Abstract: A method for manufacturing a module including a predetermined number of multilayered memories includes a multilayered wafer formation step of forming a multilayered wafer by bumpless stacking of a plurality of memory wafers; a singulating step of singulating the multilayered wafer into multilayered memories; a rearranging step of rearranging the plurality of multilayered memories in a predetermined shape; a molding step of molding the rearranged multilayered memories; a wiring formation step of forming external wiring in the multilayered memories; and a separation step of separating into a memory module including a predetermined number of molded multilayered memories.

Abstract: According to a certain embodiment, the test system includes a first test board, a test executable integrated circuit, and a first measuring apparatus. A device under test (DUT) is mounted on the first test board. The test executable integrated circuit is mounted on the first test board, and is configured to read firmware stored in the DUT in advance and to test the DUT. The first measuring apparatus instructs the test executable integrated circuit to start a test of the DUT. There are provided the test system, the test method, and the non-transitory computer readable medium, capable of reducing costs required for tests and also of shortening test time.

Abstract: There are provided a naphthol resin and an epoxy resin that impart characteristics such as high heat resistance, a low dielectric loss tangent, and a low coefficient of thermal expansion (CTE), and an epoxy resin composition including the naphthol resin or the epoxy resin as an essential component, and cured products thereof. A naphthol resin which is represented by the following formula: where R1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n represents the number of repetitions and is a number of 2 to 10, and in which, in terms of area ratio in GPC measurement, a ratio of components for which n=6 or more is 15% or more, and a ratio of components for which n=1 in GPC is 30% or less, and a hydroxy group equivalent is 260 to 400 g/eq.

Abstract: Provided is a soil conditioner that comprises, as an active ingredient, a compound represented by general formula (1), a salt thereof or a solvate of the same. In general formula (1), R1 to R6 independently represent an optionally substituted hydrocarbon group having 1-5 carbon atoms, an optionally substituted alkoxy group having 1-5 carbon atoms, an amino group, a hydroxy group, a halogen atom or a hydrogen atom.

Abstract: There are provided a naphthol resin and an epoxy resin that impart characteristics such as high heat resistance, a low dielectric loss tangent, and a low coefficient of thermal expansion (CTE), and an epoxy resin composition including the naphthol resin or the epoxy resin as an essential component, and cured products thereof. A naphthol resin which is represented by the following formula: where R1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, and n represents the number of repetitions and is a number of 2 to 10, and in which, in terms of area ratio in GPC measurement, a ratio of components for which n=6 or more is 15% or more, and a ratio of components for which n=1 in GPC is 30% or less, and a hydroxy group equivalent is 260 to 400 g/eq.

Abstract: A MIM capacitor is included in any one or more of a first matching circuit and a second matching circuit. The mat capacitor performs impedance matching of a fundamental wave included in a high-frequency signal with a transmission line, and forms a short-circuit point for a harmonic included in the high-frequency signal at a connection point with the transmission line.

Abstract: A MIM capacitor is included in any one or more of a first matching circuit and a second matching circuit. The mat capacitor performs impedance matching of a fundamental wave included in a high-frequency signal with a transmission line, and forms a short-circuit point for a harmonic included in the high-frequency signal at a connection point with the transmission line.

Abstract: A high-frequency switch includes: a first transistor connected to an input terminal and a first output terminal; a second transistor connected to the first output terminal; a third transistor connected to the second transistor and grounded; a resistor connected to a connection between the second and third transistors and grounded; a switching circuit switchable between a state in which the switching circuit allows passage of a transmitted/received signal between the input terminal and a second output terminal and a state in which the switching circuit cuts off the transmitted/received signal; and a control unit to control the first, second, and third transistors and the switching circuit. At the time of reception, the control unit brings the switching circuit into the state in which the switching circuit cuts off the transmitted/received signal, places the first and third transistors in an on-state, and places the second transistor in an off-state.

Abstract: A high-frequency switch includes: a first transistor connected to an input terminal and a first output terminal; a second transistor connected to the first output terminal; a third transistor connected to the second transistor and grounded; a resistor connected to a connection between the second and third transistors and grounded; a switching circuit switchable between a state in which the switching circuit allows passage of a transmitted/received signal between the input terminal and a second output terminal and a state in which the switching circuit cuts off the transmitted/received signal; and a control unit to control the first, second, and third transistors and the switching circuit. At the time of reception, the control unit brings the switching circuit into the state in which the switching circuit cuts off the transmitted/received signal, places the first and third transistors in an on-state, and places the second transistor in an off-state.

Abstract: To provide a terminal management apparatus capable of improving convenience in a state that power consumption is suppressed. A communication section 501 receives reporting information notifying the presence of a notification utilizing a first communication function directed to a terminal 510. When the communication section 501 has received the reporting information, a control section 502 transmits a message indicating the presence of the notification, to the terminal 510 by using a second communication function different from the first communication function.

Abstract: To provide a terminal management apparatus capable of improving convenience in a state that power consumption is suppressed. A communication section 501 receives reporting information notifying the presence of a notification utilizing a first communication function directed to a terminal 510. When the communication section 501 has received the reporting information, a control section 502 transmits a message indicating the presence of the notification, to the terminal 510 by using a second communication function different from the first communication function.

Abstract: Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320° C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O—CH2—CH(OH)—CH2—O—B—, wherein A and B are divalent aromatic groups.

Abstract: Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250° C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.

Abstract: A nitrification inhibitor and a soil improver and a fertilizer containing the same are offered which can be utilized in a wide area from a tropical to a temperate zone, and can be easily obtained from natural origin materials. It is a nitrification inhibitor to inhibit soil nitrification, containing as a main component either one of linoleic acid, ?-linolenic acid, ?-linolenic acid, and methyl linoleate, or their mixture of two or more. By incorporating this nitrification inhibitor into a soil improver or a fertilizer, nitrification of soil can be effectively inhibited.

Abstract: Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250° C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.

Abstract: Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320° C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O—CH2—CH(OH)—CH2—O—B—, wherein A and B are divalent aromatic groups.

Abstract: Disclosed is an epoxy resin composition that cures with high thermal conductivity and low thermal expansion and is capable of dissipating heat efficiently and displaying good dimensional stability when applied to encapsulation of semiconductor devices or to printed wiring boards. The epoxy resin composition is formulated from epoxy resins 50 wt % or more of which is a diphenyl ether type epoxy resin represented by the following general formula (1) (wherein n is a number of ?0 and m is an integer of 1-3) and curing agents 20 wt % or more of which is a diphenyl ether type phenolic resin represented by the following general formula (2) (wherein n is a number of ?0 and m is an integer of 1-3).

Abstract: A nitrification inhibitor and a soil improver and a fertilizer containing the same are offered which can be utilized in a wide area from a tropical to a temperate zone, and can be easily obtained from natural origin materials. It is a nitrification inhibitor to inhibit soil nitrification, containing juglone as a main component. By incorporating this nitrification inhibitor into a soil improver or a fertilizer, nitrification of soil can be effectively inhibited. The nitrification inhibitor is preferably contained in a soil improver or a fertilizer in the range of 20 to 50% weight %.

Abstract: According to the present invention, mounting conditions are determined to become closer to a setting value of a parameter regarding electricity consumption. The present invention provides a method of determining mounting conditions under which a piece of equipment mounts a component onto a substrate. The method includes: obtaining a setting value of a parameter regarding electricity consumption required to mount the component; obtaining an actual value of the parameter based on current mounting conditions; and determining new mounting conditions based on a result of comparing the setting value with the actual value.

Abstract: A nitrification inhibitor and a soil improver and a fertilizer containing the same are offered which can be utilized in a wide area from a tropical to a temperate zone, and can be easily obtained from natural origin materials. It is a nitrification inhibitor to inhibit soil nitrification, containing as a main component either one of linoleic acid, ?-linolenic acid, ?-linolenic acid, and methyl linoleate, or their mixture of two or more. By incorporating this nitrification inhibitor into a soil improver or a fertilizer, nitrification of soil can be effectively inhibited.