Abstract: The present invention relates to an inhibitor against the stem cells of chronic myeloid leukemia (CML), a pharmaceutical composition for the treatment of CML having preventive effect on CML recurrence, a method of preventing CML recurrence, and a method of assessing the efficacy of treatment with a drug in a patient with CML, including a step of determining the expression level of latexin.

Abstract: A board for high frequency device includes a plurality of electrode terminals connected to an electronic component or another electronic circuit board by flowable conducting material such as solder, and grooves formed in an electrode terminal of the plurality of electrode terminals and capable of accumulating solder or the like. Specifically, a high frequency component is mounted on the front surface of the high frequency device board, and the plurality of electrode terminals are formed on the rear surface of the high frequency device board. A ground electrode terminal included in the plurality of electrode terminals is formed at the center of the rear surface of the high frequency device board and connected to a ground. The grooves for accumulating solder or the like are formed in the ground electrode terminal. This reduces the possibility of short-circuit between adjacent electrode terminals due to the flowable conducting material such as solder.

Abstract: A high frequency module used as a unit circuit making up a phased array antenna, in which the module may be reduced in size with reduction in cost. A high frequency module 10 includes a dielectric substrate 1 having both surfaces metallized. The dielectric substrate has a first metallized layer 2 and a second metallized layer 3 formed on both surfaces and has a low noise amplifier and the phase shifter IC 9 mounted on the metallized layer 2 on one surface. The high frequency module 10 also includes a low noise transistor 7 and a distributed constant circuit 12, formed on the one surface of the dielectric substrate 1 to form the low noise amplifier together, and an input terminal 5, an output terminal 6 and power supply terminals 15A to 15D formed by leading out the metallized layer 2 on the one surface to the opposite side surface of the dielectric substrate 1 in such a manner as to maintain insulation from the metallized layer 3 on the opposite side surface.

Abstract: A board for high frequency device includes a plurality of electrode terminals connected to an electronic component or another electronic circuit board by flowable conducting material such as solder, and grooves formed in an electrode terminal of the plurality of electrode terminals and capable of accumulating solder or the like. Specifically, a high frequency component is mounted on the front surface of the high frequency device board, and the plurality of electrode terminals are formed on the rear surface of the high frequency device board. A ground electrode terminal included in the plurality of electrode terminals is formed at the center of the rear surface of the high frequency device board and connected to a ground. The grooves for accumulating solder or the like are formed in the ground electrode terminal. This reduces the possibility of short-circuit between adjacent electrode terminals due to the flowable conducting material such as solder.

Abstract: A high frequency module used as a unit circuit making up a phased array antenna, in which the module may be reduced in size with reduction in cost. A high frequency module 10 includes a dielectric substrate 1 having both surfaces metallized. The dielectric substrate has a first metallized layer 2 and a second metallized layer 3 formed on both surfaces and has a low noise amplifier and the phase shifter IC 9 mounted on the metallized layer 2 on one surface. The high frequency module 10 also includes a low noise transistor 7 and a distributed constant circuit 12, formed on the one surface of the dielectric substrate 1 to form the low noise amplifier together, and an input terminal 5, an output terminal 6 and power supply terminals 15A to 15D formed by leading out the metallized layer 2 on the one surface to the opposite side surface of the dielectric substrate 1 in such a manner as to maintain insulation from the metallized layer 3 on the opposite side surface.