Abstract: In a method of manufacturing a semiconductor device, an electrode layer is formed on a surface of a semiconductor substrate, and a resin insulation layer is formed on the surface of the semiconductor substrate so that the electrode layer can be covered with the resin insulation layer. A tapered hole is formed in the insulation layer by using a tool bit having a rake angle of zero or a negative value. The tapered hole has an opening defined by the insulation layer, a bottom defined by the electrode layer, and a side wall connecting the opening to the bottom.

Abstract: In a method of manufacturing a semiconductor device, an electrode layer is formed on a surface of a semiconductor substrate, and a resin insulation layer is formed on the surface of the semiconductor substrate so that the electrode layer can be covered with the resin insulation layer. A tapered hole is formed in the insulation layer by using a tool bit having a rake angle of zero or a negative value. The tapered hole has an opening defined by the insulation layer, a bottom defined by the electrode layer, and a side wall connecting the opening to the bottom.

Abstract: A seat apparatus for a vehicle includes a seat which is composed of a seat cushion and a seat back. A plurality of actuators are provided in the seat, for altering a bearing-surface configuration of the seat. The actuators are driven by an air compressor which is controlled by a controller in a predetermined pattern. The controller judges oscillation transmitted to a passenger seated on the seat, on the basis of a signal from an acceleration sensor, and regulates the predetermined pattern of the control, in accordance with the judged oscillation. The controller may be so arranged as to judge the oscillation transmitted to the passenger, on the basis of signals from a speed sensor and a road-surface-condition detecting sensor.