Patents by Inventor Kazuhiro Komatsu

Kazuhiro Komatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11941183
    Abstract: A touch sensor includes a sensor electrode group; and a touch integrated circuit coupled to the sensor electrode group for executing touch detection and configured to generate frame data indicative of a detection level of each of two-dimensional positions in the sensor electrode group. The touch integrated circuit is connected to an external processor different from the touch integrated circuit via a first bus. The touch integrated circuit supplies the frame data to the external processor via the first bus. The external processor feeds determination data resulting from performing predetermined processing on the frame data back to the touch integrated circuit. The touch integrated circuit performs an operation based on the determination data.
    Type: Grant
    Filed: December 6, 2022
    Date of Patent: March 26, 2024
    Assignee: Wacom Co., Ltd.
    Inventors: Hideyuki Komatsu, Kazuhiro Miyoshi, Shigeyuki Sano
  • Patent number: 11874039
    Abstract: A refrigeration cycle apparatus includes a refrigeration cycle circuit, a bypass flow path, a first valve provided in the refrigeration cycle circuit, a second valve provided at the bypass flow path, a first temperature sensor configured to detect a temperature of an indoor space, a second temperature sensor configured to detect a temperature of refrigerant on a liquid side of an indoor heat exchanger, and a notification part. The refrigeration cycle apparatus is able to operate in an operation state where the compressor operates, the indoor heat exchanger functions as an evaporator, and the first valve is open while the second valve is closed. In the operation state, the notification part issues notification of an abnormality of an electronic expansion valve or the first valve when a temperature detected by the second temperature sensor is higher than an evaporation temperature of refrigerant in the refrigeration cycle circuit.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: January 16, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yasutaka Ochiai, Kazuhiro Komatsu, Nobuaki Tasaki
  • Publication number: 20230200523
    Abstract: In an interdental cleaning tool, a flexible cleaning portion including a core covering portion that covers a core base, and a plurality of recesses that are formed due to hold pins during insert molding. The recesses are formed along a longitudinal direction of the core base portion. A core base exposed portion of each recess has a shape elongated in an oblique direction that intersects both the longitudinal direction and a lateral direction orthogonal to the longitudinal direction, and, at a position where a dimension of the core base exposed portion in the longitudinal direction is maximum, the maximum dimension is 0.25 mm or less.
    Type: Application
    Filed: December 26, 2019
    Publication date: June 29, 2023
    Applicant: SUNSTAR INC.
    Inventors: Kazuhiro KOMATSU, Keisuke KATO, Jurgen BUTZ
  • Publication number: 20220065511
    Abstract: A refrigeration cycle apparatus includes a refrigeration cycle circuit, a bypass flow path, a first valve provided in the refrigeration cycle circuit, a second valve provided at the bypass flow path, a first temperature sensor configured to detect a temperature of an indoor space, a second temperature sensor configured to detect a temperature of refrigerant on a liquid side of an indoor heat exchanger, and a notification part. The refrigeration cycle apparatus is able to operate in an operation state where the compressor operates, the indoor heat exchanger functions as an evaporator, and the first valve is open while the second valve is closed. In the operation state, the notification part issues notification of an abnormality of an electronic expansion valve or the first valve when a temperature detected by the second temperature sensor is higher than an evaporation temperature of refrigerant in the refrigeration cycle circuit.
    Type: Application
    Filed: August 1, 2019
    Publication date: March 3, 2022
    Inventors: Yasutaka OCHIAI, Kazuhiro KOMATSU, Nobuaki TASAKI
  • Publication number: 20210150437
    Abstract: An installing environment estimation device (10) includes: a data acquisition unit (11) to acquire data collected by an apparatus such as a sensor and camera of a mobile terminal carried by a maintenance personnel member to a building site, the data concerning an installation place of equipment which is installed at the building site; a feature quantity extraction unit (12) to extract a feature quantity of the acquired data; and an installing environment estimation unit (13) to estimate an installing environment of the equipment based on a classification model, by collating the feature quantity of the data with the classification model. The classification model is set for an item of the feature quantity of an individual apparatus. A range that the feature quantity which expresses an installing environment of equipment can have is set in the classification model.
    Type: Application
    Filed: January 8, 2021
    Publication date: May 20, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Jin KAWASAKI, Naoya FUKUOKA, Kazuhiro KOMATSU, Nobuaki TASAKI, Toshihiro MEGA
  • Patent number: 10746427
    Abstract: Including a data acquisition unit (11) that periodically acquires various measured temperatures of a liquid pipe (4), a gas pipe (5), and an intake port from an air conditioner controller (20), an operating state determination unit (12) that determines an operating state of an indoor unit (2) on the basis of the acquired various measured temperatures, a blowing temperature estimation unit (13) that estimates a blowing temperature from the indoor unit on the basis of the acquired various measured temperatures and an estimation model set in accordance with the determined operating state, and a blowing temperature display unit (14) that displays an estimated value of the blowing temperature.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: August 18, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Fuyuki Sato, Tomooki Ukiana, Kazuhiro Komatsu, Sosuke Minamida, Satoko Tomita
  • Patent number: 10680404
    Abstract: To provide an optical subassembly, an optical module, and an optical transmission equipment including simpler components. A first component with an optical semiconductor device mounted thereon that dissipates heat generated by the optical semiconductor device to outside, a second component in contact with the first component to form a box type housing, and a receptacle terminal that optically joined to the optical semiconductor device are provided, wherein the second component includes a window structure for transmitting light transmitted between the optical semiconductor device and the receptacle terminal, and the receptacle terminal is fused and fixed to the outside of the window structure.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: June 9, 2020
    Assignee: Lumentum Japan, Inc.
    Inventors: Kazuhiro Komatsu, Michihide Sasada
  • Patent number: 10505770
    Abstract: A signal processing device according to an embodiment includes a plurality of signal processing units and a pseudo signal generating unit. The plurality of signal processing units are provided in a plurality of reception antennas which receive reflection signals of a transmission signal reflected on an object, and perform signal processing in parallel on beat signals which are generated based on the transmission signal and the reflections signals. The pseudo signal generating unit generates a pseudo signal imitating the beat signal, and inputs the pseudo signal as a target of the signal processing into the plurality of signal processing units in parallel.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: December 10, 2019
    Assignees: FUJITSU TEN LIMITED, ASAHI KASEI MICRODEVICES CORPORATION, DENSO CORPORATION
    Inventors: Daisuke Enomoto, Kazuhiro Komatsu, Kenta Iwai, Takeshi Tanaka, Minoru Uehara, Tsuyoshi Sakakibara, Naoto Kusakawa, Hideki Kitagawa
  • Patent number: 10310199
    Abstract: Provided are an optical module and a transmission equipment in which a decrease in yield due to brazing or soldering is suppressed. Provided is an optical module including a semiconductor optical element, a stem, and a wiring substrate. The stem includes one or more lead terminals. The wiring substrate includes one or more openings through which the one or more lead terminals, respectively, pass. The stem has a placing surface on which the wiring substrate is placed, and two protrusion portions that are arranged on both external sides, respectively, of the wiring substrate. The wiring substrate further includes a ground conductor layer being positioned on a rear surface and two ground conductor patterns that are arranged on regions, respectively, that are in the vicinity of the two protrusion portions, of a front surface, and are electrically connected to the ground conductor layer.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: June 4, 2019
    Assignee: Oclaro Japan, Inc.
    Inventors: Daisuke Noguchi, Kazuhiro Komatsu
  • Patent number: 10250334
    Abstract: An optical receiver module includes light-receiving elements each having a first electrode and a second electrode to which a bias is applied, and converting input optical signals into electric signals and outputting the electric signals from the first electrodes, and a carrier having wiring patterns respectively electrically connecting to the light-receiving elements and supporting the light-receiving elements. The wiring pattern includes a first wiring line electrically connecting to the first electrode and a second wiring line electrically connecting to the second electrode. The second wiring line has a high resistance portion having a higher resistance value than the other portions at least in a position overlapping with the light-receiving element to be connected and a low resistance portion having a lower resistance value than the high resistance portion at least in a position not overlapping with any of the light-receiving elements.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: April 2, 2019
    Assignee: Oclaro Japan, Inc.
    Inventors: Takuma Ban, Kazuhiro Komatsu
  • Publication number: 20190049135
    Abstract: Including a data acquisition unit (11) that periodically acquires various measured temperatures of a liquid pipe (4), a gas pipe (5), and an intake port from an air conditioner controller (20), an operating state determination unit (12) that determines an operating state of an indoor unit (2) on the basis of the acquired various measured temperatures, a blowing temperature estimation unit (13) that estimates a blowing temperature from the indoor unit on the basis of the acquired various measured temperatures and an estimation model set in accordance with the determined operating state, and a blowing temperature display unit (14) that displays an estimated value of the blowing temperature.
    Type: Application
    Filed: September 9, 2016
    Publication date: February 14, 2019
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Fuyuki SATO, Tomooki UKIANA, Kazuhiro KOMATSU, Sosuke MINAMIDA, Satoko TOMITA
  • Patent number: 10135545
    Abstract: An optical receiver module includes a light receiving element that has a first electrode and a second electrode for receiving a bias and converts an optical signal inputted into an electrical signal to output the electrical signal via the first electrode. A signal line extends from the first electrode through the light receiving element-side signal pad and the second wire to the amplifier-side signal pad. A bias line extends from the second electrode through the light receiving element-side bias pad, the first wire, and the third wire to the first and second amplifier-side bias pads. The signal line three-dimensionally intersects with the bias line at an interval in a direction of the loop height of the first wire and that of the second wire.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: November 20, 2018
    Assignee: Oclaro Japan, Inc.
    Inventors: Takuma Ban, Kazuhiro Komatsu
  • Patent number: 10135223
    Abstract: An optical module includes: a wiring substrate that has a wiring pattern including a connecting portion and is arranged on an optical subassembly so as to be electrically connected thereto; and a flexible insulating layer formed between the optical subassembly and the wiring substrate. The optical subassembly includes: a conductive stem that has a surface opposed to the wiring substrate, the conductive stem being shaped so that the surface has a through hole opened therein and being connected to a reference potential; and a signal lead for transmitting a signal, the signal lead passing through the through hole while being electrically insulated from the conductive stem. The signal lead passes through the flexible insulating layer to be joined to the connecting portion. The flexible insulating layer is in contact with the connecting portion, the signal lead, and the surface of the conductive stem.
    Type: Grant
    Filed: May 24, 2017
    Date of Patent: November 20, 2018
    Assignee: Oclaro Japan, Inc.
    Inventors: Daisuke Noguchi, Kazuhiro Komatsu
  • Patent number: 10129983
    Abstract: A base material includes a pair of end regions located on both sides in a first direction, and an intermediate region located between the pair of end regions. The intermediate region includes a pair of side edges on both sides in a second direction orthogonal to the first direction. Both the pair of side edges do not project outward in the second direction from the pair of end regions. At least one of the pair of side edges has a shape recessed inward in the second direction from the pair of end regions. Terminals include end pads and a side pad. The end pads are located in each of the pair of end regions of the base material and arranged in the second direction. The side pad is located at at least one of the pair of side edges of the base material.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: November 13, 2018
    Assignee: Oclaro Japan, Inc.
    Inventors: Yoshikuni Uchida, Naohiko Baba, Hideaki Asakura, Michihide Sasada, Kazuhiro Komatsu
  • Patent number: 10113763
    Abstract: A refrigeration cycle apparatus Including a refrigerant circuit configured to circulate refrigerant to a compressor, an indoor heat exchanger, an expansion valve, and an outdoor heat exchanger, the compressor being connected to the indoor heat exchanger by a gas extension pipe, the expansion valve being connected to the outdoor heat exchanger by a liquid extension pipe; pressure sensors and temperature sensors to detect an operating state amount of the refrigerant circuit; and a controller to execute refrigerant-leakage detection operation of detecting refrigerant leakage by calculating a refrigerant amount in the refrigerant circuit based on the operating state amount detected by the pressure sensors and the temperature sensors, and comparing the calculated refrigerant amount with a reference refrigerant amount. The controller controls a quality of the refrigerant at an outlet of the liquid extension pipe to be in a range from 0.1 to 0.7 in the refrigerant-leakage detection operation.
    Type: Grant
    Filed: July 10, 2013
    Date of Patent: October 30, 2018
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yasutaka Ochiai, Fumitake Unezaki, Makoto Saito, Kazuhiro Komatsu, Junji Hori
  • Publication number: 20180278014
    Abstract: To provide an optical subassembly, an optical module, and an optical transmission equipment including simpler components. A first component with an optical semiconductor device mounted thereon that dissipates heat generated by the optical semiconductor device to outside, a second component in contact with the first component to form a box type housing, and a receptacle terminal that optically joined to the optical semiconductor device are provided, wherein the second component includes a window structure for transmitting light transmitted between the optical semiconductor device and the receptacle terminal, and the receptacle terminal is fused and fixed to the outside of the window structure.
    Type: Application
    Filed: March 26, 2018
    Publication date: September 27, 2018
    Inventors: Kazuhiro KOMATSU, Michihide SASADA
  • Publication number: 20180269986
    Abstract: An optical receiver module includes light-receiving elements each having a first electrode and a second electrode to which a bias is applied, and converting input optical signals into electric signals and outputting the electric signals from the first electrodes, and a carrier having wiring patterns respectively electrically connecting to the light-receiving elements and supporting the light-receiving elements. The wiring pattern includes a first wiring line electrically connecting to the first electrode and a second wiring line electrically connecting to the second electrode. The second wiring line has a high resistance portion having a higher resistance value than the other portions at least in a position overlapping with the light-receiving element to be connected and a low resistance portion having a lower resistance value than the high resistance portion at least in a position not overlapping with any of the light-receiving elements.
    Type: Application
    Filed: March 13, 2018
    Publication date: September 20, 2018
    Inventors: Takuma BAN, Kazuhiro KOMATSU
  • Publication number: 20180235087
    Abstract: A base material includes a pair of end regions located on both sides in a first direction, and an intermediate region located between the pair of end regions. The intermediate region includes a pair of side edges on both sides in a second direction orthogonal to the first direction. Both the pair of side edges do not project outward in the second direction from the pair of end regions. At least one of the pair of side edges has a shape recessed inward in the second direction from the pair of end regions. Terminals include end pads and a side pad. The end pads are located in each of the pair of end regions of the base material and arranged in the second direction. The side pad is located at at least one of the pair of side edges of the base material.
    Type: Application
    Filed: January 5, 2018
    Publication date: August 16, 2018
    Inventors: Yoshikuni UCHIDA, Naohiko BABA, Hideaki ASAKURA, Michihide SASADA, Kazuhiro KOMATSU
  • Publication number: 20180172932
    Abstract: Provided are an optical module and a transmission equipment in which a decrease in yield due to brazing or soldering is suppressed. Provided is an optical module including a semiconductor optical element, a stem, and a wiring substrate. The stem includes one or more lead terminals. The wiring substrate includes one or more openings through which the one or more lead terminals, respectively, pass. The stem has a placing surface on which the wiring substrate is placed, and two protrusion portions that are arranged on both external sides, respectively, of the wiring substrate. The wiring substrate further includes a ground conductor layer being positioned on a rear surface and two ground conductor patterns that are arranged on regions, respectively, that are in the vicinity of the two protrusion portions, of a front surface, and are electrically connected to the ground conductor layer.
    Type: Application
    Filed: December 7, 2017
    Publication date: June 21, 2018
    Inventors: Daisuke Noguchi, Kazuhiro Komatsu
  • Patent number: 10001610
    Abstract: A plurality of leads include a pair of differential signal leads for inputting differential signals, and a power supply lead for supplying power. A wiring pattern includes a pair of differential transmission lines connected to the pair of differential signal leads, and a power supply wiring connected to the power supply lead. A wiring board includes a first region overlapping an optical subassembly, and a second region extending from the first region so as to protrude from the optical subassembly. The pair of differential signal leads are farther away from the second region than the power supply lead. The pair of differential transmission lines are close together so as to be electromagnetically coupled to each other. The optical subassembly does not include a lead penetrating the wiring board in a region between the pair of differential transmission lines.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: June 19, 2018
    Assignee: OCLARO JAPAN, INC.
    Inventors: Kazuhiro Komatsu, Daisuke Noguchi