Abstract: An electromagnetic field generating coil included in plasma processing apparatus is realized with a balanced transmission line. Conductors constituting the balanced transmission line are disposed vertically above a wafer. A uniform electromagnetic field is generated in parallel with the wafer using the balanced transmission line. A gas inlet is formed above the balanced transmission line so that a gas will flow into the wafer after passing through the electromagnetic field generated around the balanced transmission line. The balanced transmission line may be formed spirally.

Abstract: An electromagnetic field generating coil included in plasma processing apparatus is realized with a balanced transmission line. Conductors constituting the balanced transmission line are disposed vertically above a wafer. A uniform electromagnetic field is generated in parallel with the wafer using the balanced transmission line. A gas inlet is formed above the balanced transmission line so that a gas will flow into the wafer after passing through the electromagnetic field generated around the balanced transmission line. The balanced transmission line may be formed spirally.

Abstract: A plurality of axially extending ribs are formed in the inner periphery of a valve body at its front end for slidably supporting the outer peripheral surface of the output shaft at its rear end. With this arrangement, any dimensional error which may occur in the region of the ribs can be suppressed small during the manufacturing of the valve body if a diameter shrinkage occurs in the inner periphery thereof. Accordingly, when the rear end of the output shaft is slidably fitted into the ribs, the output shaft is less likely to be askew with respect to the axis of the valve body. Accordingly, a biased abrasion of an annular seal member which is disposed between an opening formed in the front portion of a shell and the outer periphery of the output shaft at its front end to maintain a hermetic seal therebetween can be suppressed.

Abstract: A method of heat-processing semiconductor wafers comprising forming a purge tube which encloses the plural wafers by supporting a boat, on which the plural wafers are mounted, by a carrier arm to define a space on the upper side of the wafers while defining another space on the lower side of the wafers when the boat is to be loaded into and unloaded from a heat process furnace by the moving carrier arm or either when the boat is to be loaded into the heat process furnace or when it is to be unloaded from the heat process furnace, moving the carrier arm to communicate the purge tube with the heat process furnace, supplying nitrogen gas into both of the purge tube and the heat process furnace, keeping them connected to each other, pre-heating or cooling the wafers to a predetermined temperature range, and loading the purge tube into the heat process furnace or unloading the purge tube from the heat process furnace.