Abstract: A battery module 8 containing parallel blocks 9 connected to a protection circuit via a lead plate 2, wherein the parallel blocks 9 are welded to both sides of the lead plate without bending the lead plate 2 into a U shape. Thus it is possible to reduce the length of the lead plate 2 and suppress a voltage drop on the lead plate 2. Further, since the lead plate 2 is not bent into a U shape, the assembling accuracy of the battery module is improved and the battery module is easily packaged with a small size.

Abstract: A battery module 8 containing parallel blocks 9 connected to a protection circuit via a lead plate 2, wherein the parallel blocks 9 are welded to both sides of the lead plate without bending the lead plate 2 into a U shape. Thus it is possible to reduce the length of the lead plate 2 and suppress a voltage drop on the lead plate 2. Further, since the lead plate 2 is not bent into a U shape, the assembling accuracy of the battery module is improved and the battery module is easily packaged with a small size.

Abstract: A storage medium with built-in antenna includes circuit board on which semiconductor element is placed, first and second magnetic layers sandwiching semiconductor element and circuit board, and first and second antenna coils disposed on first and second magnetic layers. First and second antenna coils are connected in parallel on a flexible sheet. First and second antenna coils are folded at the sides of first and second magnetic layers, respectively, and electrically connected to semiconductor element.

Abstract: A storage medium with built-in antenna includes circuit board on which semiconductor element is placed, first and second magnetic layers sandwiching semiconductor element and circuit board, and first and second antenna coils disposed on first and second magnetic layers. First and second antenna coils are connected in parallel on a flexible sheet. First and second antenna coils are folded at the sides of first and second magnetic layers, respectively, and electrically connected to semiconductor element.

Abstract: All images of a plurality of sucked and held electronic components are picked up, sucked and held states of the electronic components are successively recognized by their respective images in an order of placing the electronic components onto a circuit board, and the electronic components for which such recognition processing is completed can be successively placed onto the circuit board in this order during a process of the recognition processing.

Abstract: A semiconductor memory module formed of a mounted module (12) having a semiconductor memory device (16) and a control semiconductor device (18), a circuit board (14) which contains connection terminal (20) coupled with the control semiconductor device (18) and disposed so that it is exposed from the surface of outer case (42), and an antenna connection terminal electrode (22) disposed in the inside of outer case (42); and an antenna module (24) having a sheet board (26) which includes an antenna (28) disposed on one of the surfaces in the neighborhood of the edge along the sides, a layer (30) of magnetic substance disposed on the other surface, and an antenna terminal electrode (38) disposed on the one or the other surface. The antenna module (24) is overlaid on the mounted module (12), and the antenna connection terminal electrode (22) is connected with the antenna terminal electrode (38).

Abstract: A semiconductor memory module formed of a mounted module (12) having a semiconductor memory device (16) and a control semiconductor device (18), a circuit board (14) which contains connection terminal (20) coupled with the control semiconductor device (18) and disposed so that it is exposed from the surface of outer case (42), and an antenna connection terminal electrode (22) disposed in the inside of outer case (42); and an antenna module (24) having a sheet board (26) which includes an antenna (28) disposed on one of the surfaces in the neighborhood of the edge along the sides, a layer (30) of magnetic substance disposed on the other surface, and an antenna terminal electrode (38) disposed on the one or the other surface. The antenna module (24) is overlaid on the mounted module (12), and the antenna connection terminal electrode (22) is connected with the antenna terminal electrode (38).

Abstract: All images of a plurality of sucked and held electronic components are picked up, sucked and held states of the electronic components are successively recognized by their respective images in an order of placing the electronic components onto a circuit board, and the electronic components for which such recognition processing is completed can be successively placed onto the circuit board in this order during a process of the recognition processing.

Abstract: An image pickup camera is arranged, so that a plurality of components are adapted to be sequentially imaged by corresponding image pickup device with a timing whereby light for imaging is prevented from affecting the other image pickup operation while the components are let to pass above the image pickup camera. The hold posture of each of the plurality of components can be imaged separately without decreasing the cycle time.

Abstract: All images of a plurality of sucked and held electronic components are picked up, sucked and held states of the electronic components are successively recognized by their respective images in an order of placing the electronic components onto a circuit board, and the electronic components for which such recognition processing is completed can be successively placed onto the circuit board in this order during a process of the recognition processing.

Abstract: An image pickup camera is arranged, so that a plurality of components are adapted to be sequentially imaged by corresponding image pickup device with a timing whereby light for imaging is prevented from affecting the other image pickup operation while the components are let to pass above the image pickup camera. The hold posture of each of the plurality of components can be imaged separately without decreasing the cycle time.

Abstract: Based on a relationship between cutting-and-removing amounts for partly cutting out a stub of a pattern line and impedances of a matching circuit, a cutting-and-removing amount for adjusting the impedance to a target value is determined by simulation or by comparison operation of an impedance measured value with information stored in a database. Then, based on the determined cutting-and-removing amount, the stub of the pattern line is partly cut and removed so that the impedance is adjusted to the target value.

Abstract: All images of a plurality of sucked and held electronic components are picked up, sucked and held states of the electronic components are successively recognized by their respective images in an order of placing the electronic components onto a circuit board, and the electronic components for which the recognition processing is completed can be successively placed onto the circuit board in this order during a process of the recognition processing.

Abstract: A motion of a printed circuit board (1) is detected by an encoder (4) arranged aside a belt conveyer (2), and the encoder generates a detection signal (S3) which activates a timing signal generator unit (5) for generating an image pickup start timing signal which is fed to a time measuring unit (6) for measuring the image storing time which corresponds to the time interval of the image pickup start signal (S1). According to the image storing time, the image signal (S2) generated by the line CCD camera (3) is normalized by the normalizing calculation means (7), and thereafter, the mounting condition of the printed circuit board is judged by the image recognizing section (B) with the use of the image data (D) to thereby realize a simple and convenient mechanism at a low cost and at a high precision.

Abstract: Based on a relationship between cutting-and-removing amounts for partly cutting out the stub of the pattern line and impedances of the matching circuit, a cutting-and-removing amount for adjusting the impedance to a target value is determined by simulation or by comparison operation of an impedance measured value with information stored in a database. Then, based on the determined cutting-and-removing amount, the stub of the pattern line is partly cut and removed so that the impedance is adjusted to the target value.

Abstract: A motion of a printed circuit board (1) is detected by an encoder (4) arranged aside a belt conveyer (2), and the encoder generates a detection signal (S.sub.3) which activates a timing signal generator unit (5) for generating an image pickup start timing signal which is fed to a time measuring unit (6) for measuring the image storing time which corresponds to the time interval of the image pickup start signal (S1). According to the image storing time, the image signal (S2) generated by the line CCD camera (3) is normalized by the normalizing calculation means (7), and thereafter, the mounting condition of the printed circuit board is judged by the image recognizing section (B) with the use of the image data (D) to thereby realize a simple and convenient mechanism at a low cost and at a high precision.

Abstract: The three-dimensional measuring apparatus of the present invention includes an optical beam scanning unit for scanning a projected-and-depressed surface of an object with an optical beam while controlling the scanning operation, and a detector unit for receiving a reflected optical beam reflected by the projected-and-depressed surface through the scanning operation and for thereby measuring height information on the projections and depressions of the object, in which noise information due to noise generated during the control of the scanning operation with the optical beam is prevented from being transmitted as the height information from the detector unit.

Abstract: A mounting state of a component mounted on a printed circuit board with adhesive is inspected by an apparatus which includes an image pick-up unit for picking up in colors an image of the board after the component is mounted, a color extracting part for discriminating an adhesive portion of the image based on a predetermined color distribution of the adhesive and then extracting the adhesive portion as extracted data, a cutting part for setting a window frame for a to-be-inspected portion in the image of the board relative to the extracted data so as to detect bulging of the adhesive, and cutting out data within the window frame, and a deciding part for deciding, based on the cut data, a presence/absence of the bulging of the adhesive from a size or an area of a portion in the window frame which shows a color within the color distribution of the adhesive.