Abstract: A lead frame extends from inside a sealing resin to outside the sealing resin, and is placed to make contact with a main surface of an insulating sheet opposite to a heat dissipation plate. A semiconductor element is jointed to at least a portion of a main surface of the lead frame opposite to the insulating sheet within the sealing resin. The surface of the insulating sheet in contact with the lead frame is inclined and lowered to move away from the lead frame in an end region including at least a portion of an outermost end in plan view of the insulating sheet. The sealing resin enters a region between the lead frame and the insulating sheet in the end region. The lead frame is flat at least within the sealing resin.

Abstract: A refrigerating cycle apparatus includes: a compressor that compresses and discharges refrigerant; a radiator that makes the refrigerant discharged out of the compressor to radiate heat; a pressure reducing device that decompresses the refrigerant flowing out of the radiator; an evaporator that evaporates the refrigerant decompressed by the pressure reducing device; and a decompression control part that controls operation of the pressure reducing device. The decompression control part controls the operation of the pressure reducing device in a manner that a physical quantity which has correlation with a pressure of the refrigerant in the evaporator approaches a predetermined defrosting standard value when a time-priority defrosting mode is set.

Abstract: An object is to provide a fin integrated type semiconductor device and a method of manufacturing the same, which are provided with a simple structure and good heat dissipation characteristics. The semiconductor device includes: a base plate on which fins arranged in a standing condition are formed on a first main face; an insulating layer formed on a second main face of the base plate, the second main face being opposite to the first main face of the base plate; a circuit pattern fixed to the insulating layer; and a semiconductor element joined to the circuit pattern. The fins are formed with slits that pass through in the thickness direction of the fins.

Abstract: A semiconductor device includes a base plate having a first major plane and a second major plane opposite to each other, and having a plurality of fins held upright on the first major plane and a bulge portion formed on the first major plane to encircle the plurality of fins, an insulation layer formed on the second major plane of the base plate, a circuit pattern fixed to the insulation layer, a semiconductor element connected to the circuit pattern, and a sealing resin sealing the insulation layer, the circuit pattern, and the semiconductor element. The bulge portion formed on the first major plane continuously encircles the plurality of fins, the bulge portion has a widthwise margin on an outer peripheral edge of the base plate, and the sealing resin covers an outer peripheral side face of the bulge portion and the widthwise margin.

Abstract: A power semiconductor module is provided which is capable of keeping low the degrees of increases in temperatures of wide bandgap semiconductor elements, reducing the degree of increase in chip's total surface area of the wide bandgap semiconductor elements, and being fabricated at low costs, when Si semiconductor elements and the wide bandgap semiconductor elements are placed within one and the same power semiconductor module. The Si semiconductor elements are placed in a central region of the power semiconductor module, and the wide bandgap semiconductor elements are placed on opposite sides relative to the central region or in edge regions surrounding the central region.

Abstract: A method for manufacturing, by a transfer mold method, a power module equipped with a heat conductive insulating sheet in which an inorganic filler including secondary aggregated particles formed by aggregation of primary particles of scaly boron nitride is dispersed in a thermosetting resin, where curing of an uncured or semi-cured heat conductive insulating sheet during transfer molding is advanced under specific conditions. The method for manufacturing a power module equipped with a heat conductive insulating sheet has excellent thermal conductivity and electric insulation ability.

Abstract: A power semiconductor module in which temperature rise of switching elements made of a Si semiconductor can be suppressed low and efficiency of cooling the module can be enhanced. To that end, the power semiconductor module includes switching elements made of the Si semiconductor and diodes made of a wide-bandgap semiconductor, the diodes are arranged in the middle region of the power semiconductor module, and the switching elements are arranged in both sides or in the periphery of the middle region of the power semiconductor module.

Abstract: The purpose is to provide a fin-integrated type semiconductor device that is a simple structure and has a high heat dissipating characteristic, and to provide a manufacturing method therefor. The semiconductor device includes a base plate having a first major plane and a second major plane opposite to each other, and having a plurality of fins held upright on the first plane and a bulge portion formed thereon to encircle the plurality of fins; an insulation layer formed on the second major plane of the base plate; a circuit pattern fixed to the insulation layer; a semiconductor element connected to the circuit pattern; and a sealing resin sealing the insulation layer, the circuit pattern, and the semiconductor element. The bulge portion formed on the first major plane continuously encircles the plurality of fins.

Abstract: An object is to provide a fin integrated type semiconductor device and a method of manufacturing the same, which are provided with a simple structure and good heat dissipation characteristics. The semiconductor device includes: a base plate on which fins arranged in a standing condition are formed on a first main face; an insulating layer formed on a second main face of the base plate, the second main face being opposite to the first main face of the base plate; a circuit pattern fixed to the insulating layer; and a semiconductor element joined to the circuit pattern. The fins are formed with slits that pass through in the thickness direction of the fins.

Abstract: An electronic apparatus includes a light source; a casing that accommodates the light source and includes a first window transmitting light from the light source; a water inhibitor that is formed from a circumferential wall and a window seal in a monoblock form, the circumferential wall being disposed along a inner circumference of the casing and preventing invasion of water from the circumference of the casing into the casing, the window seal being disposed inside the first window and preventing invasion of water from the first window into the casing, the water inhibitor preventing invasion of water into the casing and transmitting the light from the first window to a outside of the casing; and a light guide member that is disposed over the first window and guides the light transmitted through the first window.

Abstract: A semiconductor device includes a metal substrate including a metal base plate, an insulating sheet located on the metal base plate, and a wiring pattern located on the insulating sheet, and a semiconductor element located on the metal substrate. The semiconductor element is sealed with a molding resin. The molding resin extends to side surfaces of the metal substrate. On the side surfaces of the metal substrate, the insulating sheet and the wiring pattern are not exposed from the molding resin, whereas the metal base plate includes a projecting portion exposed from the molding resin.

Abstract: A power semiconductor module is provided which is capable of keeping low the degrees of increases in temperatures of wide bandgap semiconductor elements, reducing the degree of increase in chip's total surface area of the wide bandgap semiconductor elements, and being fabricated at low costs, when Si semiconductor elements and the wide bandgap semiconductor elements are placed within one and the same power semiconductor module. The Si semiconductor elements are placed in a central region of the power semiconductor module, and the wide bandgap semiconductor elements are placed on opposite sides relative to the central region or in edge regions surrounding the central region.

Abstract: An electronic apparatus includes: a first casing; a second casing; a support member, disposed on the second casing, to support the first casing; a slide rail, engaged with the support member, to support the first casing such that the first casing becomes slidable; and a slide stopper, disposed on the slide rail, to include a stopper surface for the support member and a projecting portion that separates a first end side of the first casing from the second casing.

Abstract: A semiconductor device includes a metal substrate including a metal base plate, an insulating sheet located on the metal base plate, and a wiring pattern located on the insulating sheet, and a semiconductor element located on the metal substrate. The semiconductor element is sealed with a molding resin. The molding resin extends to side surfaces of the metal substrate. On the side surfaces of the metal substrate, the insulating sheet and the wiring pattern are not exposed from the molding resin, whereas the metal base plate includes a projecting portion exposed from the molding resin.

Abstract: An electronic equipment includes a housing in which an opening is formed, an electronic device unit in which an electronic device is provided at the opening of the housing, a device holder which is provided with a first sealing member around a periphery of the device holder, the device holder being provided in the housing or in a fixing unit fixed to the housing via the first sealing member, a second sealing member which is provided between the electronic device unit and the device holder and is provided to surround an interconnecting opening formed in the device holder, and a conductive member which is connected to other components from the electronic device unit through the interconnecting opening to enable transmitting or receiving of an electrical signal between the electronic device and other components.

Abstract: A power semiconductor module in which temperature rise of switching elements made of a Si semiconductor can be suppressed low and efficiency of cooling the module can be enhanced. To that end, the power semiconductor module includes switching elements made of the Si semiconductor and diodes made of a wide-bandgap semiconductor, the diodes are arranged in the middle region of the power semiconductor module, and the switching elements are arranged in both sides or in the periphery of the middle region of the power semiconductor module.

Abstract: An electronic apparatus includes a light source; a casing that accommodates the light source and includes a first window transmitting light from the light source; a water inhibitor that is formed from a circumferential wall and a window seal in a monoblock form, the circumferential wall being disposed along a inner circumference of the casing and preventing invasion of water from the circumference of the casing into the casing, the window seal being disposed inside the first window and preventing invasion of water from the first window into the casing, the water inhibitor preventing invasion of water into the casing and transmitting the light from the first window to a outside of the casing; and a light guide member that is disposed over the first window and guides the light transmitted through the first window.

Abstract: An electronic device including: a housing that has a cable insertion hole; a gel member that covers the cable insertion hole to shut water off, a cable being inserted through the cable insertion hole; a holding member, formed in synthetic resin, that has a first protruding portion to pass through the gel member, the first protruding portion projecting into the cable insertion hole, the holding member mounting and holding the gel member to the housing; and a fixing unit that fixes the holding member to the housing by passing through the gel member.

Abstract: An electronic apparatus includes: a first casing; a second casing; a support member, disposed on the second casing, to support the first casing; a slide rail, engaged with the support member, to support the first casing such that the first casing becomes slidable; and a slide stopper, disposed on the slide rail, to include a stopper surface for the support member and a projecting portion that separates a first end side of the first casing from the second casing.

Abstract: An electronic apparatus includes: a housing having a liquid crystal display section mounted in the housing; a space section formed between an end side in the housing and the liquid crystal display section; and a circuit unit having an antenna pattern, a microphone, and one or plurality of mounting components being mounted on one or both of the front and rear surface sides of the circuit unit arranged in the space section.