Patents by Inventor Kazuhisa Ikenoue

Kazuhisa Ikenoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device with USB terminal
    Patent number: 6932629
    Abstract: A device main body with a USB terminal and a cap including a housing space for housing at least the USB terminal are provided. The device main body and the cap are assembled so that they can be moved in an extending or compressing manner relative to each other by inserting at least the USB terminal to the housing space, or can be rotated relative to each other in an extended state without removing the cap from the device main body.
    Type: Grant
    Filed: November 4, 2004
    Date of Patent: August 23, 2005
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Kazuhisa Ikenoue
  • Device with USB terminal
    Publication number: 20050130469
    Abstract: A device main body with a USB terminal and a cap including a housing space for housing at least the USB terminal are provided. The device main body and the cap are assembled so that they can be moved in an extending or compressing manner relative to each other by inserting at least the USB terminal to the housing space, or can be rotated relative to each other in an extended state without removing the cap from the device main body.
    Type: Application
    Filed: November 4, 2004
    Publication date: June 16, 2005
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Kazuhisa Ikenoue
  • Semiconductor device and method for manufacturing the same
    Patent number: 5278101
    Abstract: A semiconductor device includes a first frame having a bed, a semiconductor chip mounted on the bed and having a bonding pad, a second frame having an inner lead located above the semiconductor chip, a bonding wire connecting the bonding pad of the semiconductor chip to the tip end of the inner lead, and a shock-absorbing layer which is adhered at least to that surface portion of the tip end of the inner lead which faces the semiconductor chip.
    Type: Grant
    Filed: June 26, 1992
    Date of Patent: January 11, 1994
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Kazuhisa Ikenoue