Abstract: An anti-vibration device is secured to a vibration source and a vibration transmission portion to inhibit transmission of vibration, and includes a first elastically deformed portion, a second elastically deformed portion and a third elastically deformed portion. The first elastically deformed portion is a plate having a thickness in a first thickness direction and vibrates in the first thickness direction to configure a path for the vibration to be transmitted from the vibration source to the vibration transmission portion. The second elastically deformed portion is a plate having a thickness in a second thickness direction intersecting the first thickness direction and vibrates in the second thickness direction to configure the path. The third elastically deformed portion is a plate having a thickness in a third thickness direction intersecting the first thickness direction and the second thickness direction and vibrates in the third thickness direction to configure the path.

Abstract: An adhesive composition for forming an adhesive layer that can bond a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate in a peelable manner, the composition containing a component (A) which is cured through hydrosilylation and a peeling component (B) which contains a component containing an epoxy-modified polyorganosiloxane, wherein the component (A) contains a polysiloxane (A1) including a siloxane unit represented by SiO2 (unit Q) and the like, and a platinum group metal catalyst (A2); and the polysiloxane (A1) contains a polyorganosiloxane (a1) including a siloxane unit represented by SiO2 (unit Q?) and the like, and a polyorganosiloxane (a2) including a siloxane unit represented by SiO2 (unit Q?) and the like, and having a functional group (Si—H) content of 5.0 mol/kg or greater.

Abstract: The present invention provides a semiconductor substrate cleaning method including a step of removing an adhesive layer provided on a semiconductor substrate by use of a remover composition which contains a solvent but no salt, the solvent containing a C8 to C10 linear-chain, saturated, aliphatic hydrocarbon compound. As the C8 to C10 linear-chain, saturated, aliphatic hydrocarbon compound, a linear-chain hydrocarbon compound is used.

Abstract: An adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the adhesive including a component (A) that is cured by a hydrosilylation reaction and a component (B) containing a phenyl group-containing polyorganosiloxane, wherein a ratio in % by mass of the component (A) to the component (B) is 95:5 to 30:70. A separation method including applying the adhesive onto a first body to form an adhesion layer, attaching a second body to the adhesion layer, heating the adhesion layer from a side of the first body to cure the adhesive to form a layered body, processing the layered body, and carrying out separation between the adhesion layer, and the first and second bodies. The processing may be polishing the rear surface of the wafer.

Abstract: An adhesive composition for forming an adhesive layer that can bond a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate in a peelable manner, the composition containing a component (A) which is cured through hydrosilylation and a peeling component (B) which contains a component containing an epoxy-modified polyorganosiloxane, wherein the component (A) contains a polysiloxane (A1) including a siloxane unit represented by SiO2 (unit Q) and the like, and a platinum group metal catalyst (A2); and the polysiloxane (A1) contains a polyorganosiloxane (a1) including a siloxane unit represented by SiO2 (unit Q?) and the like, and a polyorganosiloxane (a2) including a siloxane unit represented by SiO2 (unit Q?) and the like, and having a functional group (Si—H) content of 5.0 mol/kg or greater.

Abstract: An adhesive composition for use in debonding with infrared radiation, which composition can achieve debonding through irradiation with an infrared ray, the composition including a component (A) which is cured through hydrosilylation and a component (B) which is at least one species selected from the group consisting of a component containing an epoxy-modified polyorganosiloxane, a component containing a methyl group-containing polyorganosiloxane, and a component containing a phenyl group-containing polyorganosiloxane.

Abstract: A laminate debonding method includes producing a laminate by joining a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate which allows passage of infrared laser light, by the mediation of a first adhesive layer provided on the first substrate and a second adhesive layer provided on the second substrate, wherein the first adhesive layer is obtained by curing an adhesive (A) containing a component which is cured through hydrosilylation, and the second adhesive layer is obtained by use of an adhesive (B) formed of a polymer adhesive having an aromatic ring in at least one of a main chain and a side chain and which allows passage of infrared laser light; and irradiating the laminate with infrared laser light from a second substrate side for debonding the second substrate at the interface between the first and second adhesive layers.

Abstract: An adhesive can be easily peeled off after polishing the back face of a wafer, which has heat resistance and can be easily washed off. An adhesive for peelably adhering between a support and a circuit-bearing face of a wafer and thereby processing a back face of the wafer, a peeling face upon peeling becomes selectable according to heating from the support side or wafer side when the adhesive is cured. The adhesive includes a component (A) curing by hydrosilylation reaction and a component (B) containing a polydimethylsiloxane. A peeling method including forming an adhesion layer by applying the adhesive to a surface of a first substrate, bonding a surface of a second substrate to the adhesion layer, curing the adhesion layer by heating from the first substrate side to form a laminate, processing the laminate, and peeling off between the first substrate and the adhesion layer.

Abstract: A viewing device for a vehicle including: a supporting body provided at a vehicle body side; a pivoting body that is pivotably supported at the supporting body, with a gap being provided between the pivoting body and the supporting body in a radial direction of pivoting; a viewing instrument that is provided at the pivoting body, that facilitates viewing by a vehicle occupant, and that is folded in or folded out as a result of the pivoting body being pivoted to one side or to another side; and a restricting portion that is provided at one of the supporting body or the pivoting body, and that restricts communication between one side and another side of the gap, with the restriction of communication between the one side and the other side of the gap being released when the viewing instrument is folded in or folded out.

Abstract: A temporary adhesive without the formation of voids between a support and a wafer. A temporary adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the temporary adhesive including a component (A) that is cured by a hydrosilylation reaction; a polymerization inhibitor (B) having a 5% mass decrease temperature of 80° C. or higher as measured using a Tg-DTA; and a solvent (C). The component (A) may include a polysiloxane (A1) including a polyorganosiloxane (a1) containing a C1-10 alkyl group and a C2-10 alkenyl group, and a polyorganosiloxane (a2) containing a C1-10 alkyl group and a hydrogen atom; and a platinum group metal-based catalyst (A2). The polymerization inhibitor (B) may be a compound of formula (1): (wherein R7 and R8 are each a C6-40 aryl group, or a combination of a C1-10 alkyl group and a C6-40 aryl group).

Abstract: A temporary adhesive is good peelability, heat resistance and cleaning removability after polishing of the rear surface of the wafer. A layered body for processing a rear surface of a wafer opposite to a circuit surface of the wafer, the layered body being a temporary adhesive loaded between a support and circuit surface of the wafer and including an adhesive layer (A) that includes a polyorganosiloxane to be cured by a hydrosilylation reaction and is releasably bonded, and a separation layer (B) includes a polyorganosiloxane and is releasably bonded, in which the polyorganosiloxane forming the separation layer (B) is a polyorganosiloxane containing a siloxane unit of RRSiO2/2 (provided that each R is bonded to a silicon atom as a Si—C bond), and at least one R is an aralkyl group, epoxy group, or phenyl group. Methods for producing and separating these layered bodies and composition for forming the separation layer.

Abstract: A resin composition which is for an insulating film and from which a cured product having a further reduced dielectric constant and dielectric loss tangent is obtained; a photosensitive resin composition; a method for producing a cured relief pattern using the photosensitive resin composition; and a semiconductor device with the cured relief pattern. This resin composition for an insulating film includes: a polyimide precursor; and a compound which is a polyimide precursor containing a polyamic acid ester, a thermal imidization accelerator, and a solvent, wherein the thermal imidization accelerator has a carboxyl group and an amino group or imino group which is deprotected by heat and exhibits basicity, and does not accelerate the imidization of the polyimide precursor before the protective group is released. Furthermore, a photosensitive resin composition which is for an insulating film and includes a photopolymerization initiator.

Abstract: An adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the adhesive including a component (A) that is cured by a hydrosilylation reaction and a component (B) containing a phenyl group-containing polyorganosiloxane, wherein a ratio in % by mass of the component (A) to the component (B) is 95:5 to 30:70. A separation method including applying the adhesive onto a first body to form an adhesion layer, attaching a second body to the adhesion layer, heating the adhesion layer from a side of the first body to cure the adhesive to form a layered body, processing the layered body, and carrying out separation between the adhesion layer, and the first and second bodies. The processing may be polishing the rear surface of the wafer.

Abstract: An opening (irradiation opening (90A)), which faces an opening portion of an outer peripheral member and through which an optical axis of an optical member (lamp unit (46)) passes, is formed in a trunk portion (88) that, together with a viewing means (door mirror) for assisting viewing by a vehicle occupant of a vehicle, is covered by the outer peripheral member (visor cover). Further, a wall portion (106), which runs along a peripheral wall of the opening portion and, at a vehicle rear side portion, faces the peripheral wall at a radial direction side, is formed at the trunk portion. Air, which enters into the opening portion while the vehicle is traveling, passes-through a flow path that is bent by the peripheral wall and the wall portion, and the flow rate is reduced, and noise is suppressed.

Abstract: A temporary adhesive has excellent spin coating properties of a circuit side of a wafer and a support, and excellent heat resistance when the circuit side of the wafer or the support is attached to an adhesion layer or a rear surface of the wafer is processed, and is capable of easily separating the circuit side of the wafer from the support after polishing the rear surface of the wafer, and simply removing an adhesive attached to the wafer or the support after the separation. The adhesive contains a component (A) to be cured by a hydrosilylation reaction, and a component (B) containing an epoxy-modified polyorganosiloxane at a ratio in % by mass of the component (A) to the component (B) of 99.995:0.005 to 30:70. The component (B) is an epoxy-modified polyorganosiloxane having an epoxy value of 0.1 to 5.

Abstract: A viewing device for a vehicle including: a supporting body provided at a vehicle body side; a pivoting body that is pivotably supported at the supporting body, with a gap being provided between the pivoting body and the supporting body in a radial direction of pivoting; a viewing instrument that is provided at the pivoting body, that facilitates viewing by a vehicle occupant, and that is folded in or folded out as a result of the pivoting body being pivoted to one side or to another side; and a restricting portion that is provided at one of the supporting body or the pivoting body, and that restricts communication between one side and another side of the gap, with the restriction of communication between the one side and the other side of the gap being released when the viewing instrument is folded in or folded out.

Abstract: A vehicle visual recognition device comprises: a rotating body disposed at a vehicle exterior and supported by a vehicle body so as to be rotatable, and including a visual recognition unit that assists visual recognition of an occupant of a vehicle; an attachment member attached to the rotating body; and a projection unit including an optical member housed in a housing body, the housing body being retained by the attachment member, and the projection unit projecting an image outside the rotating body through the optical member.

Abstract: A vehicle door mirror device is provided that includes a stay that is provided at a vehicle exterior, and a mirror main body that is supported by the stay, and that is provided with a mirror to facilitate visual recognition by an occupant. A seal member is provided between a base of the stay and the mirror main body, and a seal section is provided at the seal member that is elastically deformable so as to effect sealing between the base of the stay and the mirror main body. The seal section is provided with a hollow portion at an extension portion extending from a base end side of the seal section. This enables the seal section to undergo elastic deformation readily, enabling resistance to rotation of the mirror main body to be reduced.

Abstract: An adhesive can be easily peeled off after polishing the back face of a wafer, which has heat resistance and can be easily washed off. An adhesive for peelably adhering between a support and a circuit-bearing face of a wafer and thereby processing a back face of the wafer, a peeling face upon peeling becomes selectable according to heating from the support side or wafer side when the adhesive is cured. The adhesive includes a component (A) curing by hydrosilylation reaction and a component (B) containing a polydimethylsiloxane. A peeling method including forming an adhesion layer by applying the adhesive to a surface of a first substrate, bonding a surface of a second substrate to the adhesion layer, curing the adhesion layer by heating from the first substrate side to form a laminate, processing the laminate, and peeling off between the first substrate and the adhesion layer.

Abstract: An opening (irradiation opening (90A)), which faces an opening portion of an outer peripheral member and through which an optical axis of an optical member (lamp unit (46)) passes, is formed in a trunk portion (88) that, together with a viewing means (door mirror) for assisting viewing by a vehicle occupant of a vehicle, is covered by the outer peripheral member (visor cover). Further, a wall portion (106), which runs along a peripheral wall of the opening portion and, at a vehicle rear side portion, faces the peripheral wall at a radial direction side, is formed at the trunk portion. Air, which enters into the opening portion while the vehicle is traveling, passes-through a flow path that is bent by the peripheral wall and the wall portion, and the flow rate is reduced, and noise is suppressed.