Patents by Inventor Kazuhiko Kurematsu

Kazuhiko Kurematsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin composition
    Patent number: 4829134
    Abstract: An epoxy resin composition containing an oxazoline compound in an epoxy resin.
    Type: Grant
    Filed: August 11, 1987
    Date of Patent: May 9, 1989
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Tsuguo Sakamoto, Kazuhiko Kurematsu, Yukihiro Mikogami, Shuichi Suzuki, Cao M. Thai
  • Epoxy resin composition for cast molding
    Patent number: 4617330
    Abstract: An epoxy resin composition for cast molding which comprises:(A) an epoxy resin;(B) a curing agent;(C) cut fibers having distributions of 3 to 20 .mu.m in diameter and 3 to 1500 .mu.m in length;(D) inorganic powder having a size distribution of particles with 90% by weight or more of particles with particle sizes of 10 .mu.m or less and 50% by weight or more of particles with particle sizes of 5 .mu.m or less,the total amount of the components (C) and (D) formulated being 40 to 225 parts by volume per 100 parts by volume of the total amount of the components (A) and (B) formulated displays excellent crack resistance, strength as well as a low shrinkage characteristic and, good fluidity.
    Type: Grant
    Filed: March 28, 1985
    Date of Patent: October 14, 1986
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Cao M. Thai, Takayuki Oguni, Kazuhiko Kurematsu, Tsuguo Kato