Patents by Inventor Kazuma Kuroki
Kazuma Kuroki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9421645Abstract: A solder joint material includes a Zn-based metal material including mainly of Zn, an Al-based metal material including mainly of Al and provided on the Zn-based metal material, a Cu-based metal material including mainly of Cu and provided on the Al-based metal material, and a surface-treated layer provided on the Cu-based metal material and including an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper.Type: GrantFiled: September 25, 2014Date of Patent: August 23, 2016Assignee: Hitachi Metals, Ltd.Inventors: Yuichi Oda, Hideyuki Sagawa, Kazuma Kuroki, Hiromitsu Kuroda, Kotaro Tanaka, Hiroaki Numata
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Patent number: 9393645Abstract: The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer (101), Al-based metallic layers (102a, 102b) on both sides thereof, and X-based metallic layers (103a, 103b) (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (102a, 102b), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.Type: GrantFiled: July 28, 2011Date of Patent: July 19, 2016Assignee: Hitachi Metals, Ltd.Inventors: Takuto Yamaguchi, Masahide Okamoto, Osamu Ikeda, Hiromitsu Kuroda, Kazuma Kuroki, Shohei Hata, Yuichi Oda
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Patent number: 9255311Abstract: A copper alloy conductor has a copper alloy material which has a copper parent material with 0.001 to 0.1 wt % (=10 to 1000 wt·ppm) of oxygen and 0.15 to 0.70 wt % (exclusive of 0.15 wt %) of Sn. A crystalline grain to form a crystalline structure of the copper alloy material has an average diameter of 100 ?m or less, and 80% or more of an oxide of the Sn is dispersed in a matrix of the crystalline structure as a fine oxide grain with an average diameter of 1 ?m or less.Type: GrantFiled: January 10, 2006Date of Patent: February 9, 2016Assignee: Hitachi Metals, Ltd.Inventors: Hiromitsu Kuroda, Kazuma Kuroki, Seigi Aoyama, Hiroyoshi Hiruta
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Publication number: 20150239070Abstract: A joining material includes a composite material including a first metal material having a thermal expansion coefficient of not more than 5, and a second metal material formed on the first metal material, the second metal material having a thermal expansion coefficient higher than the first metal material, and a solder material formed on the composite material. The solder material includes a lead-free solder having a melting point of not less than 260 degrees C., and a laminated structure configured such that a Zn based metal material including Zn as a main component, a first Al based metal material including Al as a main component, and a first X based metal material including Cu, Au, Ag or Sn as a main component are laminated in the order starting from the composite material.Type: ApplicationFiled: July 24, 2014Publication date: August 27, 2015Inventors: Kazuma Kuroki, Yuichi Oda, Hiromitsu Kuroda
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Publication number: 20150151385Abstract: A solder joint material includes a Zn-based metal material including mainly of Zn, an Al-based metal material including mainly of Al and provided on the Zn-based metal material, a Cu-based metal material including mainly of Cu and provided on the Al-based metal material, and a surface-treated layer provided on the Cu-based metal material and including an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper.Type: ApplicationFiled: September 25, 2014Publication date: June 4, 2015Inventors: Yuichi ODA, Hideyuki SAGAWA, Kazuma KUROKI, Hiromitsu KURODA, Kotaro TANAKA, Hiroaki NUMATA
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Publication number: 20140283506Abstract: A heat pipe includes a metal cylindrical body including a sealed storage space for storing water, a heat absorbing portion at one end portion of the cylindrical body to absorb heat by means of evaporation of the water, and a heat radiating portion at another end portion of the cylindrical body to radiate heat by means of condensation of steam generated by the evaporation. The cylindrical body includes a base material mainly including a stainless steel, a first metal layer mainly including a nickel and a second metal layer mainly including a copper, the first metal layer being formed on an inner surface of the base material and the second metal layer being formed on an inner surface of the first metal layer. The second metal layer is exposed to the storage space.Type: ApplicationFiled: January 24, 2014Publication date: September 25, 2014Applicant: Hitachi Metals, Ltd.Inventors: Kazuma KUROKI, Hideyuki SAGAWA, Hiromitsu KURODA, Yukio SUZUKI
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Patent number: 8771839Abstract: A composite material includes a clad material including a base material that includes an iron-chromium alloy and vibration-damping layers that are provided on both surfaces of the base material and include a metal to suppress a vibration. A total thickness of the vibration-damping layers provided on the both surfaces of the base material is in a range of not less than 10% and not more than 40% relative to a total thickness of the clad material.Type: GrantFiled: January 16, 2013Date of Patent: July 8, 2014Assignee: Hitachi Metals, Ltd.Inventors: Kazuma Kuroki, Hiromitsu Kuroda, Tetsuya Tokumitsu
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Patent number: 8691395Abstract: A composite material for brazing having features of: forming a homogenous distribution of components in the brazing filler material even after brazing; having an excellent workability; offering low manufacturing costs; and having satisfactory corrosion resistivity as desired. The composite material for brazing has a lamination of a brazing filler material layer thereon, wherein the brazing filler material layer is a layer of alloy that includes copper, aluminum, and nickel.Type: GrantFiled: January 21, 2009Date of Patent: April 8, 2014Assignee: Hitachi Cable, Ltd.Inventors: Hideyuki Sagawa, Kazuma Kuroki, Hiromitsu Kuroda
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Patent number: 8669652Abstract: To provide an inexpensive lead component which can be easily connected to a semiconductor chip and which has satisfactory connectability. There is provided a lead component including a base material having a connection part for connecting to a semiconductor chip, comprising: a solder part having a Zn layer made of a Zn-bonding material rolled and clad-bonded on the base material, and an Al layer made of an Al-bonding material rolled and clad-bonded on the Zn layer, in a prescribed region including the connection part on the base material; and the solder part further comprising a metal thin film composed of one kind or two kinds or more of Au, Ag, Cu, Ni, Pd, and Pt covering a surface of the Al layer.Type: GrantFiled: March 15, 2012Date of Patent: March 11, 2014Assignee: Hitachi Cable, Ltd.Inventors: Shohei Hata, Yuichi Oda, Kazuma Kuroki, Hiromitsu Kuroda
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Publication number: 20130256390Abstract: The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer (101), Al-based metallic layers (102a, 102b) on both sides thereof, and X-based metallic layers (103a, 103b) (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (102a, 102b), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.Type: ApplicationFiled: July 28, 2011Publication date: October 3, 2013Applicant: Hitachi Cable, Ltd.Inventors: Takuto Yamaguchi, Masahide Okamoto, Osamu Ikeda, Hiromitsu Kuroda, Kazuma Kuroki, Shohei Hata, Yuichi Oda
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Publication number: 20130236741Abstract: A vibration-damping composite material includes a clad material that includes a base material includes a zinc-aluminum alloy and metal layers each including a ferritic stainless steel on both surfaces of the base material. A total thickness of the metal layers is not less than 40% and not more than 80% of the thickness of the clad material.Type: ApplicationFiled: March 5, 2013Publication date: September 12, 2013Applicant: HITACHI CABLE, LTD.Inventors: Kazuma KUROKI, Hiromitsu KURODA
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Publication number: 20120248592Abstract: To provide an inexpensive lead component which can be easily connected to a semiconductor chip and which has satisfactory connectability. There is provided a lead component including a base material having a connection part for connecting to a semiconductor chip, comprising: a solder part having a Zn layer made of a Zn-bonding material rolled and clad-bonded on the base material, and an Al layer made of an Al-bonding material rolled and clad-bonded on the Zn layer, in a prescribed region including the connection part on the base material; and the solder part further comprising a metal thin film composed of one kind or two kinds or more of Au, Ag, Cu, Ni, Pd, and Pt covering a surface of the Al layer.Type: ApplicationFiled: March 15, 2012Publication date: October 4, 2012Applicant: Hitachi Cable, Ltd.Inventors: Shohei HATA, Yuichi Oda, Kazuma Kuroki, Hiromitsu Kuroda
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Publication number: 20090186239Abstract: A composite material for brazing having features of: forming a homogenous distribution of components in the brazing filler material even after brazing; having an excellent workability; offering low manufacturing costs; and having satisfactory corrosion resistivity as desired. The composite material for brazing has a lamination of a brazing filler material layer thereon, wherein the brazing filler material layer is a layer of alloy that includes copper, aluminum, and nickel.Type: ApplicationFiled: January 21, 2009Publication date: July 23, 2009Inventors: Hideyuki SAGAWA, Kazuma Kuroki, Hiromitsu Kuroda
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Patent number: 7442445Abstract: A brazing clad material is a composite material that comprises a base material and a brazing material layer formed integrally on the base material. The brazing material layer has a Ni or Ni alloy layer, a Ti or Ti alloy layer and a Fe—Ni alloy layer that are sequentially stacked in this order on the base material. The brazing material layer has a Fe concentration of 25 to 40 wt % in the entire brazing material layer. The brazing material layer satisfies a ratio of W1/W2 to be 0.56 to 0.66, where W1 is a weight of Ni contained in the entire brazing material layer and W2 is a total weight of Ni and Ti contained in the entire brazing material layer.Type: GrantFiled: December 23, 2005Date of Patent: October 28, 2008Assignee: Hitachi Cable, Ltd.Inventors: Hideyuki Sagawa, Hiromitsu Kuroda, Kazuma Kuroki, Humio Horii, Tetsuya Tokumitu, Nobuhito Sakuyama, Shigeru Okamoto
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Publication number: 20060166028Abstract: A brazing clad material is a composite material that comprises a base material and a brazing material layer formed integrally on the base material. The brazing material layer has a Ni or Ni alloy layer, a Ti or Ti alloy layer and a Fe—Ni alloy layer that are sequentially stacked in this order on the base material. The brazing material layer has a Fe concentration of 25 to 40 wt % in the entire brazing material layer. The brazing material layer satisfies a ratio of W1/W2 to be 0.56 to 0.66, where W1 is a weight of Ni contained in the entire brazing material layer and W2 is a total weight of Ni and Ti contained in the entire brazing material layer.Type: ApplicationFiled: December 23, 2005Publication date: July 27, 2006Inventors: Hideyuki Sagawa, Hiromitsu Kuroda, Kazuma Kuroki, Humio Horii, Tetsuya Tokumitu, Nobuhito Sakuyama, Shigeru Okamoto
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Publication number: 20060157167Abstract: A copper alloy conductor has a copper alloy material which has a copper parent material with 0.001 to 0.1 wt % (=10 to 1000 wt.ppm) of oxygen and 0.15 to 0.70 wt % (exclusive of 0.15 wt %) of Sn. A crystalline grain to form a crystalline structure of the copper alloy material has an average diameter of 100 ?m or less, and 80% or more of an oxide of the Sn is dispersed in a matrix of the crystalline structure as a fine oxide grain with an average diameter of 1 ?m or less.Type: ApplicationFiled: January 10, 2006Publication date: July 20, 2006Applicant: Hitachi Cable, Ltd.Inventors: Hiromitsu Kuroda, Kazuma Kuroki, Seigi Aoyama, Hiroyoshi Hiruta
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Publication number: 20050260437Abstract: A composite material for brazing has a brazing layer provided on a surface of a base metal. The brazing layer satisfies a requirement represented by formula: W1/W2=0.58 to 0.68 wherein W1 represents the weight of an Ni (nickel) ingredient contained in the brazing layer; and W2 represents the total weight of the Ni ingredient and a Ti (titanium) ingredient contained in the brazing layer.Type: ApplicationFiled: May 20, 2005Publication date: November 24, 2005Applicant: Hitachi Cable, Ltd.Inventors: Kazuma Kuroki, Hiromitsu Kuroda, Hideyuki Sagawa, Sumio Shirai