Abstract: A working machine control device includes a camera that obtains a captured image by imaging a particular part that is a part of a lower travelling body, and a controller, in which the controller includes a setting unit that sets a target slewing angle of an upper slewing body with respect to the lower travelling body, and a display control unit that causes a display unit to display a display screen in which a target image indicating a target position of the particular part is displayed in a superimposed manner at a position on the captured image, the position being where the particular part is displayed when a slewing angle of the upper slewing body with respect to the lower travelling body reaches the target slewing angle.

Abstract: An anti-vibration device is secured to a vibration source and a vibration transmission portion to inhibit transmission of vibration, and includes a first elastically deformed portion, a second elastically deformed portion and a third elastically deformed portion. The first elastically deformed portion is a plate having a thickness in a first thickness direction and vibrates in the first thickness direction to configure a path for the vibration to be transmitted from the vibration source to the vibration transmission portion. The second elastically deformed portion is a plate having a thickness in a second thickness direction intersecting the first thickness direction and vibrates in the second thickness direction to configure the path. The third elastically deformed portion is a plate having a thickness in a third thickness direction intersecting the first thickness direction and the second thickness direction and vibrates in the third thickness direction to configure the path.

Abstract: A variable capacity turbocharger includes a housing, a turbine impeller at least partially located in the housing, a scroll flow path located in the housing and encircling the turbine impeller, a first nozzle ring and a second nozzle ring facing each other in the housing, a nozzle flow path located between the first nozzle ring and the second nozzle ring and fluidly coupling the scroll flow path to the turbine impeller, a gap formed between the first nozzle ring and the housing, and a bearing hole located in the first nozzle ring and including an opening adjacent to the gap. The gap is located on an opposite side of the first nozzle ring to the nozzle flow path. Additionally, the gap is connected to the scroll flow path.

Abstract: The present disclosure proposes a diagnostic system capable of properly identifying the cause of even an error for which multiple factors or multiple compound factors may be accountable. The diagnostic system according to the present disclosure is provided with a learning device for learning at least one of a recipe defining operations of an inspection device, log data describing states of the device, or specimen data describing characteristics of a specimen in association with error types of the device, and estimates the cause of the error by using the learning device (refer to FIG. 4).

Abstract: A power amplification circuit performs power amplification appropriate for the condition of an input signal. The power amplification circuit includes a splitter that includes a variable inductance element and a variable capacitance element and that splits a signal into a signal having a first power level and a signal having a second power level based on a value of inductance of the variable inductance element and a value of capacitance of the variable capacitance element. A carrier amplifier is connected to the splitter and amplifies the signal and output a signal. A peaking amplifier is connected to the splitter and outputs a signal when the second power level is greater than or equal to a predetermined power level, and a combiner (combines the two signals from the respective amplifiers.

Abstract: An actual machine control device 100 of a work machine 10 determines whether a connection center C1 of the work machine 10 is in a state of being presumed to deviate into one of vertical directions from a predetermined height range H. If the connection center C1 is in a state of being presumed to deviate into one of the vertical directions from the predetermined height range H, the actual machine control device 100 controls a driving device 150 so that a viewing angle range of an imaging device 112 is changed into the direction of the deviation.

Abstract: To provide a semiconductor device and a semiconductor module that are capable of improving a heat dissipation property in the semiconductor device including a heat generating element. A semiconductor device includes: a P-type semiconductor substrate, which has a main surface and a main surface opposed to the main surface; an N-type N well, which is provided on the main surface side of the semiconductor substrate; a unit field effect transistor, which is provided in the N well; a P-type heat dissipation guard ring region, which is provided on the main surface side of the semiconductor substrate on the outside of the N well in plan view of the semiconductor substrate; wiring, which is provided on the heat dissipation guard ring region; bump placement portions; and bumps.

Abstract: A master acquires, from a slave, a surrounding image obtained by capturing an image of surroundings of a construction machine from inside a cab seat of the construction machine, determines whether or not a working device is included in the surrounding image, and in a case of determining that the working device is not included in the surrounding image, calculates a position of the working device from a posture of the construction machine and displays, on a display device, a display object for informing an operator of the calculated position, together with the surrounding image.

Abstract: A plasma processing apparatus includes: a processing chamber disposed inside a vacuum container and in which plasma is formed; and a member which is a member forming an inner wall surface of the processing chamber and is disposed on a surface to be exposed to the plasma and has a coating film formed by spraying of yttrium fluoride or a material containing the yttrium fluoride. A ratio of an orthorhombic crystal of the yttrium fluoride or the material containing the yttrium fluoride forming the coating film relative to the entirety is 60% or more.

Abstract: On detection of a difference between the operation amount detected by a first sensor and the operation amount received by a first communication unit from a slave, a master side controller executes at least one of stop control to automatically stop a construction machine and alarm control to cause a warning device to issue an alarm. On detection of a difference between the operation amount detected by a second sensor and the operation amount received by a communication unit from the master, a slave side controller executes at least one of the stop control to automatically stop the construction machine and the alarm control to cause the warning device to issue the alarm.

Abstract: Provided is a manufacturing method of an interior member of a plasma processing apparatus, which improves processing yield. The interior member is disposed inside a processing chamber of the plasma processing apparatus and includes, on a surface thereof, a film of a material having resistance to plasma. The manufacturing method includes: a step of moving a gun by a predetermined distance along the surface of the interior member to spray the material to form the film, and disposing a test piece having a surface having a shape simulating a surface shape of the interior member within a range of the distance within which the gun is moved and forming the film of the material on the surface of the test piece; and a step of adjusting, based on a result of detecting a crystal size of the film on the surface of the test piece and presence or absence of a residual stress or inclusion of a contaminant element, a condition of forming the film on the surface of the interior member by the gun.

Abstract: The present disclosure proposes a diagnostic system capable of properly identifying the cause of even an error for which multiple factors or multiple compound factors may be accountable. The diagnostic system according to the present disclosure is provided with a learning device for learning at least one of a recipe defining operations of an inspection device, log data describing states of the device, or specimen data describing characteristics of a specimen in association with error types of the device, and estimates the cause of the error by using the learning device (refer to FIG. 4).

Abstract: An objective of the present invention is to provide a system which can infer the cause of a recipe error and present a correction candidate for the recipe error. A recipe information presentation system or recipe error inference system according to the present invention: causes a learner to learn a correspondence between a recipe and an error originating from the recipe; and acquires from the learner an inference result as to whether the error occurs when a new recipe is used (refer to FIG. 1).

Abstract: A semiconductor chip is mounted on a mounting substrate. The semiconductor chip includes plural first bumps on a surface facing the mounting substrate. The plural first bumps each have a shape elongated in a first direction in plan view and are arranged in a second direction perpendicular to the first direction. The mounting substrate includes, on a surface on which the semiconductor chip is mounted, at least one first land connected to the plural first bumps. At least two first bumps of the plural first bumps are connected to each first land. The difference between the dimension of the first land in the second direction and the distance between the outer edges of two first bumps at respective ends of the arranged first bumps connected to the first land is 20 ?m or less.

Abstract: A semiconductor chip is mounted on a mounting substrate. The semiconductor chip includes plural first bumps on a surface facing the mounting substrate. The plural first bumps each have a shape elongated in a first direction in plan view and are arranged in a second direction perpendicular to the first direction. The mounting substrate includes, on a surface on which the semiconductor chip is mounted, at least one first land connected to the plural first bumps. At least two first bumps of the plural first bumps are connected to each first land. The difference between the dimension of the first land in the second direction and the distance between the outer edges of two first bumps at respective ends of the arranged first bumps connected to the first land is 20 ?m or less.

Abstract: Each of a first image processing unit and a second image processing unit is configured to generate print data to be used by a printing unit based on image data generated by a controller. The controller comprises a transmission control unit configured to select, based on a sheet size which is a print setting corresponding to a print job as a condition, one of first transmission control of controlling a transmission unit to alternately transmit band data included in first image data and band data included in second image data and second transmission control of controlling the transmission unit so that the band data included in the second image data will be transmitted after the band data included in the first image data has been transmitted.

Abstract: On detection of a difference between the operation amount detected by a first sensor and the operation amount received by a first communication unit from a slave, a master side controller executes at least one of stop control to automatically stop a construction machine and alarm control to cause a warning device to issue an alarm. On detection of a difference between the operation amount detected by a second sensor and the operation amount received by a communication unit from the master, a slave side controller executes at least one of the stop control to automatically stop the construction machine and the alarm control to cause the warning device to issue the alarm.

Abstract: A working machine control device includes a camera that obtains a captured image by imaging a particular part that is a part of a lower travelling body, and a controller, in which the controller includes a setting unit that sets a target slewing angle of an upper slewing body with respect to the lower travelling body, and a display control unit that causes a display unit to display a display screen in which a target image indicating a target position of the particular part is displayed in a superimposed manner at a position on the captured image, the position being where the particular part is displayed when a slewing angle of the upper slewing body with respect to the lower travelling body reaches the target slewing angle.

Abstract: A master acquires, from a slave, a surrounding image obtained by capturing an image of surroundings of a construction machine from inside a cab seat of the construction machine, determines whether or not a working device is included in the surrounding image, and in a case of determining that the working device is not included in the surrounding image, calculates a position of the working device from a posture of the construction machine and displays, on a display device, a display object for informing an operator of the calculated position, together with the surrounding image.

Abstract: A semiconductor chip is mounted on a mounting substrate. The semiconductor chip includes plural first bumps on a surface facing the mounting substrate. The plural first bumps each have a shape elongated in a first direction in plan view and are arranged in a second direction perpendicular to the first direction. The mounting substrate includes, on a surface on which the semiconductor chip is mounted, at least one first land connected to the plural first bumps. At least two first bumps of the plural first bumps are connected to each first land. The difference between the dimension of the first land in the second direction and the distance between the outer edges of two first bumps at respective ends of the arranged first bumps connected to the first land is 20 ?m or less.