyphenylene ether resin composition, if necessary, can further comprise (C) 1-40 parts by weight of conductive carbon or an A-B-A' type or A-B'-B" type block copolymer elastomer. Owing to its excellent mechanical properties, heat resistance and moldability, the resin composition is useful in the fields of automotive vehicles, home electronic or electric appliances and industrial parts or components.
    Type: Grant
    Filed: August 10, 1994
    Date of Patent: July 18, 1995
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Masaji Yoshimura, Kazuharu Kanezaki, Takashi Satoh, Tomoyuki Nakata, Minoru Takiguchi
  • Patent number: 5382627
    Abstract: A polyphenylene ether resin composition containing (A) 100 parts by weight of a polyphenylene-ether-base resin composed of 100-60 wt. % of a polyphenylene ether resin and 0-40 wt. % of a polystyrene resin and (B) 1-40 parts by weight of a dicarboxylic acid ester copolymer obtained from a vinyl monomer and an unsaturated dicarboxylic acid ester as copolymerizable components. The dicarboxylic acid ester copolymer has a weight average molecular weight not greater than 60,000. The polyphenylene ether resin composition, if necessary, can further comprise (C) 1-40 parts by weight of conductive carbon or an A-B-A' type or A-B'-B" type block copolymer elastomer. Owing to its excellent mechanical properties, heat resistance and moldability, the resin composition is useful in the fields of automotive vehicles, home electronic or electric appliances and industrial parts or components.
    Type: Grant
    Filed: August 2, 1993
    Date of Patent: January 17, 1995
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Masaji Yoshimura, Kazuharu Kanezaki, Takashi Satoh, Tomoyuki Nakata, Minoru Takiguchi
  • Patent number: 5349027
    Abstract: A modified polyolefin resin obtained by reacting a polyolefin resin with an epoxy group-containing acrylamide monomer represented by the following general formula I:H.sub.2 C.dbd.CR--CO--NH--CH.sub.2 --Ar:wherein Ar represents an aromatic hydrocarbon group having 6 to 24 carbon atoms which is substituted with at least one glycidyloxy group and R represents a hydrogen atom or a methyl group) in the presence of a free-radical initiator is herein provided.A thermoplastic resin composition comprising 5 to 95% by weight of the foregoing modified polyolefin resin and 95 to 5% by weight of another thermoplastic resin is herein provided.Further, a filler-reinforced polyolefin resin composition comprising 100 parts by weight of the foregoing modified polyolefin resin and 3 to 300 parts by weight of an inorganic or organic filler is herein provided.
    Type: Grant
    Filed: September 16, 1992
    Date of Patent: September 20, 1994
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Toru Ueki, Masaji Yoshimura, Kazuharu Kanezaki, Susumu Kishi, Takashi Satoh, Minoru Takiguchi
  • Patent number: 5149465
    Abstract: A conductive resin composition which has electrical conductivity and antistatic property, is excellent in heat resistance and processability, and comprises:(A) from 50 to 95% by weight of a polyphenylene ether resin,(B) from 50 to 5% by weight of a copolymer of a styrenic compound and an .alpha.,.beta.-unsaturated dicarboxylic acid imide compound,(C) from 5 to 30 parts by weight of a conductive carbon per 100 parts by weight of the sum of the resin (A) and the copolymer (B), and (D) from 1 to 20 parts by weight of a low molecular weight polystyrene per 100 parts by weight of the sum of the resin (A) and the copolymer (B).
    Type: Grant
    Filed: March 25, 1991
    Date of Patent: September 22, 1992
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Toru Ueki, Kenji Sakata, Masaji Yoshimura, Kazuharu Kanezaki, Ineo Iwata
  • Patent number: 5075035
    Abstract: A molding material for electroconductive IC parts is here provided which has a preferable heat distortion temperature (heat resistance) and a desirable melt flow index (moldability) and which supplies molded articles having a suitable surface specific resistance. The above-mentioned molding material comprises 50% by weight or more of a polyphenylene ether resin, electroconductive carbon, an acid imide compound which can be used depending upon an intrinsic viscosity of the polyphenylene ether resin, a high-impact polystyrene resin and an A--B--A' type block copolymer elastomer.
    Type: Grant
    Filed: August 15, 1989
    Date of Patent: December 24, 1991
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Toru Ueki, Masaji Yoshimura, Kazuharu Kanezaki, Takashi Satoh, Ineo Iwata, Susumu Kishi
  • Patent number: 4869938
    Abstract: Disclosed herein is a polypropylene sheet obtained by forming a resin composition, which contains a polypropylene resin and a hydrogenated petroleum resin in specific amounts, into a sheet at a particular chill-roll temperature and then annealing the sheet at a specific temperature for a specific period of time as well as an improved production process of such a polypropylene sheet. Also disclosed is a polypropylene sheet comprising a sheet obtained from the above resin composition and a polypropylene layer of at least 10 .mu.m thick applied on at least one side of the sheet. A polypropylene resin composition suitable for the production of such polypropylene sheets is also disclosed. The above polypropylene sheets are suitable for use in press-through packages.
    Type: Grant
    Filed: August 22, 1986
    Date of Patent: September 26, 1989
    Assignee: Mitsui Toatsu Chemicals Inc.
    Inventors: Katsuyuki Usami, Toru Ueki, Hajime Sentoku, Takashi Takahashi, Kazuharu Kanezaki