Abstract: An antenna includes a conductive patch. The patch includes, in a plan view, a first power feed-side edge and a first non-power feed-side edge positioned on opposite sides in a first direction in one-to-one relation, and a second power feed-side edge and a second non-power feed-side edge positioned on opposite sides in a second direction intersecting the first direction in one-to-one relation. The patch includes, in the plan view, a first power feed point positioned on a side nearer to the first power feed-side edge and a second power feed point positioned on a side nearer to the second power feed-side edge. In the plan view, at least a portion of the first power feed-side edge expands outward and forms a protrusion. A width of the protrusion in the second direction gradually decreases toward a top of the protrusion. The first power feed point is positioned nearer to the top of the protrusion than a middle of a hill slope of the protrusion in the first direction.

Abstract: A circular polarized array antenna includes an antenna layer and a ground layer. The antenna layer includes a plurality of antenna elements disposed at different positions in plan view. Each of the antenna elements is composed of a circular polarized antenna. The ground layer faces the antenna layer. The ground layer includes a plurality of ground patterns separated from each other. Each of the ground patterns faces one or more of the antenna elements.

Abstract: An antenna includes a first conductor. The first conductor includes a shaft-shaped part and a plurality of flange-shaped projecting parts projecting from the shaft-shaped part to directions crossing an axial direction of the shaft-shaped part.

Abstract: An antenna includes a first conductor. The first conductor includes a shaft-shaped part and a plurality of flange-shaped projecting parts projecting from the shaft-shaped part to directions crossing an axial direction of the shaft-shaped part.

Abstract: A waveguide structure of the present disclosure includes a first conductor layer, a plurality of dielectric strips which are formed so as to extend adjacently to one another on the upper surface of the first conductor layer, and a second conductor layer formed on the upper surface of the first conductor layer so as to cover the upper and side surfaces of the dielectric strips.

Abstract: A waveguide structure according to one embodiment includes an upper waveguide and a mode conversion portion. The upper waveguide internally transmits a high frequency signal in TE10 mode along a first direction. The mode conversion portion is configured to electromagnetically couple with the upper waveguide. The mode conversion portion converts the high frequency signal propagating through the upper waveguide from TE10 mode to TM11 mode. The mode conversion portion transmits the high frequency signal converted in a second direction perpendicular to the first direction. According to the waveguide structure pursuant to the embodiment, it is possible to attain excellent transmission characteristics of high frequency signals.

Abstract: A high-frequency module includes a high-frequency component including a high-frequency circuit, a conductor plate including a slot, a first conductive wire, and two second conductive wires. The high-frequency component includes a signal terminal and two reference potential terminals. The signal terminal is used for at least one of input and output of a high-frequency signal. The two reference potential terminals are connected to a reference potential. The first conductive wire is connected to the signal terminal in terms of high-frequency. The first conductive wire crosses over above the slot. The two second conductive wires are connected to the two reference potential terminals in terms of high-frequency. The two second conductive wires are so disposed along the first conductive wire and do not cross over the slot. The first conductive wire and the two second conductive wires form a pair and are electromagnetically coupled to the slot.

Abstract: A circuit board is provided. The circuit board includes a substrate, a waveguide line and a laminated waveguide. The waveguide line is at least partially positioned on a first surface of the substrate. The waveguide line transmits a high frequency signal. The laminated waveguide is formed inside the substrate. The laminated waveguide is electromagnetically coupled to the waveguide line, and has a lead-out portion led out from inside the substrate to a surface other than the first surface. The laminated waveguide includes a dielectric layer, a pair of main conductive layers and a through conductor group. The pair of main conductive layers sandwiches the dielectric layer in a thickness direction thereof. In the through conductor group, a plurality of through conductors are arranged along a high frequency signal transmitting direction. The plurality of through conductors electrically connect the pair of main conductive layers.

Abstract: A high-frequency module according to the present embodiment includes a substrate, a circuit board, and a resonator. The substrate has an input-output portion for high-frequency signals formed on one surface thereof. The circuit board includes a dielectric waveguide line with its end face exposed, and is placed on the one surface of the substrate such that a virtual plane extending beyond the end face is intersected by the one surface of the substrate. The resonator includes input-output end portions for high-frequency signals at ends thereof, in which one of the input-output end portions is connected to the end face of the dielectric waveguide line, and the other thereof is connected to the input-output portion of the substrate.

Abstract: A high-frequency module according to the present embodiment includes a substrate, a circuit board, and a waveguide. The substrate has an input-output portion for high-frequency signals on one surface thereof. The circuit board has a dielectric waveguide line with its end face exposed, and is placed on the one surface of the substrate such that a virtual plane extending beyond the end face is intersected by the one surface of the substrate. The waveguide has openings at ends thereof, in which one of the openings is connected to the end face of the dielectric waveguide line, and the other opening is connected to the input-output portion of the substrate.

Abstract: The invention relates to a direct-current blocking circuit, and a hybrid circuit device, a transmitter, a receiver, a transmitter-receiver and a radar device that have the direct-current blocking circuit. A dielectric substrate (2) is provided with a conductor layer (3) disposed parallel with the dielectric substrate (2), first and second planar lines (4, 5) each containing a part of the conductor layer (3), and a waveguide (6) containing a part of the conductor layer (3). The first and second planar lines (4, 5) are located on one surface (2a) side of the dielectric substrate (2) with respect to the conductor layer (3), and the waveguide (6) is located on another surface (2b) side of the dielectric substrate (2). In a transmission direction (X) of electric signals, as to the waveguide (6), its one end overlaps with one end of the first planar line (4), and its another end overlaps with one end of the second planar line (5).

Abstract: The invention relates to a high-frequency circuit board that can efficiently radiate heat generated in a mounted electronic component without reducing the degree of freedom in design, a high-frequency circuit module including the high-frequency circuit board, and a radar apparatus including the high-frequency circuit module. A dielectric substrate (3) includes a mounting portion (4) that is disposed on one surface (3a) of the dielectric substrate (3) and on which an electronic component (2) is to be mounted, and a waveguide (5) that is formed in the dielectric substrate (3). The mounting portion (4) and the waveguide (5) are connected with each other through a heat conductor (6) having a thermal conductivity higher than that of the dielectric substrate (3).

Abstract: The invention relates to a high-frequency transmission line connection structure, a circuit board having the connection structure, a high-frequency module having the circuit board, and a radar apparatus. A first laminated waveguide sub-line part (21) includes a pair of main conductor layers that oppose each other in a thickness direction with a dielectric layer (31) having the same thickness as a dielectric layer (31) of a microstrip line (1) interposed therebetween. A second laminated waveguide sub-line part (22) includes dielectric layers (31, 32) thicker than the dielectric layer of the first laminated waveguide sub-line part (21). A laminated waveguide main-line part (23) includes dielectric layers (31, 32, 33) thicker than the dielectric layers of the second laminated waveguide sub-line part (22). A conversion part (10) connected to the microstrip line (1) is formed by integrating with an upper main conductor layer constituting the respective line parts.

Abstract: A waveguide structure according to one embodiment includes an upper waveguide and a mode conversion portion. The upper waveguide internally transmits a high frequency signal in TE10 mode along a first direction. The mode conversion portion is configured to electromagnetically couple with the upper waveguide. The mode conversion portion converts the high frequency signal propagating through the upper waveguide from TE10 mode to TM11 mode. The mode conversion portion transmits the high frequency signal converted in a second direction perpendicular to the first direction. According to the waveguide structure pursuant to the embodiment, it is possible to attain excellent transmission characteristics of high frequency signals.

Abstract: A circuit board is provided. The circuit board includes a substrate, a waveguide line and a laminated waveguide. The waveguide line is at least partially positioned on a first surface of the substrate. The waveguide line transmits a high frequency signal. The laminated waveguide is formed inside the substrate. The laminated waveguide is electromagnetically coupled to the waveguide line, and has a lead-out portion led out from inside the substrate to a surface other than the first surface. The laminated waveguide includes a dielectric layer, a pair of main conductive layers and a through conductor group. The pair of main conductive layers sandwiches the dielectric layer in a thickness direction thereof. In the through conductor group, a plurality of through conductors are arranged along a high frequency signal transmitting direction. The plurality of through conductors electrically connect the pair of main conductive layers.

Abstract: A high-frequency module according to the present embodiment includes a substrate, a circuit board, and a waveguide. The substrate has an input-output portion for high-frequency signals on one surface thereof. The circuit board has a dielectric waveguide line with its end face exposed, and is placed on the one surface of the substrate such that a virtual plane extending beyond the end face is intersected by the one surface of the substrate. The waveguide has openings at ends thereof, in which one of the openings is connected to the end face of the dielectric waveguide line, and the other opening is connected to the input-output portion of the substrate.

Abstract: A high-frequency module according to the present embodiment includes a substrate, a circuit board, and a resonator. The substrate has an input-output portion for high-frequency signals formed on one surface thereof. The circuit board includes a dielectric waveguide line with its end face exposed, and is placed on the one surface of the substrate such that a virtual plane extending beyond the end face is intersected by the one surface of the substrate. The resonator includes input-output end portions for high-frequency signals at ends thereof, in which one of the input-output end portions is connected to the end face of the dielectric waveguide line, and the other thereof is connected to the input-output portion of the substrate.

Abstract: The invention relates to a high-frequency transmission line connection structure, a circuit board having the connection structure, a high-frequency module having the circuit board, and a radar apparatus. A first laminated waveguide sub-line part (21) includes a pair of main conductor layers that oppose each other in a thickness direction with a dielectric layer (31) having the same thickness as a dielectric layer (31) of a microstrip line (1) interposed therebetween. A second laminated waveguide sub-line part (22) includes dielectric layers (31, 32) thicker than the dielectric layer of the first laminated waveguide sub-line part (21). A laminated waveguide main-line part (23) includes dielectric layers (31, 32, 33) thicker than the dielectric layers of the second laminated waveguide sub-line part (22). A conversion part (10) connected to the microstrip line (1) is formed by integrating with an upper main conductor layer constituting the respective line parts.

Abstract: The invention relates to a direct-current blocking circuit, and a hybrid circuit device, a transmitter, a receiver, a transmitter-receiver and a radar device that have the direct-current blocking circuit. A dielectric substrate (2) is provided with a conductor layer (3) disposed parallel with the dielectric substrate (2), first and second planar lines (4, 5) each containing a part of the conductor layer (3), and a waveguide (6) containing a part of the conductor layer (3). The first and second planar lines (4, 5) are located on one surface (2a) side of the dielectric substrate (2) with respect to the conductor layer (3), and the waveguide (6) is located on another surface (2b) side of the dielectric substrate (2). In a transmission direction (X) of electric signals, as to the waveguide (6), its one end overlaps with one end of the first planar line (4), and its another end overlaps with one end of the second planar line (5).

Abstract: The invention relates to a high-frequency circuit board that can efficiently radiate heat generated in a mounted electronic component without reducing the degree of freedom in design, a high-frequency circuit module including the high-frequency circuit board, and a radar apparatus including the high-frequency circuit module. A dielectric substrate (3) includes a mounting portion (4) that is disposed on one surface (3a) of the dielectric substrate (3) and on which an electronic component (2) is to be mounted, and a waveguide (5) that is formed in the dielectric substrate (3). The mounting portion (4) and the waveguide (5) are connected with each other through a heat conductor (6) having a thermal conductivity higher than that of the dielectric substrate (3).