Abstract: A printed wiring board includes: a component mounting region; a plurality of electrode pads arranged at a peripheral edge portion of the component mounting region; a solder resist film that coats the component mounting region; and a plurality of solder bonding faces arranged at a region surrounded by the plurality of electrode pads. The solder resist film and the plurality of solder bonding faces form an island-shaped pattern such that the plurality of solder bonding faces are isolated with each other by the solder resist film.

Abstract: A mount structure having a substrate, a connector secured to the substrate, and a flexible printed wiring board electrically connected to the connector and spaced apart from the substrate. The flexible printed wiring board is positioned below the connector and separated from the connector by a distance greater than a thickness of the substrate.

Abstract: A mount structure having a substrate, a connector secured to the substrate, and a flexible printed wiring board electrically connected to the connector and spaced apart from the substrate. The flexible printed wiring board is positioned below the connector and separated from the connector by a distance greater than a thickness of the substrate.

Abstract: A mount structure having a substrate, a connector secured to the substrate, and a flexible printed wiring board electrically connected to the connector and spaced apart from the substrate. The flexible printed wiring board is opposed to the connector across the substrate or arranged in a space having a height generally equal to the thickness of the substrate.

Abstract: A mount structure having a substrate, a connector secured to the substrate, and a flexible printed wiring board electrically connected to the connector and spaced apart from the substrate. The flexible printed wiring board is opposed to the connector across the substrate or arranged in a space having a height generally equal to the thickness of the substrate.

Abstract: An optical molding apparatus is used for an optical molding method including the steps of radiating light onto a photocurable resin so as to cure the irradiated portion and laminating the cured objects. The apparatus comprises: a container provided with an aperture on a bottom surface or a side surface thereof; a base which is movably away from a surface of the aperture; a light radiation apparatus for radiating light into the container through the aperture; and a cured object holding plate which is freely mounted and dismounted from above the base. A movable base device for the optical molding apparatus comprises the base and an elevator erected on a peripheral edge of the container so as to lift and lower the base. The base is provided with a frame, one end thereof constituting a slide portion vertically moved along the elevator, a model holding plate removably mounted on the frame, frame supporting members with the base end sides thereof rotatably supported by the slide portion.

Abstract: A planetary gear type transmission designed to equalize the load on a plurality of planet gears meshed with a sun gear. The planetary gear type transmission includes an intermediate ring or annulus which is disposed between an outer ring gear in mesh with the planet gears and a low speed shaft or casing connected to the ring gear. Furthermore, the annulus is coupled to the ring gear and the low speed shaft or casing by means of flexible couplings, each of which comprises a plurality of flat springs.