Patents by Inventor Kazumasa Hori
Kazumasa Hori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10163539Abstract: A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0?([Co]?0.007)/([P]?0.008)?6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced.Type: GrantFiled: October 19, 2016Date of Patent: December 25, 2018Assignees: Mitsubishi Shindoh Co., Ltd., Mitsubishi Materials CorporationInventors: Keiichiro Oishi, Kazumasa Hori
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Publication number: 20170103825Abstract: A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0?([Co]?0.007)/([P]?0.008)?6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced.Type: ApplicationFiled: October 19, 2016Publication date: April 13, 2017Inventors: Keiichiro Oishi, Kazumasa Hori
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Patent number: 9512506Abstract: A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0?([Co]?0.007)/([P]?0.008)?6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced.Type: GrantFiled: February 23, 2009Date of Patent: December 6, 2016Assignees: MITSUBISHI SHINDOH CO., LTD., MITSUBISHI MATERIALS CORPORATIONInventors: Keiichiro Oishi, Kazumasa Hori
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Publication number: 20110100676Abstract: A high strength and high conductivity copper rod or wire includes Co of 0.12 to 0.32 mass %, P of 0.042 to 0.095 mass %, Sn of 0.005 to 0.70 mass %, and O of 0.00005 to 0.0050 mass %. A relationship of 3.0?([Co]?0.007)/([P]?0.008)?6.2 is satisfied between a content [Co] mass % of Co and a content [P] mass % of P. The remainder includes Cu and inevitable impurities, and the rod or wire is produced by a process including a continuous casting and rolling process. Strength and conductivity of the high strength and high conductivity copper rod or wire are improved by uniform precipitation of a compound of Co and P and by solid solution of Sn. The high strength and high conductivity copper rod or wire is produced by the continuous casting and rolling process, and thus production costs are reduced.Type: ApplicationFiled: February 23, 2009Publication date: May 5, 2011Applicants: MITSUBISHI SHINDOH CO., LTD., MITSUBISHI MATERIALS CORPORATIONInventors: Keiichiro Oishi, Kazumasa Hori
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Patent number: 7524356Abstract: A method for manufacturing a low-oxygen copper wire is provided, in which a dehydrogenating treatment can be performed without requiring a long moving distance of molten copper, and the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire can be obtained having superior surface quality.Type: GrantFiled: August 2, 2005Date of Patent: April 28, 2009Assignee: Mitsubishi Materials CorporationInventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
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Publication number: 20050262968Abstract: A method for manufacturing a low-oxygen copper wire is provided, in which a dehydrogenating treatment can be performed without requiring a long moving distance of molten copper, and the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire can be obtained having superior surface quality.Type: ApplicationFiled: August 2, 2005Publication date: December 1, 2005Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
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Patent number: 6944930Abstract: A method for manufacturing a low-oxygen copper wire is provided, in which a dehydrogenating treatment can be performed without requiring a long moving distance of molten copper, and the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire can be obtained having superior surface quality.Type: GrantFiled: February 26, 2001Date of Patent: September 20, 2005Assignee: Mitsubishi Materials CorporationInventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
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Patent number: 6682824Abstract: An adhesion-resistant oxygen-free roughly drawn copper wire having an oxygen concentration of 1 to 10 ppm and a hydrogen concentration of 1 ppm or less, has a surface oxide film having a total thickness of 50 to 500 angstroms, in which 0.2 to 90% of the total thickness of the oxide film is Cu2O. The adhesion-resistant oxygen-free roughly drawn copper wire is prepared using a continuous casting process, in which the molten copper is agitated and dehydrogenated in a casting trough containing weirs, and the thickness of the oxide layer is controlled by alcohol cleaning the cast copper bar material prior to rolling.Type: GrantFiled: April 11, 2001Date of Patent: January 27, 2004Assignee: Mitsubishi Materials CorporationInventors: Yutaka Koshiba, Tutomu Masui, Kazumasa Hori, Yoshiaki Hattori
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Patent number: 6589473Abstract: An apparatus for manufacturing a copper wire includes a melting furnace in which combustion is performed in a reducing atmosphere so as to produce molten copper; a holding furnace for maintaining a predetermined temperature of the molten copper supplied from the melting furnace; a casting trough for sealing the molten copper supplied from the holding furnace in a non-oxidizing atmosphere and for transferring the molten copper to a tundish; a degasser provided in the casting trough for dehydrogenating the molten copper passing therethrough; a continuous casting machine for continuously producing cast copper from the molten copper supplied from the tundish, and a cutter for cutting the cast copper into a predetermined length. The apparatus permits a dehydrogenating treatment to be performed without requiring a long moving distance of molten copper, and in which the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire having superior surface quality can be obtained.Type: GrantFiled: February 22, 2001Date of Patent: July 8, 2003Assignee: Mitsubishi Materials CorporationInventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
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Publication number: 20010029659Abstract: A method for manufacturing a low-oxygen copper wire is provided, in which a dehydrogenating treatment can be performed without requiring a long moving distance of molten copper, and the generation of holes in solidification is suppressed, whereby high quality low-oxygen copper wire can be obtained having superior surface quality.Type: ApplicationFiled: February 26, 2001Publication date: October 18, 2001Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
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Publication number: 20010028135Abstract: An apparatus for manufacturing a copper wire includes a melting furnace in which combustion is performed in a reducing atmosphere so as to produce molten copper; a soaking furnace for maintaining a predetermined temperature of the molten copper supplied from the melting furnace; a casting trough for sealing the molten copper supplied from the soaking furnace in a non-oxidizing atmosphere and for transferring the molten copper to a turn-dish; a degasser provided in the casting trough for dehydrogenating the molten copper passing therethrough; a continuous casting machine for continuously producing cast copper from the molten copper supplied from the turn-dish, and a cutter for cuffing the cast copper into a predetermined length.Type: ApplicationFiled: February 22, 2001Publication date: October 11, 2001Applicant: Mitsubishi Materials CorporationInventors: Haruhiko Asao, Yutaka Koshiba, Keiji Nogami, Tutomu Masui, Kazumasa Hori, Kenji Wakiguchi, Masahiko Wada, Yoshiaki Hattori
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Patent number: 5146164Abstract: An eddy current flaw detection apparatus, having: a pair of detecting coils disposed in a separated manner along a transit path of a conductor and coaxial with the conductor, magnetic fields generated by said detecting coils being in anti-phase; an alternating current bridge circuit, two sides of a bridge of which are comprising the detecting coils, and which, when a relative change occurs in inductances of the detecting coils and equilibrium of the bridge is thus disturbed, outputs an abnormality detection signal; a pair of resonance coils, which are disposed between the detecting coils, and coaxial with the detecting coils, and magnetic fields of which are in phase, and which are so set that in a state in which the bridge is in equilibrium, induction currents generated by said resonance coils cancel each other out; and a capacity circuit for the purpose of bringing oscillation frequencies of the detecting coils into resonance, which is connected to the resonance coils.Type: GrantFiled: July 3, 1991Date of Patent: September 8, 1992Assignee: Mitsubishi Materials CorporationInventors: Tsutomu Masui, Kazumasa Hori, Akio Ueno
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Patent number: 4663141Abstract: A process for recovering or purifying selenium is disclosed. A selenium-containing material is reacted with carbon monoxide and ammonia or a primary or secondary amine to form a compound soluble in an aprotic solvent. The reaction product is subjected to the reverse reaction by heating it to liberate selenium, which is separated by filtration. The reaction is specific to selenium, and selenium can be separated from sulfur, tellurium, arsenic, halogen, etc. The used reagents can be recovered and used repeatedly.Type: GrantFiled: August 12, 1985Date of Patent: May 5, 1987Assignee: Mitsubishi Kinzoku Kabushiki KaishaInventors: Noboru Sonoda, Naoyuki Hosoda, Kazumasa Hori