Patents by Inventor Kazuhiro Ushita

Kazuhiro Ushita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10287685
    Abstract: Provided is a susceptor capable of achieving improved thermal uniformity while suppressing reduction in its temperature increase rate and heat utilization efficiency. A susceptor includes a plate-shaped first member including a wafer placement surface on which to place a wafer, and a second member supporting the first member and laid on the first member in the direction perpendicular to the wafer placement surface. The thermal conductivity of the first member is higher than the thermal conductivity of the second member.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: May 14, 2019
    Assignee: MARUWA CO., LTD.
    Inventors: Fumiya Kobayashi, Sho Kumagai, Kazuhiro Ushita, Tadashi Onishi, Tomonori Ishigaki
  • Publication number: 20160281227
    Abstract: Provided is a susceptor capable of achieving improved thermal uniformity while suppressing reduction in its temperature increase rate and heat utilization efficiency. A susceptor includes a plate-shaped first member including a wafer placement surface on which to place a wafer, and a second member supporting the first member and laid on the first member in the direction perpendicular to the wafer placement surface. The thermal conductivity of the first member is higher than the thermal conductivity of the second member.
    Type: Application
    Filed: August 29, 2014
    Publication date: September 29, 2016
    Applicant: BRIDGESTONE CORPORATION
    Inventors: Fumiya KOBAYASHI, Sho KUMAGAI, Kazuhiro USHITA, Tadashi ONISHI, Tomonori ISHIGAKI
  • Publication number: 20120074404
    Abstract: Provided is a supporting substrate (30) to be bonded on a single crystalline wafer composed of a single crystalline body. The supporting substrate is provided with a silicon carbide polycrystalline substrate (10) composed of a silicon carbide polycrystalline body, and a coat layer (20) deposited on the silicon carbide polycrystalline substrate (10). The coat layer (20) is composed of silicon carbide or silicon and is in contact with the single crystalline wafer, and the arithmetic average roughness of the contact surface (22) of the coat layer (20) in contact with the single crystalline wafer is 1 nm or less.
    Type: Application
    Filed: March 19, 2010
    Publication date: March 29, 2012
    Applicant: BRIDGESTONE CORPORATION
    Inventor: Kazuhiro Ushita
  • Patent number: 6699411
    Abstract: It is an object of the present invention to provide a method for simply producing a high purity silicon carbide sintered body having no remaining metal silicon and excellent heat resistance. A method for producing a silicon carbide sintered body of the present invention comprises the steps of: preparing a slurry by dispersing silicon carbide powder in a solvent; forming a molded body by pouring the slurry into a mold and effecting calcination for the slurry in a vacuum atmosphere or in an inert gas atmosphere; and sealing pores within the calcined molded body by impregnating the pores with high purity metal silicon molten by heating, and allowing the high purity metal silicon and carbon contained in the molded body to react on each other in the pores so as to produce silicon carbide.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: March 2, 2004
    Assignee: Bridgestone Corporation
    Inventors: Fumio Odaka, Kazuhiro Ushita, Yoshitomo Takahashi
  • Patent number: 6632761
    Abstract: A silicon carbide powder which can increase the densities of a green body and a sintered silicon carbide, a method of producing a green body having a high density and excellent handling properties, and a method of producing a sintered silicon carbide having a high density, in which methods the silicon carbide powder is used. The silicon carbide powder includes at a particulate volume ratio of 20% to 80% a silicon carbide powder whose model ratio is 1.7 &mgr;m to 2.7 &mgr;m and a silicon carbide powder whose model ratio is 10.5 &mgr;m to 21.5 &mgr;m. The silicon carbide powder is used in the method of producing a green body and in the method of producing a sintered silicon carbide powder.
    Type: Grant
    Filed: August 15, 2000
    Date of Patent: October 14, 2003
    Assignee: Bridgestone Corporation
    Inventors: Kazuhiro Ushita, Fumio Odaka, Yoshitomo Takahashi
  • Publication number: 20020070485
    Abstract: It is an object of the present invention to provide a method for simply producing a high purity silicon carbide sintered body having no remaining metal silicon and excellent heat resistance. A method for producing a silicon carbide sintered body of the present invention comprises the steps of: preparing a slurry by dispersing silicon carbide powder in a solvent; forming a molded body by pouring the slurry into a mold and effecting calcination for the slurry in a vacuum atmosphere or in an inert gas atmosphere; and sealing pores within the calcined molded body by impregnating the pores with high purity metal silicon molten by heating, and allowing the high purity metal silicon and carbon contained in the molded body to react on each other in the pores so as to produce silicon carbide.
    Type: Application
    Filed: August 30, 2001
    Publication date: June 13, 2002
    Applicant: Bridgestone Corporation
    Inventors: Fumio Odaka, Kazuhiro Ushita, Yoshitomo Takahashi
  • Patent number: 6387834
    Abstract: A method for producing a sintered silicon carbide body which has excellent strength and the like and in which cracking and breaking are prevented is provided. In the method for producing a sintered silicon carbide body, metallic silicon is, in a vacuum atmosphere or in a non-oxidizing atmosphere, impregnated into a molded body containing silicon carbide and carbon so as to form an impregnated body, and the impregnated body is cooled in a state of being provided with a temperature distribution of 0.1-1.5° C./cm.
    Type: Grant
    Filed: May 26, 2000
    Date of Patent: May 14, 2002
    Assignee: Bridgestone Corporation
    Inventors: Fumio Odaka, Kazuhiro Ushita, Yoshitomo Takahashi