Patents by Inventor Kazuhiko Fukamachi
Kazuhiko Fukamachi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8070893Abstract: The invention provides Cu—Ni—Si—Co—Cr copper alloys for electronic materials having excellent characteristics such as dramatically improved strength and electrical conductivity. In one aspect, the invention is a Cu—Ni—Si—Co—Cr copper alloy for electronic materials, containing about 0.5-about 2.5% by weight of Ni, about 0.5 -about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and about 0.09 -about 0.5% by weight of Cr, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si in the alloy composition satisfies the formula: about 4?[Ni+Co]/Si?about 5, and the ratio of Ni to Co in the alloy composition satisfies the formula: about 0.5?Ni/Co?about 2, and wherein Pc is equal to or less than about 15/1000 ?m2, or Pc/P is equal to or less than about 0.Type: GrantFiled: March 31, 2006Date of Patent: December 6, 2011Assignee: JX Nippon Mining & Metals CorporationInventors: Naohiko Era, Kazuhiko Fukamachi, Hiroshi Kuwagaki
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Publication number: 20090035174Abstract: The invention provides Cu—Ni—Si alloys containing Co, and having excellent strength and conductivity. A copper alloy for electronic materials in accordance with the invention contains about 0.5-about 2.5% by weight of Ni, about 0.5-about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si ([Ni+Co]/Si ratio) satisfies the formula: about 4?[Ni+Co]/Si?about 5, and the ratio of Ni to Co (Ni/Co ratio) satisfies the formula: about 0.5?Ni/Co?about 2.Type: ApplicationFiled: March 23, 2006Publication date: February 5, 2009Applicant: Nippon Mining & Metals Co., Ltd.Inventors: Naohiko Era, Kazuhiko Fukamachi, Hiroshi Kuwagaki
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Publication number: 20090025840Abstract: The invention provides Cu—Ni—Si—Co—Cr copper alloys for electronic materials having excellent characteristics such as dramatically improved strength and electrical conductivity. In one aspect, the invention is a Cu—Ni—Si—Co—Cr copper alloy for electronic materials, containing about 0.5-about 2.5% by weight of Ni, about 0.5-about 2.5% by weight of Co, about 0.30-about 1.2% by weight of Si, and about 0.09-about 0.5% by weight of Cr, and the balance being Cu and unavoidable impurities, wherein the ratio of the total weight of Ni and Co to the weight of Si in the alloy composition satisfies the formula: about 4?[Ni+Co]/Si?about 5, and the ratio of Ni to Co in the alloy composition satisfies the formula: about 0.5?Ni/Co?about 2, and wherein Pc is equal to or less than about 15/1000 ?m2, or Pc/P is equal to or less than about 0.Type: ApplicationFiled: March 31, 2006Publication date: January 29, 2009Applicant: Nippon Mining & Metals Co., Ltd.Inventors: Naohiko Era, Kazuhiko Fukamachi, Hiroshi Kuwagaki
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Publication number: 20090022993Abstract: Copper alloys having excellent strength while suppressing irregularity of wavelengths, etc., of the fluctuations and having excellent bendability are obtained while suppressing growth of crystal grains. The copper-based alloy contains 2.0 to 4.0 mass % of Ti, and the total content of unavoidable impurity elements Pb, Sn, Zn, Mn, Fe, Co, Ni, S, Si, Al, P, As, Se, Te, Sb, Bi, Au, and Ag is not more than 0.1 mass %, and contents of each element thereof is not more than 0.01 mass %, and not less than 80% of quality of a second-phase particles having an area of not less than 0.01 ?m2 observed by a cross section speculum contains not less than 3% of the total amount of the above described unavoidable impurity elements in composition.Type: ApplicationFiled: February 25, 2008Publication date: January 22, 2009Applicant: NIPPON MINING & METALS CO., LTDInventors: Yasutaka Sugawara, Kazuhiko Fukamachi
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Publication number: 20080210353Abstract: The invention aims at providing high-strength copper alloy, especially phosphor bronze, with excellent bending workability. The excellently bendable high-strength copper alloy is obtained through grain size control whereby a finally cold rolled copper alloy with a tensile strength and 0.2% yield strength different by not more than 80 MPa is allowed to have characteristics such that its mean grain size (mGS) after annealing at 425° C. for 10,000 seconds is not more than 5 ?m and the standard deviation of the mean grain size (?GS) is not more than ?×mGS. Improvements in characteristics presumably attributable to the synergistic effect of grain-boundary strengthening and dislocation strengthening are stably achieved by the adjustments of cold rolling and annealing conditions and by the study of the correlation between pertinent characteristic values after the final rolling.Type: ApplicationFiled: April 11, 2008Publication date: September 4, 2008Applicant: Nippon Mining & Metals Co., Ltd.Inventors: Kazuhiko Fukamachi, Masato Shigyo
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Publication number: 20080175746Abstract: The present invention provides Corson alloy having remarkably improved properties, in particular, by bringing out the effect of added Cr more efficiently. A copper alloy for electronic materials comprising 2.5-4.5% by mass of Ni; 0.50-1.2% by mass of Si; 0.0030-0.2% by mass of Cr; balance Cu and inevitable impurities, wherein the weight ratio of Ni to Si is in the range of 3 to 7 and the content of carbon is 50 ppm by mass or less is provided.Type: ApplicationFiled: January 18, 2007Publication date: July 24, 2008Applicant: Nippon Mining & Metals Co., Ltd.Inventors: Naohiko Era, Kazuhiko Fukamachi, Hiroshi Kuwagaki
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Publication number: 20080121320Abstract: Superior bendability in a copper alloy and further strength improvement ensures characteristics which are sufficiently superior in view of essential qualities of strength of titanium-copper. 2.0 to 4.0 mass % of Ti, 0.01 to 0.50 mass % of one or more than one kind of element from among Fe, Co, Ni, Cr, V, Zr, B, and P as the third element group are contained, and not less than 50% of the total content of these elements is made to exist as second-phase particles.Type: ApplicationFiled: January 29, 2008Publication date: May 29, 2008Applicant: NIPPON MINING & METALS COMPANY, LIMITEDInventors: Yasutaka Sugawara, Kazuhiko Fukamachi
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Publication number: 20060204396Abstract: A copper material alloy comprising 2.0 to 4.0 weight % of Ti and 0.05 to 0.50 weight % of Fe wherein; inevitable impurities have an amount of 0.01 weight % or less in total; and the ratio of X ray diffraction intensity of the alloy satisfies I(311)/I(111)?0.5. The copper alloy of the present invention has improved punchability and excellent bendability.Type: ApplicationFiled: March 9, 2006Publication date: September 14, 2006Inventors: Yasutaka Sugawara, Kazuhiko Fukamachi
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Patent number: 6881281Abstract: The present invention provides a Cu—Cr—Zr alloy material excellent in fatigue and intermediate temperature characteristics, which comprises 0.05 to 1.0% by mass of Cr and 0.05 to 0.25% by mass of Zr with a balance of Cu and inevitable impurities. The alloy comprises inclusion particles based on any one of Zr and a Cu—Zr alloy having a diameter of 0.1 ?m or more, and the proportion of the inclusion particles containing 10% or more of sulfur as one of the inevitable impurities is one particle/mm2.Type: GrantFiled: January 20, 2004Date of Patent: April 19, 2005Assignee: Nikko Metal Manufacturing Co., Ltd.Inventors: Kazuki Kanmuri, Kazuhiko Fukamachi
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Publication number: 20040219054Abstract: Copper alloys having excellent strength while suppressing irregularity of wavelengths, etc., of the fluctuations and having excellent bendability are obtained while suppressing growth of crystal grains. The copper-based alloy contains 2.0 to 4.0 mass % of Ti, and the total content of unavoidable impurity elements Pb, Sn, Zn, Mn, Fe, Co, Ni, S, Si, Al, P, As, Se, Te, Sb, Bi, Au, and Ag is not more than 0.1 mass %, and contents of each element thereof is not more than 0.01 mass %, and not less than 80% of quality of a second-phase particles having an area of not less than 0.01 &mgr;m2 observed by a cross section speculum contains not less than 3% of the total amount of the above described unavoidable impurity elements in composition.Type: ApplicationFiled: November 28, 2003Publication date: November 4, 2004Applicant: NIKKO METAL MANUFACTURING CO., LTD.Inventors: Yasutaka Sugawara, Kazuhiko Fukamachi
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Publication number: 20040208778Abstract: The present invention provides a Cu—Cr—Zr alloy material excellent in fatigue and intermediate temperature characteristics, which comprises 0.05 to 1.0% by mass of Cr and 0.05 to 0.25% by mass of Zr with a balance of Cu and inevitable impurities. The alloy comprises inclusion particles based on any one of Zr and a Cu—Zr alloy having a diameter of 0.1 &mgr;m or more, and the proportion of the inclusion particles containing 10% or more of sulfur as one of the inevitable impurities is one particle/mm2.Type: ApplicationFiled: January 20, 2004Publication date: October 21, 2004Inventors: Kazuki Kanmuri, Kazuhiko Fukamachi
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Publication number: 20040136861Abstract: Superior bendability in a copper alloy and further strength improvement ensures characteristics which are sufficiently superior in view of essential qualities of strength of titanium-copper. 2.0 to 4.0 mass % of Ti, 0.01 to 0.50 mass % of one or more than one kind of element from among Fe, Co, Ni, Cr, V, Zr, B, and P as the third element group are contained, and not less than 50% of the total content of these elements is made to exist as second-phase particles.Type: ApplicationFiled: November 28, 2003Publication date: July 15, 2004Applicant: NIKKO METAL MANUFACTURING CO., LTD.Inventors: Yasutaka Sugawara, Kazuhiko Fukamachi
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Publication number: 20040007294Abstract: A phosphor bronze strip having excellent bending workability and high mechanical strength for use in electronic parts such as terminal connectors wherein;Type: ApplicationFiled: March 28, 2003Publication date: January 15, 2004Inventors: Kazuhiko Fukamachi, Toshihiro Niimi
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Publication number: 20030211357Abstract: A copper alloy material for connectors for reducing wear of a press die, the material comprising: 25 to 40 mass % of Zn and the balance of Cu and inevitable impurities; the material having an arithmetic mean surface roughness (Ra) along a direction perpendicular to a rolling direction for the material of 0.07 to 0.13 &mgr;m; maximum height (Ry) of not more than 1.3 &mgr;m; a surface oxide film having a thickness in a range of from 3 to 80 nm; and not less than 10 atom % of oxide of alloy elements, except for Cu, contained in the oxide film.Type: ApplicationFiled: March 27, 2003Publication date: November 13, 2003Applicant: NIPPON MINING & METALS CO., LTD.Inventors: Koji Harada, Kazuhiko Fukamachi
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Publication number: 20030188809Abstract: The present invention relates to a high-strength copper alloy used for electronic parts such as terminals and connectors, and more particularly, to a high-strength phosphor bronze strip. The present invention provides a phosphor bronze strip with excellent punching formability characterized in that a total content of S (20 to 100 ppm), Mn, Ca, Mg and Al is 50 ppm or less, a phosphor bronze strip with excellent punching formability characterized in that the sum total of lengths of etching imprints is 5 mm/mm2 or more when a cross-section parallel to the rolling direction is etched, a phosphor bronze strip with excellent punching formability characterized in that a copper sulfide phase exists in a range of 1 to 3% of the microstructure whose cross-section is parallel to the rolling direction and a phosphor bronze strip characterized in that the plastic deformation ratio when subjected to a shearing test with clearance of 4 to 10% is 50% or less.Type: ApplicationFiled: March 27, 2003Publication date: October 9, 2003Inventors: Kazuhiko Fukamachi, Toshihiro Niimi
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Publication number: 20030188814Abstract: The invention aims at providing high-strength copper alloy, especially phosphor bronze, with excellent bending workability. The excellently bendable high-strength copper alloy is obtained through grain size control whereby a finally cold rolled copper alloy with a tensile strength and 0.2% yield strength different by not more than 80 MPa is allowed to have characteristics such that its mean grain size (mGS) after annealing at 425° C. for 10,000 seconds is not more than 5 &mgr;m and the standard deviation of the mean grain size (&sgr;GS) is not more than ⅓XmGS. Improvements in characteristics presumably attributable to the synergistic effect of grain-boundary strengthening and dislocation strengthening are stably achieved by the adjustments of cold rolling and annealing conditions and by the study of the correlation between pertinent characteristic values after the final rolling.Type: ApplicationFiled: March 10, 2003Publication date: October 9, 2003Inventors: Kazuhiko Fukamachi, Masato Shigyo
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Patent number: 6613451Abstract: Ni alloy or Cu alloy containing P and/or B is plated on a base metal consisting of Cu or Cu alloy as an intermediate layer, Sn or Sn alloy is further plated on the content of P or B in the plating layer is limited by carrying out reflow treatment, whereby, heat resistance and insertion and withdrawal properties are improved.Type: GrantFiled: April 12, 2001Date of Patent: September 2, 2003Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Hajime Asahara, Kazuhiko Fukamachi
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Patent number: 6403234Abstract: A plated material for connectors, having superior insertion and withdrawal properties, comprises an intermediate layer consisting of Ni alloy plating having a Vickers hardness of 450 to 750 Hv and a thickness of 0.3 to 2 &mgr;m provided on a base metal consisting of Cu or Cu alloy, a reflowed Sn or Sn alloy plated surface layer provided thereon, and an alloy layer consisting primarily of Sn—Ni and having a thickness of 0.05 to 2 &mgr;m formed by diffusion between the intermediate layer and the surface layer, in which average grain size of said Sn—Ni compound is 0.05 to 1 &mgr;m.Type: GrantFiled: June 14, 2000Date of Patent: June 11, 2002Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Atsushi Kodama, Kazuhiko Fukamachi
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Patent number: 6024809Abstract: Fe--Ni alloy with improved etch factors for electronic parts are provided which are characterized by the composition consisting of, all by weight, 30-55% Ni, 0.8% or less Mn, 0.0030-0.0100% N, or 0.02% less Al, and the balance Fe and unavoidable impurities, preferably with 0.01% or less C, 0.003% or less Si, 0.005%, or less S, 0.005% or less P, and 0.0100% or less O. There is provided Fe--Ni alloy materials for electronic parts which have high etch factors and produce favorably etched surfaces without blister generation, by restricting the N and Al contents within specified ranges and preferably limiting C, Si, P, S, and O contents below specified levels.Type: GrantFiled: November 17, 1997Date of Patent: February 15, 2000Assignee: Nippon Mining & Metals Co., Ltd.Inventors: Toshiyuki Ono, Kazuhiko Fukamachi
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Patent number: 5161972Abstract: In a method and device for fixing a denture to the root cap, which is embedded in the tooth root, non-plated platinum magnet containing from 33-47% of Pt is attached to the inner or lower surface of the denture so as to generate the magnetic retention between the magnet and the root cap.Type: GrantFiled: August 31, 1990Date of Patent: November 10, 1992Assignee: Nippon Mining Co., Ltd.Inventors: Yasuhiro Matsui, Kazuhiko Fukamachi