Abstract: A cover structure of an internal combustion engine of a motorcycle includes an engine that is mounted on a motorcycle and includes a cooling device for cooling the engine. The cover structure includes a sprocket cover portion that covers from the width direction of the vehicle. The cover structure also includes a pipe cover portion that covers from the width direction of vehicle a discharge side hose and an intake side hose of the cooling device. The cover structure further includes a side surface cover that includes a joining portion which is vertically arranged from the sprocket cover portion towards the pipe cover portion so as to be in parallel with the discharge side hose. The intake side hose is arranged side by side in the width direction of the vehicle and integrally joins the sprocket cover portion with the pipe cover portion.

Abstract: A wafer polishing method, in which the outer circumferential edge of a polishing member is first cut by a cutting tool fixed to a table base, thereby forming the polishing member into a completely round shape and also positioning the polishing member in a Y direction at a Y-directional reference position of the table base. Thereafter, a polishing unit is once lifted in the condition where the table base remains still at the reference position. Thereafter, the table base is horizontally moved toward a column in the Y direction to thereby position the polishing member in the Y direction so that only a peripheral portion of the wafer is polished by the polishing member. At this time, the horizontal travel of the table base is preliminarily obtained from the Y-directional positional relation between the cutting tool and the wafer held on a chuck table and from the width of the peripheral portion to be polished.

Abstract: A wafer polishing method, in which the outer circumferential edge of a polishing member is first cut by a cutting tool fixed to a table base, thereby forming the polishing member into a completely round shape and also positioning the polishing member in a Y direction at a Y-directional reference position of the table base. Thereafter, a polishing unit is once lifted in the condition where the table base remains still at the reference position. Thereafter, the table base is horizontally moved toward a column in the Y direction to thereby position the polishing member in the Y direction so that only a peripheral portion of the wafer is polished by the polishing member. At this time, the horizontal travel of the table base is preliminarily obtained from the Y-directional positional relation between the cutting tool and the wafer held on a chuck table and from the width of the peripheral portion to be polished.

Abstract: A screen-printing plate is provided with a plurality of printing patterns disposed in a single plate frame. Each printing pattern is formed with a plurality of mesh holes. At least two different aperture ratios of the mesh holes forming the printing patterns are provided according to the positions of regions on the screen-printing plate in which the printing patterns are disposed. The aperture ratio of the mesh holes forming the printing patterns positioned in a region close to the periphery of the plate frame is set higher than the aperture ratio of the mesh holes forming the printing patterns positioned in a central region of the plate frame.

Abstract: A screen-printing plate is provided with a plurality of printing patterns disposed in a single plate frame. Each printing pattern is formed with a plurality of mesh holes. At least two different aperture ratios of the mesh holes forming the printing patterns are provided according to the positions of regions on the screen-printing plate in which the printing patterns are disposed. The aperture ratio of the mesh holes forming the printing patterns positioned in a region close to the periphery of the plate frame is set higher than the aperture ratio of the mesh holes forming the printing patterns positioned in a central region of the plate frame.

Abstract: A plating apparatus (11) includes a plating solution container (13) storing a plating solution (14) and a cathode (18) dipped therein, for plating objects which are placed on the cathode (18) by driving an air cylinder (22) for applying vibration to the cathode (18) while making a stopper (24) collide with a forward end (21a) of a coupling member (21) which is coupled to the air cylinder (22) and the cathode (18) thereby applying an impact to the cathode (18).