Abstract: A telescopic boom includes a first frame having a curved portion whose section is substantially U-shaped, and a second frame connected to the first frame so that a closed section is formed. In the telescopic boom, the U-shaped curved portion of the first frame includes a plurality of protrusion portions formed at intervals in a circumferential direction of the telescopic boom, each protrusion portion extending in a longitudinal direction of the telescopic boom and being formed to have an arc-shaped section and protrude to the outside of the first frame.

Abstract: A wiring board includes: an insulating layer; and a wiring layer including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the upper surface of the wiring layer is exposed from the insulating layer, and the side surface and the lower surface of the wiring layer are embedded in the insulating layer. A recess portion is formed in an outer edge portion of the upper surface of the wiring layer, and the recess portion is filled with the insulating layer.

Abstract: An examination is performed of whether or not a bank having a defect portion is present. When a bank having a defect portion is present, the bank having the defect portion is repaired by forming a dam in each of adjacent concave spaces between which the bank having the defect portion is located. A dam formed in a concave space partitions the concave space into a first space in a vicinity of the defect portion and a second space outside the vicinity of the defect portion. The dam, at a portion thereof with lowest height, satisfies (h/H)+0.1W?1.5, 0.5?(h/H)?2.0, and 5?W?50, where a ratio of the height h of the dam to a height H of the banks is denoted as h/H, and a width of the dam is denoted as W ?m.

Abstract: A wiring substrate includes a first wiring substrate, a first insulation layer covering the first wiring layer, a second insulation layer stacked on the first insulation layer, and a cavity extending through the second insulation layer and exposing a portion of the upper surface of the first insulation layer. The cavity includes an opening, which is defined by an upper portion of a stepped inner wall surface of the second insulation layer, and a recess, which is defined by a lower portion of the stepped inner wall surface that contacts the upper surface of the first insulation layer. The recess is wider than the opening. An electronic component is mounted on the upper surface of the first insulation layer. The opening and the recess are filled with a third insulation layer that covers the electronic component and the second insulation layer.

Abstract: A wiring substrate includes a first wiring substrate, a first insulation layer stacked on the first wiring layer, and second and third insulation layers sequentially stacked on the first insulation layer. An electronic component is mounted on the first insulation layer in a cavity extending through the second and third insulation layers. The cavity is filled with a fourth insulation layer that entirely covers an upper surface of the third insulation layer and covers the electronic component. A second wiring layer is incorporated in the second and third insulation layers and electrically connected to the first wiring layer. The second wiring layer is electrically connected to a third wiring layer, which is stacked on the fourth insulation layer, by a first via wiring extending through the second and third insulation layers.

Abstract: A bank repair method for repairing a defect portion of a bank in a process of manufacturing an organic electroluminescence (EL) display device including a substrate, banks formed over the substrate, and light-emitting layers formed in concave spaces defined by the banks. The bank repair method includes: examining whether or not a bank having a defect portion is present; and when a bank having a defect portion is present, repairing the bank by applying a repair material containing a gas adsorbent to the defect portion and curing the repair material; and after curing the repair material, baking the repair material by irradiating the repair material with infrared laser light.

Abstract: A wiring board includes: an insulating layer; and a wiring layer including: an upper surface; a lower surface opposite to the upper surface; and a side surface between the upper surface and the lower surface, wherein the upper surface of the wiring layer is exposed from the insulating layer, and the side surface and the lower surface of the wiring layer are embedded in the insulating layer. A recess portion is formed in an outer edge portion of the upper surface of the wiring layer; and the recess portion is filled with the insulating layer.

Abstract: A fuel filler system for use in a vehicle is provided. The system includes a fuel filler tube, a locking bracket coupled to an inner surface of the fuel filler tube, and a closure device coupleable within the tube end and including an outer wall and a radially movable tab extending from the outer wall. The tab engages the locking bracket after rotation of the closure device from a first rotational position to a second rotational position to prevent rotation of the closure device relative to the locking bracket. The closure device further includes a web flexibly connecting the tab to the outer wall and a region of weakness defined in the web, such that upon forcible rotation of the closure device from the second rotational position to the first rotational position, the region of weakness facilitates separation of the web from the outer wall.

Abstract: An examination is performed of whether or not a bank having a defect portion is present. When a bank having a defect portion is present, the bank having the defect portion is repaired by forming a dam in each of adjacent concave spaces between which the bank having the defect portion is located. A dam formed in a concave space partitioning the concave space into a first space in a vicinity of the defect portion and a second space outside the vicinity of the defect portion.

Abstract: An electronic component built-in substrate includes an insulating base material having a first surface and a second surface opposite to the first surface, an electronic component embedded in the insulating base material and having an electrode on a side surface thereof, a first wiring layer embedded in an area outside the electrode of the electronic component in the insulating base material with a surface of the first wiring layer being exposed from the first surface of the insulating base material, a via conductor reaching from the second surface of the insulating base material to a side surface of the electrode of the electronic component and the first wiring layer, and a second wiring layer formed on the second surface of the insulating base material and connected to the via conductor.

Abstract: A wiring substrate includes a first wiring substrate, a first insulation layer covering the first wiring layer, a second insulation layer stacked on the first insulation layer, and a cavity extending through the second insulation layer and exposing a portion of the upper surface of the first insulation layer. The cavity includes an opening, which is defined by an upper portion of a stepped inner wall surface of the second insulation layer, and a recess, which is defined by a lower portion of the stepped inner wall surface that contacts the upper surface of the first insulation layer. The recess is wider than the opening. An electronic component is mounted on the upper surface of the first insulation layer. The opening and the recess are filled with a third insulation layer that covers the electronic component and the second insulation layer.

Abstract: A wiring substrate includes a first wiring layer, a first insulation layer, and a second wiring layer. The first insulation layer covers an upper surface and a side surface of the first wiring layer and exposes a lower surface of the first wiring layer. The second wiring layer is stacked on at least one of a lower surface of the first insulation layer and the lower surface of the first wiring layer.

Abstract: A wiring substrate includes a first wiring substrate, a first insulation layer stacked on the first wiring layer, and second and third insulation layers sequentially stacked on the first insulation layer. An electronic component is mounted on the first insulation layer in a cavity extending through the second and third insulation layers. The cavity is filled with a fourth insulation layer that entirely covers an upper surface of the third insulation layer and covers the electronic component. A second wiring layer is incorporated in the second and third insulation layers and electrically connected to the first wiring layer. The second wiring layer is electrically connected to a third wiring layer, which is stacked on the fourth insulation layer, by a first via wiring extending through the second and third insulation layers.

Abstract: An image forming apparatus includes a multi-color misalignment calculator that calculates an amount of multi-color misalignment of multiple color misalignment detection test pattern images based on position readings outputted by multiple test pattern image detectors, an image formation condition adjusting unit that adjusts an image formation condition of the image forming apparatus in accordance with the amount of multi-color misalignment of the multiple color misalignment detection test pattern images calculated by the multi-color misalignment calculator, and a process control unit that initiates a first multi-color misalignment correction control mode including a skew misalignment correction process and a second multi-color misalignment correction control mode excluding the skew misalignment correction process to correct multi-color misalignment of the multiple color misalignment detection test pattern images.

Abstract: A circuit board includes an insulating layer including first and second insulator films, a first wiring layer embedded in the first insulator film and including pads and first wiring patterns exposed from the first insulator film, and a second wiring layer including second wiring patterns formed on the second insulator film and via wirings penetrating the insulating layer and electrically connecting the second wiring patterns to the first wiring layer. The first insulator film is made of a reinforcement-free resin that includes no reinforcing member. The second insulator film is made of a reinforcing member impregnated with a resin.

Abstract: A device includes a sound source, an electric board, an exterior member, an electric board container box, and a sound absorber. The sound source generates a sound at a time of operation. The electric board has a circuit mounting an electrical component. The exterior member surrounds the sound source and the electric board. The electric board container box houses the electric board. The sound absorber is at least partially disposed inside a virtual space corresponding to a thickness of the electric board container box in an interior space of the device.

Abstract: Systems and methods for assembling a fuel filler system for use in a vehicle are provided. A locking bracket is coupled within an end of a fuel filler tube. At least one passage is defined in the locking bracket for facilitating insertion of a closure device into the fuel filler tube end. At least one anti-removal structure on the closure device passes through the at least one passage during insertion of the closure device. The at least one anti-removal structure precludes removal of the closure device after insertion of the closure device, and rotation of the closure device from a first rotational position relative to the locking bracket to a second rotational position. First and second anti-rotation structures extending from the closure device engage first and second ends of the locking bracket to prevent further rotation of the closure device.

Abstract: An image forming apparatus includes a plurality of latent image bearers, a latent image writer, a plurality of developing units, a primary transfer unit, a secondary transfer unit, an adjuster, a pattern image formation controller, a color deviation detector, a color deviation correction controller, and an image-formation-mode setting unit. The color deviation correction controller executes color deviation correction control in the separated state. The image-formation-mode setting unit sets a normal linear-velocity image formation mode in which an image is formed at a normal linear velocity and at least one non-normal linear-velocity image formation mode including a low linear-velocity image formation mode in which an image is formed at a low linear velocity slower than the normal linear velocity.

Abstract: A liquid ejecting apparatus includes a liquid ejecting head that includes a nozzle formation surface on which a plurality of nozzles which eject a liquid are formed to be lined up in one direction to form nozzle columns, a belt-shaped member that is brought into contact with the nozzle formation surface, and a belt-shaped member contact portion that brings the belt-shaped member into contact with the nozzle formation surface in both a first contact state where the belt-shaped member is brought into contact with a partial area of the nozzle formation surface and a second contact state where the belt-shaped member is in contact with an area corresponding to the nozzle column in a direction along the nozzle column on the nozzle formation surface.

Abstract: Systems and methods for assembling a fuel filler system for use in a vehicle are provided. The fuel filler system includes a closure device assembly and a fuel filler tube. A circumferential rim extends radially outwardly from a first end of the fuel filler tube. The rim has a non-planar cross-sectional shape. The fuel filler system also includes at least one catch member that extends from an inner surface of the closure device assembly. A seal member encircles a portion of the closure device assembly, and is axially spaced apart from the at least one catch member. After the closure device assembly is coupled to the fuel filler tube, the circumferential rim is axially captured between the at least one catch member and the seal member.