Abstract: A ceramic capacitor includes: a multilayer structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, wherein a main component of the plurality of dielectric layers is BaTiO3, wherein the plurality of dielectric layers include Mn as a first sub-component, Mg as a second sub-component, a rare earth element which is at least one of Ho and Dy as a third sub-component, V as a fourth sub-component, Si as a fifth sub-component, Ca as a sixth sub-component, wherein an average grain diameter of ceramic grains of the plurality of dielectric layers is 280 nm or more and 380 nm or less.

Abstract: A multilayer ceramic capacitor (10) has a laminate body (20) constituted by dielectric layers (17) and internal electrode layers (18) stacked alternately. The dielectric layers (17) contain (Ba(1-x-y)CaxSry)m(Ti(1-z)Zrz)O3, where 0.03?x?0.16, 0?y?0.02, 0<z?0.02, 0.99?m?1.02, as a primary component, and an R oxide (R is a rare earth element) by 1.0 to 4.0 mol in equivalent element, an Mg compound by 0.2 to 2.5 mol in equivalent element, an Mn compound by 0.1 to 1.0 mol in equivalent element, a Zr compound by 0.1 to 2.0 mol in equivalent element, a V compound by 0.05 to 0.3 mol in equivalent element, and an Si compound by 0.2 to 5.0 mol in equivalent element, per 100 mol of the primary component. The multilayer ceramic capacitor can offer excellent DC bias properties and ensure high reliability.

Abstract: A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked. A relationship of “IA/IB>0.30” is satisfied and a peak current value IB is 100 pA/mm2 or less in a TSDC in which a polarizing temperature is 150 degrees C., a polarizing electric field is 15 V/?m to 20 V/?m, a polarizing time is 60 minutes, and an increasing speed of temperature is 10° C./minute, when a peak current of a low temperature side of a temperature range of 160 degrees C. or more and less than 230 degrees C. is IA and a peak current of a high temperature side of a temperature range of 230 degrees C. or more and 350 degrees C. or less is IB.

Abstract: A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked. A relationship of “IA/IB>0.30” is satisfied and a peak current value IB is 100 pA/mm2 or less in a TSDC in which a polarizing temperature is 150 degrees C., a polarizing electric field is 15 V/?m to 20 V/?m, a polarizing time is 60 minutes, and an increasing speed of temperature is 10° C./minute, when a peak current of a low temperature side of a temperature range of 160 degrees C. or more and less than 230 degrees C. is IA and a peak current of a high temperature side of a temperature range of 230 degrees C. or more and 350 degrees C. or less is IB.

Abstract: A ceramic capacitor includes: a multilayer structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, wherein a main component of the plurality of dielectric layers is BaTiO3, wherein the plurality of dielectric layers include Mn as a first sub-component, Mg as a second sub-component, a rare earth element which is at least one of Ho and Dy as a third sub-component, V as a fourth sub-component, Si as a fifth sub-component, Ca as a sixth sub-component, wherein an average grain diameter of ceramic grains of the plurality of dielectric layers is 280 nm or more and 380 nm or less.

Abstract: A multilayer ceramic capacitor (10) has a laminate body (20) constituted by dielectric layers (17) and internal electrode layers (18) stacked alternately. The dielectric layers (17) contain (Ba(1-x-y)CaxSry)m(Ti(1-z)Zrz)O3, where 0.03?x?0.16, 0?y?0.02, 0<z?0.02, 0.99?m?1.02, as a primary component, and an R oxide (R is a rare earth element) by 1.0 to 4.0 mol in equivalent element, an Mg compound by 0.2 to 2.5 mol in equivalent element, an Mn compound by 0.1 to 1.0 mol in equivalent element, a Zr compound by 0.1 to 2.0 mol in equivalent element, a V compound by 0.05 to 0.3 mol in equivalent element, and an Si compound by 0.2 to 5.0 mol in equivalent element, per 100 mol of the primary component. The multilayer ceramic capacitor can offer excellent DC bias properties and ensure high reliability.

Abstract: A ceramic capacitor includes: a multilayer structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, wherein a main component of the plurality of dielectric layers is ceramic having a perovskite structure expressed by BamTiO3 (0.9990?m?1.0015), wherein the plurality of dielectric layers include Mn as a first sub-component, Mg as a second sub-component, a rare earth element which is at least one of Ho and Dy as a third sub-component, V as a fourth sub-component, Si as a fifth sub-component, Ca as a sixth sub-component, wherein an average grain diameter of ceramic grains of the plurality of dielectric layers is 280 nm or more and 380 nm or less.

Abstract: A ceramic electronic device includes: a ceramic body that has a first face and a second face facing with the first face and has an internal electrode layer inside thereof; a pair of external electrodes that cover the first face and the second face; and a spot that is formed on a third face of the ceramic body that is different from the first face and the second face and is an amorphous phase including Ba, Si and O.

Abstract: A multilayer ceramic capacitor includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are alternately stacked and are alternately exposed to two edge faces thereof; and external electrodes formed on the two edge faces; wherein: the external electrodes have a structure in which a plated layer is formed on a ground layer whose main component is a metal or an alloy, a thermal expansion coefficient of the metal being larger than that of a main ceramic component of the dielectric layer, the ground layer including a ceramic additive; outermost layers of the multilayer chip are cover layers whose main component is a main component of the dielectric layer; and thermal expansion coefficients satisfy a relationship of, the main component of the ground layer>the main component of the cover layers>the ceramic additive.

Abstract: A ceramic capacitor includes: a multilayer structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, wherein a main component of the plurality of dielectric layers is ceramic having a perovskite structure expressed by BamTiO3 (0.9990?m?1.0015), wherein the plurality of dielectric layers include Mn as a first sub-component, Mg as a second sub-component, a rare earth element which is at least one of Ho and Dy as a third sub-component, V as a fourth sub-component, Si as a fifth sub-component, Ca as a sixth sub-component, wherein an average grain diameter of ceramic grains of the plurality of dielectric layers is 280 nm or more and 380 nm or less.

Abstract: A ceramic electronic device includes: a ceramic body that has a first face and a second face facing with the first face and has an internal electrode layer inside thereof; a pair of external electrodes that cover the first face and the second face; and a spot that is formed on a third face of the ceramic body that is different from the first face and the second face and is an amorphous phase including Ba, Si and O.

Abstract: A multilayer ceramic capacitor includes: a multilayer chip in which each of dielectric layers and each of internal electrode layers are alternately stacked and are alternately exposed to two edge faces thereof; and external electrodes formed on the two edge faces; wherein: the external electrodes have a structure in which a plated layer is formed on a ground layer whose main component is a metal or an alloy, a thermal expansion coefficient of the metal being larger than that of a main ceramic component of the dielectric layer, the ground layer including a ceramic additive; outermost layers of the multilayer chip are cover layers whose main component is a main component of the dielectric layer; and thermal expansion coefficients satisfy a relationship of, the main component of the ground layer>the main component of the cover layers>the ceramic additive.

Abstract: Dielectric ceramics capable of decreasing the displacement causing ringing and a multi-layer ceramic capacitor capable of decreasing occurrence of ringing in which the dielectric ceramics comprise a solid solution represented by: Ba—Ti—Zr—Re-Me-O3 where (Re is at least one metal element selected from La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu and Y, Me is a metal element selected from Mg, Cr, and Mn, and Zr is an arbitrary ingredient), and SiO2, where Ti:Zr is from 100:0 to 75:25, and Ba is from 97 mol to 103 mol, Re is from 2 mol to 18 mol, Me is from 2 mol to 18 mol, and SiO2 is from 0.5 mol to 10 mol assuming Ti+Zr as 100 mol.

Abstract: A multi-layer ceramic capacitor includes a plurality of dielectric ceramic layers; internal electrodes formed between the dielectric ceramic layers; and end termination electrodes electrically connected to the internal electrodes, wherein the dielectric ceramic layer is a sintered body constituted of a primary component that, when it is expressed by ABO3+aRe2O3+bMnO, satisfies 1.000?A/B?1.035, 0.05?a?0.75 and 0.25?b?2.0; and a subcomponent that includes at least one kind of B, Li or S in the range of 0.16 to 1.6 parts by mass in total in terms of B2O3, Li2O and SiO2; and the internal electrode is constituted of Cu or a Cu alloy.

Abstract: Dielectric ceramics and a multi-layer ceramic capacitor with internal Ni electrodes having a more improved property showing the reliability such as high accelerated life time than usual, a temperature characteristic of the permittivity satisfying the X6S property, and having a permittivity of from 800 to 1800, wherein the dielectric ceramics comprise a main ingredient within a range: 1.100?Ba/Ti?1.700 0.02?a?0.10 0.01?b?0.

Abstract: A multi-layer ceramic capacitor includes a plurality of dielectric ceramic layers; internal electrodes formed between the dielectric ceramic layers; and end termination electrodes electrically connected to the internal electrodes, wherein the dielectric ceramic layer is a sintered body constituted of a primary component that, when it is expressed by ABO3+aRe2O3+bMnO, satisfies 1.000?A/B?1.035, 0.05?a?0.75 and 0.25?b?2.0; and a subcomponent that includes at least one kind of B, Li or S in the range of 0.16 to 1.6 parts by mass in total in terms of B2O3, Li2O and SiO2; and the internal electrode is constituted of Cu or a Cu alloy.

Abstract: Dielectric ceramics include a sintered body comprising a principal ingredient, when represented by: ABO3+aRe+bM+Zr oxide where ABO3 is a barium titanate-based solid solution having a perovskite structure, Re is at least one oxide of La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu and/or Y, M is at least one oxide of Mg, Al, Cr, Mn, Fe, Ni, Cu, and/or Zn, a and b each represents a mol number of the oxides per 1 mol of ABO3 within a range of: 1.100?Ba/Ti?1.700, 0.05?a?0.25, 0.05?b?0.25, Ti:Zr=95:5 to 60:40.

Abstract: A preform for metal matrix composite material comprising: inorganic particles, small-diameter inorganic fibers, and large-diameter inorganic fibers. An average particle diameter of the inorganic particles is 1 to 50 &mgr;m. An average fiber diameter of the small-diameter inorganic fibers is 2 to 5 &mgr;m, and an average fiber length of the small-diameter inorganic fibers is 10 to 200 &mgr;m. An average fiber diameter of the large-diameter inorganic fibers is 4 to 20 &mgr;m, and an average fiber length of the large-diameter inorganic fibers is 10 to 200 &mgr;m. The small-diameter inorganic fibers catch and disperse the inorganic particles in a process of forming a formed body, and the large-diameter inorganic fibers create voids in cooperation with the small-diameter inorganic fibers in the process of forming the formed body.