Abstract: This invention provides a resin composition for preparing an allylphenol-maleimide copolymer used for a protective film for an electronic component including: (A) an allyl group-containing phenol compound having a rigid structure; (B) an N-aromatic maleimide group-containing compound having a rigid structure; and (C) an N-aliphatic maleimide group-containing compound having a flexible structure.

Abstract: An IC card includes an IC module and a card base. The IC module is constituted by a circuit board having contact patterns formed thereon and an IC chip mounted on the circuit board. The card base houses the IC module so as to expose the contact patterns. The circuit board of the IC module is constituted by a pattern portion on which the contact patterns are formed and bent portions formed by bending the pattern portion. The card base includes an opening for exposing the contact patterns of the IC module, and clamping portions, formed on peripheral portions of the opening, for fixing the bent portions. The bent portions of the IC module are fixedly clamped by the clamping portions such that the contact patterns are arranged on substantially the same plane as a surface of the card base.

Abstract: A biaxially oriented plastic container having, in section, three layers formed by concentrically injecting two types of plastic into a cavity to mold a bottomed parison and stretch-blow molding said parison to form a biaxially oriented container with excellent heat-resistance and gas barrier properties; said two types of plastic having between them an intermediate layer of plastic having selected lengths of glass fiber.