Abstract: A semiconductor chip includes: a semiconductor substrate; a penetrating electrode which is formed through the semiconductor substrate from a first surface to a second surface of the semiconductor substrate and has a projection which projects from the second surface; an insulating layer formed over an entire surface of the second surface. The insulating layer includes a first insulating section formed in a region around the projection and a second insulating section other than the first insulating section. The second insulating section is formed to be thinner than a thickest area of the first insulating section.

Abstract: A depression is formed in a semiconductor substrate, in which an integrated circuit is formed, from a first surface of the semiconductor substrate. A conductive section is formed in the depression. The conductive section is caused to project from a second surface of the semiconductor substrate opposite to the first surface. The conductive section is ground or polished until the fresh surface is exposed.