Patents by Inventor Kazuki Koga

Kazuki Koga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090123717
    Abstract: An FRP is produced using a prepreg comprising reinforcing fiber, a sheet-like reinforcing fiber substrate containing reinforcing fiber, and a matrix resin, wherein the matrix resin is impregnated into the sheet-like reinforcing fiber substrate and also covers one surface of the sheet-like reinforcing fiber substrate, and the matrix resin impregnation ratio is within a range of 35% to 95%; a prepreg comprising reinforcing fiber, a sheet-like reinforcing fiber substrate containing reinforcing fiber, and a matrix resin, wherein the matrix resin exists on both surfaces of the sheet-like reinforcing fiber substrate, and the portion inside the sheet-like reinforcing fiber substrate into which the matrix resin has not been impregnated is continuous; or a prepreg comprising reinforcing fiber, a sheet-like reinforcing fiber substrate containing reinforcing fiber, and a matrix resin, wherein at least one surface exhibits a sea-and-island-type pattern comprising resin-impregnated portions (island portions) where the mat
    Type: Application
    Filed: October 2, 2008
    Publication date: May 14, 2009
    Applicant: Mitsubishi Rayon co., Ltd.
    Inventors: Kazuya Goto, Kazuki Koga, Tadayoshi Saitou, Akihiro Ito, Tsuneo Takano, Kouki Wakabayashi
  • Publication number: 20080187718
    Abstract: An epoxy resin composition suitably used for a prepreg which can complete curing in a short time even at a low temperature and secure a sufficient usable period under preservation at room temperature, in comparison with conventional epoxy resin compositions. An epoxy resin composition comprising at least one of an epoxy resin, an amine compound having at least one sulfur atom in the molecule thereof, and a reaction product of an epoxy resin and an amine compound having at least one sulfur atom in the molecule thereof, and an amine compound having at least one sulfur atom in the molecule thereof, and a urea compound and a dicyandiamide, wherein each of the contents of the sulfur atom and the urea compound in the epoxy resin composition is respectively 0.2 to 7% by mass and 1 to 15% by mass.
    Type: Application
    Filed: March 27, 2008
    Publication date: August 7, 2008
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Tsuneo Takano, Akitada Yanase, Tadashi Sakai, Kiharu Numata, Akihiro Ito, Masato Taguchi, Junichi Muramatsu, Kazuya Goto, Kazuki Koga
  • Publication number: 20080185753
    Abstract: An epoxy resin composition suitably used for a prepreg which can complete curing in a short time even at a low temperature and secure a sufficient usable period under preservation at room temperature, in comparison with conventional epoxy resin compositions. An epoxy resin composition comprising at least one of an epoxy resin, an amine compound having at least one sulfur atom in the molecule thereof, and a reaction product of an epoxy resin and an amine compound having at least one sulfur atom in the molecule thereof, and an amine compound having at least one sulfur atom in the molecule thereof, and a urea compound and a dicyandiamide, wherein each of the contents of the sulfur atom and the urea compound in the epoxy resin composition is respectively 0.2 to 7% by mass and 1 to 15% by mass.
    Type: Application
    Filed: March 27, 2008
    Publication date: August 7, 2008
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Tsuneo Takano, Akitada Yanase, Tadashi Sakai, Kiharu Numata, Akihiro Ito, Masato Taguchi, Junichi Muramatsu, Kazuya Goto, Kazuki Koga
  • Publication number: 20080185757
    Abstract: An epoxy resin composition suitably used for a prepreg which can complete curing in a short time even at a low temperature and secure a sufficient usable period under preservation at room temperature, in comparison with conventional epoxy resin compositions. An epoxy resin composition comprising at least one of an epoxy resin, an amine compound having at least one sulfur atom in the molecule thereof, and a reaction product of an epoxy resin and an amine compound having at least one sulfur atom in the molecule thereof, and an amine compound having at least one sulfur atom in the molecule thereof, and a urea compound and a dicyandiamide, wherein each of the contents of the sulfur atom and the urea compound in the epoxy resin composition is respectively 0.2 to 7% by mass and 1 to 15% by mass.
    Type: Application
    Filed: March 27, 2008
    Publication date: August 7, 2008
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Tsuneo Takano, Akitada Yanase, Tadashi Sakai, Kiharu Numata, Akihiro Ito, Masato Taguchi, Junichi Muramatsu, Kazuya Goto, Kazuki Koga
  • Publication number: 20060035548
    Abstract: An FRP is produced using a prepreg comprising reinforcing fiber, a sheet-like reinforcing fiber substrate containing reinforcing fiber, and a matrix resin, wherein the matrix resin is impregnated into the sheet-like reinforcing fiber substrate and also covers one surface of the sheet-like reinforcing fiber substrate, and the matrix resin impregnation ratio is within a range of 35% to 95%; a prepreg comprising reinforcing fiber, a sheet-like reinforcing fiber substrate containing reinforcing fiber, and a matrix resin, wherein the matrix resin exists on both surfaces of the sheet-like reinforcing fiber substrate, and the portion inside the sheet-like reinforcing fiber substrate into which the matrix resin has not been impregnated is continuous; or a prepreg comprising reinforcing fiber, a sheet-like reinforcing fiber substrate containing reinforcing fiber, and a matrix resin, wherein at least one surface exhibits a sea-and-island-type pattern comprising resin-impregnated portions (island portions) where the mat
    Type: Application
    Filed: July 18, 2003
    Publication date: February 16, 2006
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Kazuya Goto, Kazuki Koga, Tadayoshi Saitou, Akihiro Ito, Tsuneo Takano, Kouki Wakabayashi
  • Publication number: 20060035088
    Abstract: An epoxy resin composition suitably used for a prepreg which can complete curing in a short time even at a low temperature and secure a sufficient usable period under preservation at room temperature, in comparison with conventional epoxy resin compositions. An epoxy resin composition comprising at least one of an epoxy resin, an amine compound having at least one sulfur atom in the molecule thereof, and a reaction product of an epoxy resin and an amine compound having at least one sulfur atom in the molecule thereof, and an amine compound having at least one sulfur atom in the molecule thereof, and a urea compound and a dicyandiamide, wherein each of the contents of the sulfur atom and the urea compound in the epoxy resin composition is respectively 0.2 to 7% by mass and 1 to 15% by mass.
    Type: Application
    Filed: November 28, 2003
    Publication date: February 16, 2006
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Tsuneo Takano, Akitada Yanase, Tadashi Sakal, Kiharu Numata, Akihiro Ito, Masato Taguchi, Junichi Muramatsu, Kazuya Goto, Kazuki Koga