Patents by Inventor Kazuma YAMAWAKI
Kazuma YAMAWAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11959979Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.Type: GrantFiled: March 8, 2023Date of Patent: April 16, 2024Assignee: TDK CORPORATIONInventors: Kunihiro Ueda, Yoshimitsu Wada, Hiraku Hirabayashi, Kazuma Yamawaki, Tsuyoshi Umehara
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Patent number: 11946989Abstract: A magnetic sensor device includes at least one magnetic sensor and a support. A center of gravity of an element layout area of the at least one magnetic sensor is deviated from a center of gravity of a reference plane of the support. The at least one magnetic sensor includes four resistor sections constituted by a plurality of magnetoresistive elements. Magnetization of a free layer in each of two of the resistor sections includes a component in a third magnetization direction. The magnetization of a free layer in each of the other two resistor sections includes a component in a fourth magnetization direction opposite to the third magnetization direction.Type: GrantFiled: May 16, 2023Date of Patent: April 2, 2024Assignee: TDK CORPORATIONInventors: Norikazu Ota, Hiraku Hirabayashi, Kazuma Yamawaki, Shuhei Miyazaki, Kazuya Watanabe
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Publication number: 20240085499Abstract: A magnetic sensor device includes a stacked structure including a sensor substrate and a sensor element circuitry. The sensor substrate has a surface and a perimeter. The sensor element circuitry is provided on the surface of the sensor substrate, has a perimeter, and includes one or more magnetic sensor elements. As viewed in a plane parallel to the surface, a portion or all of the perimeter of the sensor element circuitry is located at a position different from a position of the perimeter of the sensor substrate.Type: ApplicationFiled: August 11, 2023Publication date: March 14, 2024Applicant: TDK CORPORATIONInventors: Kazuma YAMAWAKI, Shuhei MIYAZAKI
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Publication number: 20240019505Abstract: A magnetic sensor device includes a sensor substrate and a sensor element circuitry. The sensor substrate has a surface. The sensor element circuitry is provided on the surface of the sensor substrate and includes one or more magnetic sensor elements. As viewed in a plane parallel to the surface, the sensor substrate has a perimeter that is substantially octagonal. The perimeter includes two short sides opposed to each other, two long sides opposed to each other, and four corners. The four corners are each chamfered entirely or partially in a thickness direction that is substantially orthogonal to the surface. A ratio of a length of each of the four corners along each of the two long sides of the sensor substrate to a length of each of the two long sides of the sensor substrate is less than or equal to 0.39.Type: ApplicationFiled: June 29, 2023Publication date: January 18, 2024Applicant: TDK CORPORATIONInventors: Kazuma YAMAWAKI, Shuhei MIYAZAKI
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Publication number: 20230402352Abstract: A lead frame includes a die pad, a plurality of leads, and a frame member. The frame member includes a first connection bar extending in a first direction and a second connection bar extending in a second direction. The die pad is connected to the second connection bar. The plurality of leads include a plurality of first leads connected to the first connection bar and a plurality of second leads connected to the second connection bar. The number of the plurality of second leads is smaller than the number of the plurality of first leads. Each of the plurality of second leads is connected to one corresponding first lead of the plurality of first leads.Type: ApplicationFiled: May 17, 2023Publication date: December 14, 2023Applicant: TDK CORPORATIONInventors: Kazuma YAMAWAKI, Hiraku HIRABAYASHI
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Publication number: 20230280420Abstract: A magnetic sensor device includes at least one magnetic sensor and a support. A center of gravity of an element layout area of the at least one magnetic sensor is deviated from a center of gravity of a reference plane of the support. The at least one magnetic sensor includes four resistor sections constituted by a plurality of magnetoresistive elements. Magnetization of a free layer in each of two of the resistor sections includes a component in a third magnetization direction. The magnetization of a free layer in each of the other two resistor sections includes a component in a fourth magnetization direction opposite to the third magnetization direction.Type: ApplicationFiled: May 16, 2023Publication date: September 7, 2023Applicant: TDK CORPORATIONInventors: Norikazu OTA, Hiraku HIRABAYASHI, Kazuma YAMAWAKI, Shuhei MIYAZAKI, Kazuya WATANABE
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Publication number: 20230251331Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.Type: ApplicationFiled: March 8, 2023Publication date: August 10, 2023Applicant: TDK CorporationInventors: Kunihiro Ueda, Yoshimitsu Wada, Hiraku Hirabayashi, Kazuma Yamawaki, Tsuyoshi Umehara
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Patent number: 11686788Abstract: A magnetic sensor device includes at least one magnetic sensor and a support. A center of gravity of an element layout area of the at least one magnetic sensor is deviated from a center of gravity of a reference plane of the support. The at least one magnetic sensor includes four resistor sections constituted by a plurality of magnetoresistive elements. Magnetization of a free layer in each of two of the resistor sections includes a component in a third magnetization direction. The magnetization of a free layer in each of the other two resistor sections includes a component in a fourth magnetization direction opposite to the third magnetization direction.Type: GrantFiled: May 2, 2022Date of Patent: June 27, 2023Assignee: TDK CORPORATIONInventors: Norikazu Ota, Hiraku Hirabayashi, Kazuma Yamawaki, Shuhei Miyazaki, Kazuya Watanabe
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Publication number: 20230140621Abstract: An electronic component package of an embodiment of the disclosure includes a base, a first plated layer, a first electronic component chip, a second plated layer, and a second electronic component chip. The base includes a first surface and a second surface. The first plated layer covers the first surface. The first electronic component chip is provided on the first plated layer with a first insulating layer being interposed therebetween. The second plated layer covers the second surface. The second electronic component chip is provided on the second plated layer with a second insulating layer being interposed therebetween. The first plated layer and the second plated layer each include a first metal material that is less likely to undergo an ion migration phenomenon than silver (Ag).Type: ApplicationFiled: December 29, 2022Publication date: May 4, 2023Applicant: TDK CorporationInventors: Yongfu CAI, Shuhei MIYAZAKI, Kazuma YAMAWAKI
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Patent number: 11630165Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.Type: GrantFiled: March 24, 2022Date of Patent: April 18, 2023Assignee: TDK CORPORATIONInventors: Kunihiro Ueda, Yoshimitsu Wada, Hiraku Hirabayashi, Kazuma Yamawaki, Tsuyoshi Umehara
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Publication number: 20230056523Abstract: A lead frame includes a die pad, a plurality of leads, at least one support lead, and a frame member. The frame member includes two first connection bars and two second connection bars. The plurality of leads include a plurality of specific leads. The plurality of specific leads are each connected to the first connection bar. At least one of the specific leads is connected to the second connection bar via the at least one support lead. The cross-sectional second-order moment of a cross section of the at least one support lead perpendicular to a Y direction around an X axis is equal to or more than the cross-sectional second-order moment of a cross section of the at least one support lead perpendicular to an X direction around a Y axis.Type: ApplicationFiled: July 5, 2022Publication date: February 23, 2023Applicant: TDK CORPORATIONInventors: Kazuma YAMAWAKI, Shuhei MIYAZAKI
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Publication number: 20230053559Abstract: A lead frame includes a die pad, a plurality of leads, a frame member, and at least one wire. The frame member includes two first connection bars and two second connection bars. The plurality of leads include a plurality of specific leads. Each of the specific leads is connected to the first connection bar. At least one of the specific leads is connected to the second connection bar via the at least one wire.Type: ApplicationFiled: July 5, 2022Publication date: February 23, 2023Applicant: TDK CORPORATIONInventors: Kazuma YAMAWAKI, Shuhei MIYAZAKI
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Patent number: 11569143Abstract: An electronic component package of an embodiment of the disclosure includes a base, a first plated layer, a first electronic component chip, a second plated layer, and a second electronic component chip. The base includes a first surface and a second surface. The first plated layer covers the first surface. The first electronic component chip is provided on the first plated layer with a first insulating layer being interposed therebetween. The second plated layer covers the second surface. The second electronic component chip is provided on the second plated layer with a second insulating layer being interposed therebetween. The first plated layer and the second plated layer each include a first metal material that is less likely to undergo an ion migration phenomenon than silver (Ag).Type: GrantFiled: May 9, 2019Date of Patent: January 31, 2023Assignee: TDK CORPORATIONInventors: Yongfu Cai, Shuhei Miyazaki, Kazuma Yamawaki
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Publication number: 20230008088Abstract: A magnetic sensor device includes at least one magnetic sensor and a support. A center of gravity of an element layout area of the at least one magnetic sensor is deviated from a center of gravity of a reference plane of the support. The at least one magnetic sensor includes four resistor sections constituted by a plurality of magnetoresistive elements. Magnetization of a free layer in each of two of the resistor sections includes a component in a third magnetization direction. The magnetization of a free layer in each of the other two resistor sections includes a component in a fourth magnetization direction opposite to the third magnetization direction.Type: ApplicationFiled: May 2, 2022Publication date: January 12, 2023Applicant: TDK CORPORATIONInventors: Norikazu OTA, Hiraku HIRABAYASHI, Kazuma YAMAWAKI, Shuhei MIYAZAKI, Kazuya WATANABE
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Publication number: 20220214409Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.Type: ApplicationFiled: March 24, 2022Publication date: July 7, 2022Applicant: TDK CORPORATIONInventors: Kunihiro UEDA, Yoshimitsu WADA, Hiraku HIRABAYASHI, Kazuma YAMAWAKI, Tsuyoshi UMEHARA
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Patent number: 11313920Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.Type: GrantFiled: March 12, 2020Date of Patent: April 26, 2022Assignee: TDK CORPORATIONInventors: Kunihiro Ueda, Yoshimitsu Wada, Hiraku Hirabayashi, Kazuma Yamawaki, Tsuyoshi Umehara
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Publication number: 20200209324Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.Type: ApplicationFiled: March 12, 2020Publication date: July 2, 2020Applicant: TDK CORPORATIONInventors: Kunihiro UEDA, Yoshimitsu WADA, Hiraku HIRABAYASHI, Kazuma YAMAWAKI, Tsuyoshi UMEHARA
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Patent number: 10634734Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.Type: GrantFiled: July 5, 2017Date of Patent: April 28, 2020Assignee: TDK CORPORATIONInventors: Kunihiro Ueda, Yoshimitsu Wada, Hiraku Hirabayashi, Kazuma Yamawaki, Tsuyoshi Umehara
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Publication number: 20200035574Abstract: An electronic component package of an embodiment of the disclosure includes a base, a first plated layer, a first electronic component chip, a second plated layer, and a second electronic component chip. The base includes a first surface and a second surface. The first plated layer covers the first surface. The first electronic component chip is provided on the first plated layer with a first insulating layer being interposed therebetween. The second plated layer covers the second surface. The second electronic component chip is provided on the second plated layer with a second insulating layer being interposed therebetween. The first plated layer and the second plated layer each include a first metal material that is less likely to undergo an ion migration phenomenon than silver (Ag).Type: ApplicationFiled: May 9, 2019Publication date: January 30, 2020Applicant: TDK CorporationInventors: Yongfu CAI, Shuhei MIYAZAKI, Kazuma YAMAWAKI
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Publication number: 20180017634Abstract: This sensor unit includes a base having a substantially-rectangular planar shape including a first side and a second side that are substantially orthogonal to each other, and a plurality of first sensors provided on the base and arranged on a first axis. The first axis is substantially parallel to the first side and passes through a center position of the base.Type: ApplicationFiled: July 5, 2017Publication date: January 18, 2018Applicant: TDK CORPORATIONInventors: Kunihiro UEDA, Yoshimitsu WADA, Hiraku HIRABAYASHI, Kazuma YAMAWAKI, Tsuyoshi UMEHARA