Abstract: A lamp includes an LED module, a drive unit supplying power to the LED module, and a base via which power is fed from an external power supply to the drive unit. The drive unit is located between the LED module and the base. The drive unit includes a circuit board having a main surface on which lead-type electronic components are mounted, lead wires (first lead wires) extending from the main surface of the circuit board and connected to the LED module, and lead wires (second lead wires) extending from the main surface of the circuit board and connected to the base. The circuit board has a through-hole extending from the main surface to an opposite surface thereof. The lead wires pass through the through-hole.

Abstract: There are provided a substrate for mounting a device and a package for housing the device employing the same in which a power semiconductor device can be readily set for a temperature suitable for operation and can thus function in a proper fashion. The substrate for mounting the device includes a support body having, on one main surface of the support body, a device mounting portion for mounting a power semiconductor device, the support body having a plurality of columnar parts that are spaced apart in a thickness direction with respect to the device mounting portion and are arranged apart from each other; and a heat accumulating region which is disposed between the columnar parts and is lower in thermal conductivity than the support body.

Abstract: A lamp includes an LED module, a drive unit supplying power to the LED module, and a base via which power is fed from an external power supply to the drive unit. The drive unit is located between the LED module and the base. The drive unit includes a circuit board having a main surface on which lead-type electronic components are mounted, lead wires (first lead wires) extending from the main surface of the circuit board and connected to the LED module, and lead wires (second lead wires) extending from the main surface of the circuit board and connected to the base. The circuit board has a through-hole extending from the main surface to an opposite surface thereof. The lead wires pass through the through-hole.

Abstract: There are provided a substrate for mounting a device and a package for housing the device employing the same in which a power semiconductor device can be readily set for a temperature suitable for operation and can thus function in a proper fashion. The substrate for mounting the device includes a support body having, on one main surface of the support body, a device mounting portion for mounting a power semiconductor device, the support body having a plurality of columnar parts that are spaced apart in a thickness direction with respect to the device mounting portion and are arranged apart from each other; and a heat accumulating region which is disposed between the columnar parts and is lower in thermal conductivity than the support body.

Abstract: The invention offers a slurry for polishing the surface of a nitride crystal. The polishing slurry contains oxide abrasive grains, at least one dispersant selected from the group consisting of an anionic organic dispersant and an inorganic dispersant, and an oxidizing reagent. The polishing slurry has a pH of less than 7. The slurry efficiently polishes the surface of the nitride crystal.

Abstract: A circuit coupling adhesive which is superior in heat resistance and moisture resistance is provided. The circuit coupling adhesive of the present invention can be used for purposes where high performing reliability is required, since it exhibits satisfactory electroconductive/insulative performance at connection of electrodes, etc. and the characteristics will not be varied so much even after a long period of use in a high temperature and high humidity environment. The circuit coupling adhesive comprises, as the essential ingredients, an epoxy resin, a latent curing agent, inorganic fillers having an average particle diameter of 500 nm or less, and electro-conductive particles. By mix a sufficient amount of inorganic fillers having an average particle diameter of 500 nm or less, the coefficient of thermal expansion can be decreased and the heat resistance and moisture resistance can be improved.

Abstract: This invention provides a photoreactive composition in which reaction of a hydrolyzable metal compound takes place by irradiation of light. A photoreactive composition, which comprises a hydrolyzable metal compound (A) comprising a metal atom and a hydrolyzable functional group bonded to the metal atom and, a compound (B) promoting reaction, polymerization or crosslinking of the compound (A) in the presence of oxygen by irradiation of light.

Abstract: A circuit coupling adhesive which is superior in heat resistance and moisture resistance is provided. The circuit coupling adhesive of the present invention can be used for purposes where high performing reliability is required, since it exhibits satisfactory electroconductive/insulative performance at connection of electrodes, etc. and the characteristics will not be varied so much even after a long period of use in a high temperature and high humidity environment. The circuit coupling adhesive comprises, as the essential ingredients, an epoxy resin, a latent curing agent, inorganic fillers having an average particle diameter of 500 nm or less, and electro-conductive particles. By mix a sufficient amount of inorganic fillers having an average particle diameter of 500 nm or less, the coefficient of thermal expansion can be decreased and the heat resistance and moisture resistance can be improved.

Abstract: There is provided a personal image information recording/outputting system capable of inexpensively acquiring an output matter (a printed matter of a photographic image or the like) of personal image information (digital image data) such as a facial photographic image, and allowing third parties to effectively utilize personal image information such as a facial photographic image or the like by permission of an owner of personal image information or the like. A photographic image managing part 12 of a center server 10 stores photographic image data 14 and personal data 15, which are transferred from a store server 20 or 30, in a data base 13, and retrieves and extract photographic image data 14 meeting required conditions, from the data base 13 on the basis of personal data 15.

Abstract: This invention provides a photoreactive composition in which reaction of a hydrolyzable metal compound takes place by irradiation of light.

Abstract: Input image data (3) and reproduction-restraining pattern data (2) are combined to obtain composite image data. A composite image represented by the composite image data is printed on an image-receiving sheet (10) by an on-demand printing system. A reproduction-restraining pattern (11) appears when the printed composite image is copied.

Abstract: A photographing system comprises a photographing box (16) capable of accommodates a user (17) and of allowing the user (17) to change a pose, a lighting means (2) installed in the photographing box (16), and a photographing means (3) installed in the photographing box (16). A printing means (8) prints out pictures on the basis of photographic data provided by the photographing means (3). The lighting means (2), the photographing means (3) and the printing means (8) are controlled by a synchronizing control means (9).

Abstract: There is provided a personal image information recording/outputting system capable of inexpensively acquiring an output matter (a printed matter of a photographic image or the like) of personal image information (digital image data) such as a facial photographic image, and allowing third parties to effectively utilize personal image information such as a facial photographic image or the like by permission of an owner of personal image information or the like. A photographic image managing part 12 of a center server 10 stores photographic image data 14 and personal data 15, which are transferred from a store server 20 or 30, in a data base 13, and retrieves and extract photographic image data 14 meeting required conditions, from the data base 13 on the basis of personal data 15.

Abstract: A method of producing an acrylic emulsion adhesive characterized in that a composition comprising 100 parts by weight of a monomeric mixture of alkyl (meth)acrylate, acrylic acid, methacrylic acid and N-vinylpyrrolidone, 0.5-2 parts by weight of a surfactant mixture of an anionic surfactant and a nonionic surfactant, and 0.03 to 0.5 part by weight of a polymerization initiator is subjected to emulsion polymerization reaction. The acrylic emulsion adhesive of this invention is rich in solids, features good adhesion and cohesion as well as high water resistance. Therefore, by coating one side of a transparent support, this adhesive can be used as an adhesive sheet for surface protection.

Abstract: A package for housing semiconductor elements including an insulating base which consists of electrical insulation material, and has a mounting portion that mounts semiconductor elements on the upper surface as well as a plurality of depressions on either of the upper surface and the lower surface thereof, a plurality of metallized wiring layers led away from the periphery of the mounting portion and extending to one end surface of the depressions, a plurality of connection pads for electrically connecting the metallized wiring layers formed on the end surface of the depressions of the insulating base and terminals which are soldered to the connection pads, wherein the terminals are accurately attached by solder to designated positions on the connection pads and securely and strongly joined to designated wire conductors of external electronic circuit boards to achieve reliable electrical connections of semiconductor integrated circuit elements housed inside the package to external electronic circuit boards.

Abstract: A circuit sub-assembly as a mounting for an electronic component such as Josephson device, i.e., a superconducting element, comprises a ceramic insulating substrate, an oxygen-shielding barrier layer formed on the insulating substrate, and a circuit film of niobium, as a superconducting material formed on the barrier layer according to a desired pattern. The barrier layer prevents oxidation of the circuit layer by shielding it from oxygen present in the insulating substrate. Due to the barrier layer, the circuit film is scarcely subject to superconductivity-impairing oxidation. The circuit film is thus capable of high-speed electronic signal conduction.

Abstract: Disclosed herein is a pressure sensitive adhesive composition comprising 100 parts by weight of at least one block copolymer selected from the group consisting of block copolymers represented by the general formula A-B-A and block copolymers represented by the general formula A-B, wherein A means a styrene polymer block and B denotes a butadiene polymer block, an isoprene polymer block or a polymer block obtained by hydrogenating these polymers, 10-200 parts by weight of a tackifying resin and 25-200 parts by weight of a polyolefin. Pressure sensitive adhesive tapes or sheets comprising, as a pressure sensitive adhesive layer, the pressure sensitive adhesive composition are also disclosed.

Abstract: Disclosed herein is a pressure sensitive adhesive composition comprising 100 parts by weight of at least one block copolymer selected from the group consisting of block copolymers represented by the general formula A-B-A and block copolymers represented by the general formula A-B, wherein A means a styrene polymer block and B denotes a butadiene polymer block, an isoprene polymer block or a polymer block obtained by hydrogenating these polymers, 100-200 parts by weight of a tackifying resin and 25-200 parts by weight of a polyolefin. Pressure sensitive adhesive tapes or sheets comprising, as a pressure sensitive adhesive layer, the pressure sensitive adhesive composition are also disclosed.

Abstract: A method of forming a ball on the end of a wire by electrical discharge between the wire and an electrode includes detecting the discharge voltage and discharge current of an electrical discharge between an end of a wire having a diameter and an electrode; multiplying the discharge voltage by the discharge current for respective time intervals during the discharge to compute the heat energy supplied in the discharge during each time interval; integrating the heat energy for the time intervals during a discharge to determine the total heat energy supplied during the discharge; comparing the total heat energy with a predetermined heat energy that produces a ball on the end of the wire, the ball having a diameter of about two to three and one-half times the diameter of the wire; and controlling at least one of the discharge voltage, current, and duration in accordance with the comparison and terminating the discharge when the total heat energy supplied to the discharge exceeds the predetermined heat energy.

Abstract: A robot control system including a robot, a robot controller for controlling operation of the robot, and a teaching box for teaching the robot through the robot controller. The teaching box includes an input unit separate from the robot controller for entering a command signal to teach the robot its operation to be effected and a control unit for controlling the input unit and processing and for applying the command signal to the robot controller.