Abstract: A reducing agent supply device for supplying a reducing agent to a portion of a passage for a flue gas upstream of a SCR catalyst includes at least one header pipe extending in the passage and configured to allow the reducing agent to pass through; a plurality of injection nozzles disposed on the header pipe at intervals along an extension direction of the header pipe and configured to inject the reducing agent into the passage; a heat shield plate disposed on an upstream side of the header pipe with respect to a flow direction of the flue gas and having a longitudinal direction along the extension direction of the header pipe; and at least one fixing part contacting each of the heat shield plate and the header pipe and fixing the heat shield plate to the header pipe.

Abstract: A reducing agent supply device for supplying a reducing agent to a portion of a passage for a flue gas upstream of a SCR catalyst includes at least one header pipe extending in the passage and configured to allow the reducing agent to pass through; a plurality of injection nozzles disposed on the header pipe at intervals along an extension direction of the header pipe and configured to inject the reducing agent into the passage; a heat shield plate disposed on an upstream side of the header pipe with respect to a flow direction of the flue gas and having a longitudinal direction along the extension direction of the header pipe; and at least one fixing part contacting each of the heat shield plate and the header pipe and fixing the heat shield plate to the header pipe.

Abstract: A semiconductor device which is sealed with a plastic sealing layer and whose thickness is regulated to be below a given value is known. Since the thickness of the device is small, and the thickness of the upper portion of the plastic sealing layer and the thickness of the lower portion thereof are different from each other, the plastic sealing layer becomes warped, thus causing a crack on the side of the semiconductor chip. To solve this problem, the semiconductor device according to the present invention comprises a semiconductor chip on which a plurality of grooves are defined. Consequently, the thickness of the lower portion of the plastic layer becomes greater, thereby preventing cracks from occurring on the semiconductor chip.

Abstract: A semiconductor device which is sealed with a plastic sealing layer and whose thickness is regulated to be below a given value is known. Since the thickness of the device is small, and the thickness of the upper portion of the plastic sealing layer and the thickness of the lower portion thereof are different from each other, the plastic sealing layer becomes warped, thus causing a crack on the side of the semiconductor chip.

Abstract: A semiconductor. device comprises a semiconductor chip on which a plurality of grooves are defined, thus acting as a resisting member, the effect of which is to prevent the semiconductor chip from bending. Consequently, the thickness of the lower portion of the plastic layer becomes greater, thereby preventing cracks from occurring on the semiconductor chip.

Abstract: In a semiconductor device 1 according to the present invention, a plurality of inner leads are bonded to a front surface of a semiconductor element 11 covered by a package 10, with bent portions 17 formed at some inner leads 13a among the plurality of inner leads 13 and the front ends of the bent portions 17 exposed at a front surface of the package 10. This structure ensures that the semiconductor element is not caused to move vertically inside the forming die by the pressure of the liquid resin or the like during the sealing process.

Abstract: Leads 106 provided at an electronic part connectors 110 of an electronic part 100, which are electrically connected to a surface of a substrate 120 are structured in such a manner that they are directly connected to a substrate connector formed at the surface of the substrate 120 through a pressing force or a bonding force applied to the electronic part 100. This lead structure makes it possible to preclude the use of connectors including additional members such as contact pins, to achieve a reduction in the length of the communicating path of the electrical signals, and in addition, since electrical connection is achieved at one location, i.e., between the leads 106 and the substrate connector at the substrate 120, the contact resistance is minimized.