Abstract: An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.

Abstract: A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.

Abstract: A contactor has a contactor substrate and a plurality of contact electrodes formed on the contactor substrate. Each contact electrode is formed by a metal wire bent between one end joined to the contactor substrate and the other end. An inclined plane is formed by a cutting surface. A fracture surface formed by a tension fracture is formed at the apex portion of the contact electrode.

Abstract: An initiator includes a casing, a reactant disposed in the casing, and electrodes arranged to contact the reactant. The reactant contains an electrically conductive substance in a manner such that once a voltage is applied to the electrodes, an electric current flows through the electrically conductive substance, thereby initiating a reaction of the reactant. The initiator is easily manufactured with low manufacturing cost.

Abstract: A contactor comprises a film substrate of an insulating material and plural wiring patterns on the substrate, wherein a first end of each wiring pattern extends out from a first edge of the substrate as a first contact terminal and a second end of each wiring pattern extends out from a second edge of the substrate as a second contact terminal, and a part of the contactor located between the first end and second end can be deformed resiliently.

Abstract: A contactor has contact electrodes elastically deformable in a direction of thickness of the contactor so that the contactor can make a contact with a semiconductor device with an appropriate contact pressure. The contactor is positioned between the semiconductor device and a test board so as to electrically connect the semiconductor device to the test board. Each of a plurality of contact electrodes has a first contact electrode part, a second contact electrode part and a connecting part electrically connecting the first contact electrode part to the second contact electrode part. The first contact electrode part contacts an electrode of the semiconductor device. The second contact electrode part contacts a terminal of the test board. A combining member has an insulating characteristic and holds the connecting part of each of the contact electrodes in a predetermined arrangement.

Abstract: A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.

Abstract: A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.

Abstract: An attachment structure between a semiconductor device socket and a test circuit substrate is provided. The semiconductor device socket includes a socket body and a contact film disposed therein. Extension conductive wires extended from a contact portion to be connected to a semiconductor device are formed on the contact film. The contact film is also provided with socket connectors connected to the extension conductive wires. The test circuit substrate is provided with circuit substrate connectors corresponding to the socket connectors. The socket connectors and the circuit substrate connectors are in a male-female connector relationship.

Abstract: An IC carrier on which an integrated circuit (IC) package is loaded when electric testing of the IC package is carried out is described. The present invention enables an IC package to be loaded on or unloaded from the IC carrier smoothly without bending any of closely arranged fine leads, and prevents the lead from being deformed by falling impact when it is dropped. According to the present invention, an IC carrier for an IC package having an array of leads comprises an array of socket means for mating with the array of leads, wherein selected one of said socket means differs in an inner dimension from the other ones in the same array. The technique is applicable to both a flat IC package (QFP or SOP) and a pin grid array IC package (PGA).

Abstract: A hair cosmetic is disclosed which comprises the following components (A), (B) and (C):(A) a cationic surfactant;(B) a fat and/or an oil; and(C) an alkyl saccharide surfactant represented by the following formula (1) :R.sup.1 --O--(R.sup.2 O).sub.m --G.sub.n (1)wherein the weight ratio of (A)/(C) is from 1 to 20. A hair cosmetic which further comprises fine particles of an average particle size of 100 .mu.m or below as the component (D) is also disclosed. The hair cosmetic of the present invention gives a good smoothness, a good elasticity and an oil-free feel to the hair without imparting any sticky feel or dry and loose feel thereto.

Abstract: An IC carrier for electric testing of an IC package enables an IC package to be loaded on or unloaded from it smoothly without bending any of closely arranged fine leads, and prevents the leads from being deformed by falling impact when it is dropped. The IC carrier for an IC package, having an array of leads, comprises an array of sockets for mating with the array of leads, wherein selected one of the sockets differs in clearance between a width of each of the sockets and a width of each of the leads to be mated from the other ones in a cross section of an array. For instance, an array of sockets having holes to mate with leads having a single diameter of an IC package are arranged so that inner diameters of the holes in an outer part of the array is larger than those in a central part of the array. The technique is applicable to both a flat IC package (QFP or SOP) and a pin grid array IC package (PGA).

Abstract: The barrel temperature control apparatus for an injection molding machine can execute the barrel temperature control in such a way as to optimize the disturbance suppression characteristics. The temperature control section 7 comprises the manipulated variable addition and subtraction section 14 at the rear stage of the PiD control section 12 in such a way that the barrel temperature of the injection molding machine 1 can be controlled under both feedback and feed-forward. Further, when the same products are molded continuously, the barrel temperature is feed-forward controlled on the basis of the learned change manipulated variable.

Abstract: A reference pressure of melted material injected to a mold cavity of a mold is set as a function of injection passing time from a start of an injecting process or a function of a distance of movement of an injection plunger, and the movement of the plunger is started at a temporarily constant injection speed. A correction value of the injection speed is obtained to eliminate a difference between a sensed pressure of the melted material injected to the mold cavity of the mold and the reference pressure in a range that the sensed pressure of the melted material exceeds the reference pressure during the injection passing time from the start of the injection process wherein the plunger is started to move or during the movement of the plunger, and the injection speed is corrected in accordance with the corrected value.

Abstract: A composition for hair treatment such as hair rinse, shampoo, or hair conditioner, contains (a) 0.1-10 wt. % of a modified silicone polymer having at least one alkoxy group in the molecule and a melting point of not lower than 30.degree. C., (b) 0.1-20 wt. % of a cationic surface active agent, (c) 0.1-30 wt. % of an oily or fatty material, (d) 0.1-90 wt. % of an organic liquid which is compatible with water and of which molecule has at least one hydroxy group, and (e) water.

Abstract: A cosmetic composition comprising a long-chain alkyltrimethylol is disclosed. The alkyltrimethylol is represeneted by the formula (I): ##STR1## wherein R is a linear or branched, saturated or unsaturated alkyl group having 8-22 carbon atoms. The composition is applied to various types of cosmetic and exhibits superior extendibility when applied, imparts a non-sticky, fresh feeling upon use, and provides an excellent moisture-retaining effect.