Patents by Inventor Kazuhiro Higashimaru

Kazuhiro Higashimaru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8454863
    Abstract: A transfer layer on a surface of a mold has a thickness distribution along the radius direction that the layer is thick in an inner round portion but is gradually thinner toward an outer round portion. An adhesive layer is formed between a surface of a signal substrate which bears a signal recording film and the mold which seats the transfer layer. The adhesive layer has a thickness distribution that the layer is thin in an inner round portion but is gradually thicker toward an outer round portion. Since the thickness distributions along the radius direction of the transfer layer and the adhesive layer are opposite to each other, the thickness distribution of an isolation layer which comprises the two layers is uniform.
    Type: Grant
    Filed: November 4, 2008
    Date of Patent: June 4, 2013
    Assignee: Panasonic Corporation
    Inventors: Kazuhiro Hayashi, Kazuya Hisada, Kazuhiro Higashimaru, Eiji Ohno
  • Patent number: 7820234
    Abstract: A method of manufacturing an optical information recording medium to/from which signals can optically be recorded and reproduced. The recording medium includes a signal substrate (100), a signal recording layer (110), and a transparent cover layer (125) having a first transparent layer (115) and a second transparent layer (120), which is harder than the first transparent layer (115). Signals can be recorded and reproduced to and from the recording medium by a light transmitted to the signal recording layer through the transparent cover layer (125). The first transparent layer is formed so as to have a first predetermined distribution of thickness. The second transparent layer is formed so as to have a second predetermined distribution of thickness to make the total thickness of the transparent cover layer (125) uniform. The first transparent layer (115) may be made of a plurality of thin laminated transparent layers.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: October 26, 2010
    Assignee: Panasonic Corporation
    Inventors: Kazuhiro Hayashi, Kazuya Hisada, Shinya Abe, Kazuhiro Higashimaru, Eiji Ohno
  • Publication number: 20090065131
    Abstract: A transfer layer on a surface of a mold has a thickness distribution along the radius direction that the layer is thick in an inner round portion but is gradually thinner toward an outer round portion. An adhesive layer is formed between a surface of a signal substrate which bears a signal recording film and the mold which seats the transfer layer. The adhesive layer has a thickness distribution that the layer is thin in an inner round portion but is gradually thicker toward an outer round portion. Since the thickness distributions along the radius direction of the transfer layer and the adhesive layer are opposite to each other, the thickness distribution of an isolation layer which comprises the two layers is uniform.
    Type: Application
    Filed: November 4, 2008
    Publication date: March 12, 2009
    Applicant: Panasonic Corporation
    Inventors: Kazuhiro HAYASHI, Kazuya HISADA, Kazuhiro HIGASHIMARU, Eiji OHNO
  • Patent number: 7460463
    Abstract: A transfer layer on a surface of a mold has a thickness distribution along the radius direction that the layer is thick in an inner round portion but is gradually thinner toward an outer round portion. An adhesive layer is formed between a surface of a signal substrate which bears a signal recording film and the mold which seats the transfer layer. The adhesive layer has a thickness distribution that the layer is thin in an inner round portion but is gradually thicker toward an outer round portion. Since the thickness distributions along the radius direction of the transfer layer and the adhesive layer are opposite to each other, the thickness distribution of an isolation layer which comprises the two layers is uniform.
    Type: Grant
    Filed: May 7, 2003
    Date of Patent: December 2, 2008
    Assignee: Panasonic Corporation
    Inventors: Kazuhiro Hayashi, Kazuya Hisada, Kazuhiro Higashimaru, Eiji Ohno
  • Patent number: 7396562
    Abstract: A method of manufacturing an optical information recording medium that has a substrate having a signal recording layer formed on one principal surface thereof; and an optically transparent layer formed on the signal recording layer and made from a radiation cure type resin. According to the method, when the optically transparent layer is formed, the radiation cure type resin is supplied onto the substrate, and the radiation cure type resin is applied over the substrate by spinning the substrate at a predetermined number of application revolutions in a spin coating method. The number of revolutions of the substrate is increased after the application of the resin, and radiation is irradiated to cure the radiation cure type resin while the number of revolutions of the substrate is increased.
    Type: Grant
    Filed: June 6, 2002
    Date of Patent: July 8, 2008
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kazuya Hisada, Eiji Ohno, Kazuhiro Higashimaru, Kazuhiro Hayashi
  • Publication number: 20040252626
    Abstract: A method of manufacturing an optical information recording medium that has a substrate having a signal recording layer formed on one principal surface thereof; and an optically transparent layer formed on the signal recording layer and made from a radiation cure type resin. According to the method, when the optically transparent layer is formed, the radiation cure type resin is supplied onto the substrate, and the radiation cure type resin is applied over the substrate by spinning the substrate at a predetermined number of application revolutions in a spin coating method. The number of revolutions of the substrate is increased after the application of the resin, and radiation is irradiated to cure the radiation cure type resin while the number of revolutions of the substrate is increased.
    Type: Application
    Filed: July 27, 2004
    Publication date: December 16, 2004
    Inventors: Kazuya Hisada, Eiji Ohno, Kazuhiro Higashimaru, Kazuhiro Hayashi
  • Publication number: 20040232570
    Abstract: A method of manufacturing an optical information recording medium to/from which signals can optically be recorded and reproduced. The recording medium includes a signal substrate (100), a signal recording layer (110), and a transparent cover layer (125) having a first transparent layer (115) and a second transparent layer (120) harder than the first transparent layer (115), signals being recorded and reproduced to and from the recording medium by a light transmitted to the signal recording layer through the transparent cover layer (125). The first transparent layer is formed so as to have a first predetermined distribution of thickness. The second transparent layer is formed so as to have a second predetermined distribution of thickness to make the total thickness of the transparent cover layer (125) uniform. The first transparent layer (115) may be made of a plurality of thin laminated transparent layers.
    Type: Application
    Filed: May 10, 2004
    Publication date: November 25, 2004
    Inventors: Kazuhiro Hayashi, Kazuya Hisada, Shinya Abe, Kazuhiro Higashimaru, Eiji Ohno
  • Publication number: 20030231578
    Abstract: A transfer layer on a surface of a mold has a thickness distribution along the radius direction that the layer is thick in an inner round portion but is gradually thinner toward an outer round portion. An adhesive layer is formed between a surface of a signal substrate which bears a signal recording film and the mold which seats the transfer layer. The adhesive layer has a thickness distribution that the layer is thin in an inner round portion but is gradually thicker toward an outer round portion. Since the thickness distributions along the radius direction of the transfer layer and the adhesive layer are opposite to each other, the thickness distribution of an isolation layer which comprises the two layers is uniform.
    Type: Application
    Filed: May 7, 2003
    Publication date: December 18, 2003
    Inventors: Kazuhiro Hayashi, Kazuya Hisada, Kazuhiro Higashimaru, Eiji Ohno