Abstract: A high-accuracy current detecting resistor is provided whose resistance does not change greatly according to temperature change and which has an excellent dielectric strength. In a resistor in which an electrical resistance alloy plate and a radiating metallic plate are laminated via a resin insulating layer, the electrical resistance alloy plate is formed of an alloy containing nickel and copper and is adhered to the resin insulating layer by etching a grain boundary of the alloy in the form of a concave.

Abstract: A high-accuracy current detecting resistor is provided whose resistance does not change greatly according to temperature change and which has an excellent dielectric strength. In a resistor in which an electrical resistance alloy plate and a radiating metallic plate are laminated via a resin insulating layer, the electrical resistance alloy plate is formed of an alloy containing nickel and copper and is adhered to the resin insulating layer by etching a grain boundary of the alloy in the form of a concave.

Abstract: A process for producing a soybean milk and soybean milk pack includes cooking ground soybeans with the use of superheated steam containing no or little oxygen, thus extracting soybean proteins to give a cooked bean juice of the soybeans; separating a solid soybean curd lees in the oxygen-free state without cooling the bean juice to give a soybean milk containing no or little dissolved oxygen and having soybean proteins suspended therein. The process also includes filling the thus produced soybean milk into pack containers in an oxygen-free environment with no or little dissolved oxygen without heating or cooling the soybean milk, sealing the containers, and then storing at 1 to 10° C.

Abstract: In a semiconductor device having a laminated metal layer in which a metal layer whose main component is aluminum and a metal layer whose main component is nickel are laminated on each other, the ratio (tAl/tNi) of the thickness (tAl) of the metal layer whose main component is aluminum to that (tNi) of the metal layer whose main component is nickel is controlled to 5 or larger, so that part of the metal layer whose main component is aluminum remains even if an Al—Ni intermetallic compound is formed.

Abstract: The caldron of the invention comprises a cylindrical caldron main body having a raw material charge port for charging a water-added raw material to be boiled and a discharge port for discharging a boiled raw material, both ports being disposed near to both the closed ends of the caldron main body and at least one steam injection pipe installed in the caldron main body and having a plurality of injection ports for injecting steam and preferably oxygen-free streams for boiling the raw material, wherein the injecting direction of the steam injected from the injection ports is inclined so that the steam is supplied in the circumferential direction of the caldron main body.

Abstract: A metallic printed board is formed by laminating an insulation layer on the surface of a metallic sheet as a base, and then electronic parts are mounted on the conductor pattern formed on the surface of the insulation layer. A double-sided printed board mounted thereon electronic parts is placed in parallel. Both the printed boards are supported and fixed monolithically by filling the space between the printed boards with an insulation resin and curing the resin. Furthermore, an insulation resin is laminated on the surface of the printed board in such a manner that the resin may cover the mounted electronic parts, and cured. The heat generated from the electronic parts can be efficiently transmitted to the insulation resins by using a resin having a high thermal conductivity for both of the insulation resins, and the heat is then emitted from the surfaces of the metallic sheet or the insulation resin.

Abstract: A metallic printed board is formed by laminating an insulation layer on the surface of a metallic sheet as a base, and then electronic parts are mounted on the conductor pattern formed on the surface of the insulation layer. A double-sided printed board mounted thereon electronic parts is placed in parallel. Both the printed boards are supported and fixed monolithically by filling the space between the printed boards with an insulation resin and curing the resin. Furthermore, an insulation resin is laminated on the surface of the printed board in such a manner that the resin may cover the mounted electronic parts, and cured. The heat generated from the electronic parts can be efficiently transmitted to the insulation resins by using a resin having a high thermal conductivity for both of the insulation resins, and the heat is then emitted from the surfaces of the metallic sheet or the insulation resin.

Abstract: A metallic printed board having layers including a metallic plate, an electric insulating layer and a metallic film, includes a plurality of insulating regions in the electric insulating layer. The insulating regions have different dielectric or thermal properties and are formed of a number of kinds of electric insulating materials having the different dielectric or thermal properties respectively. The insulating regions are arranged on an identical plane surface of the metallic plate.