Patents by Inventor Kazuhisa Danno

Kazuhisa Danno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9696751
    Abstract: A substrate is provided with a transparent electrode in which the pattern is hardly visible even when the transparent electrode layer has been patterned, and a method for manufacturing thereof is provided. On at least one of the surfaces of a transparent film, a first, second, and third dielectric material layer, and a patterned transparent electrode layer are included, in this order, each preferably having a film thickness and refractive index within a specific range. The first and third dielectric material layers are silicon oxide layers containing SiOx and SiOv as main components, respectively. The second dielectric material layer is a metal oxide layer containing a metal oxide. The transparent electrode layer is a conductive metal oxide layer containing an indium-tin composite oxide as a main component. The refractive indexes of the first (n1), second (n2), and third (n3) dielectric material layers satisfy the relationship n3<n1<n2.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: July 4, 2017
    Assignee: KANEKA CORPORATION
    Inventors: Hiroaki Ueda, Kozo Kondo, Kazuhisa Danno
  • Publication number: 20150145816
    Abstract: A substrate is provided with a transparent electrode in which the pattern is hardly visible even when the transparent electrode layer has been patterned, and a method for manufacturing thereof is provided. On at least one of the surfaces of a transparent film, a first, second, and third dielectric material layer, and a patterned transparent electrode layer are included, in this order, each preferably having a film thickness and refractive index within a specific range. The first and third dielectric material layers are silicon oxide layers containing SiOx and SiOv as main components, respectively. The second dielectric material layer is a metal oxide layer containing a metal oxide. The transparent electrode layer is a conductive metal oxide layer containing an indium-tin composite oxide as a main component. The refractive indexes of the first (n1), second (n2), and third (n3) dielectric material layers satisfy the relationship n3<n1<n2.
    Type: Application
    Filed: January 29, 2013
    Publication date: May 28, 2015
    Inventors: Hiroaki Ueda, Kozo Kondo, Kazuhisa Danno
  • Patent number: 6266830
    Abstract: A bathing apparatus related to the present invention provided with an open portion in a bag having a content volume that allows a bather to enter in addition to being provided with hoses which supply and discharge a bathing liquid at suitable locations of a bathing bag that is provided with open/close portions in succession from the edge of the open portion which can maintain a water tight state when the open/close portions are closed. The bathing apparatus is characterized by the bathing bag and hoses connected using joints comprised by a joint portion disposed in one direction being linkable to a joint portion disposed in another direction which form a water passing state when linked together and when not linked together at least one of the joints being in a water non-passing state.
    Type: Grant
    Filed: March 4, 1999
    Date of Patent: July 31, 2001
    Assignee: Kaneka Corporation
    Inventors: Kazuhisa Danno, Kazuaki Kira, Hiroshi Matsumoto
  • Patent number: 5668247
    Abstract: The invention provides novel thermoplastic polyimide featuring solid adhesive property under low temperature, low hygroscopic coefficient, and solid resistivity to radioactive rays. The invention also provides novel polyamide acid which is substantially precursor of the thermoplastic polyimide, and also provides novel thermally fusible laminated film for covering conductive wires, featuring solid adhesive property under low temperature, solid resistivity to radioactive rays, and distinct suitability for covering superconductive wires in particular.The novel thermoplastic polyimide is represented by general formula (1) corresponding to the chemical structure shown below; ##STR1## wherein, Ar.sub.1, Ar.sub.2, Ar.sub.4, and Ar.sub.6, respectively designate divalent organic radical, whereas Ar.sub.3 and Ar.sub.
    Type: Grant
    Filed: December 16, 1993
    Date of Patent: September 16, 1997
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hiroyuki Furutani, Kazuhisa Danno, Yoshifumi Okamoto, Junya Ida, Yoshihide Oonari, Hitoshi Nojiri, Hirosaku Nagano
  • Patent number: 5621068
    Abstract: A thermoplastic polyimide film comprising a thermoplastic polyimide polymer, a polyimide laminate, respectively being suited for use as cover-lay adhesive agent and a cover-lay film capable of exerting distinguished thermal resistant property, processability and adhesion property useful for the manufacture of flexible printed circuit boards, and yet, suited for use as the adhesive-agent layers of flexible copper-coated laminates and bilateral adhesive sheets; and a method of manufacturing the polyimide laminate. The thermoplastic polyimide polymer represented by the general formula (1) specified below: ##STR1## wherein Ar.sub.1, Ar.sub.2, Ar.sub.4 and Ar.sub.6, represents divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 represent quadrivalent organic radical, wherein l, m amd n designate positive integer of 0 to 15, wherein the sum of 1 and m is 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.
    Type: Grant
    Filed: February 22, 1995
    Date of Patent: April 15, 1997
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisha
    Inventors: Yoshifumi Okamoto, Hiroyuki Furutani, Kazuhisa Danno, Junya Ida, Hirosaku Nagano