Abstract: A pressure-sensitive adhesive tape of the present invention includes thermally expandable microspheres, wherein the thermally expandable microspheres are each formed of a shell and a volatile substance contained in the shell, and wherein the shell is formed of a resin having a glass transition temperature (Tg) of 120° C. or more. In one embodiment, the resin for forming the shell contains a constituent unit having a carboxyl group.

Abstract: The present invention provides a heat-resistant pressure-sensitive adhesive tape for the production of a semiconductor device, including a base material layer and a pressure-sensitive adhesive layer formed on each side of the base material layer, in which at least the pressure-sensitive adhesive layer at a side on which a semiconductor chip is to be encapsulated with a resin contains a silicone pressure-sensitive adhesive. The heat-resistant pressure-sensitive adhesive tape is used for temporarily fixing a chip in a method for producing a substrateless semiconductor package which does not use a metal lead frame.

Abstract: The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive and a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the heat-expandable pressure-sensitive adhesive layer has a glass transition temperature of ?40° C. to 30° C.

Abstract: In the production process of electronic parts, the static electricity generated when peeling a pressure-sensitive adhesive tape has interfered with the performance of the electronic parts. This problem has been solved by a pressure-sensitive adhesive tape for temporary fixing of electronic parts of the present invention including at least a supporting substrate film and a thermally expandable pressure-sensitive adhesive layer provided on one side of the substrate, wherein the thermally expandable pressure-sensitive adhesive layer contains thermally expandable microspheres and an ionic liquid; the content of the ionic liquid is 0.01 to 10 parts by weight based on 100 parts by weight of a polymer contained in the thermally expandable pressure-sensitive adhesive layer; the surface resistance of the thermally expandable pressure-sensitive adhesive layer is 1.0×1013 ?/? or less; and the ratio of the surface resistance after heating for foaming to that before the heating is 5.0 or less.

Abstract: The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive and a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the heat-expandable pressure-sensitive adhesive layer has a glass transition temperature of ?40° C. to 30° C.

Abstract: A front core for a magnetic erase head is produced by a method that includes forming a pair of elongate magnetic bars by sintering such that they can be combined with a gap therebetween, holding the magnetic bars with a predetermined space to form a recess and a gap groove, pouring a resin into the recess and the gap groove to join the magnetic bars, and grinding the magnetic bars joined to each other. This allows the recess and the gap groove to be formed through no cutting process, thus contributing to reduction in time required for the process and to decrease in consumption of grindstone for cost reduction.