Patents by Inventor Kazumi Onda
Kazumi Onda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9917010Abstract: A semiconductor device includes: a semiconductor substrate; a heat sink mounted on an upper surface of the semiconductor substrate; wirings formed on a lower surface of the semiconductor substrate; and the like. The heat sink is mounted on the upper surface of the semiconductor substrate, and a planar size thereof is approximately the same as that of the semiconductor substrate. Moreover, the heat sink has a thickness of 500 ?m to 2 mm, and may be formed to be thicker than the semiconductor substrate. By using the heat sink to reinforce the substrate, a thickness of the semiconductor substrate can be reduced to, for example, about 50 ?m. As a result, a thickness of the entire semiconductor device can be reduced.Type: GrantFiled: April 8, 2014Date of Patent: March 13, 2018Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Hideaki Yoshimi, Mitsuo Umemoto, Kazumi Onda, Kazumi Horinaka
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Patent number: 9905497Abstract: The invention is directed to firm bonding between semiconductor dies etc bonded to a lead frame and wire-bonding portions of the lead frame by ultrasonic Al wire bonding, and the prevention of shortcircuit between the semiconductor dies etc due to a remaining portion of the outer frame of the lead frame after the outer frame is cut. By extending the wire-bonding portion etc on the lead frame in a wire-bonding direction and connecting the wire-bonding portion etc to the outer frame of the lead frame through a connection lead etc, the ultrasonic vibration force in the ultrasonic Al wire bonding is prevented from dispersing and the Al wire and the wire-bonding portion etc are firmly bonded. The outer frame is cut after a resin sealing process is completed.Type: GrantFiled: September 3, 2015Date of Patent: February 27, 2018Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Takeshi Susaki, Masahito Shindo, Kazumi Onda
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Publication number: 20150380344Abstract: The invention is directed to firm bonding between semiconductor dies etc bonded to a lead frame and wire-bonding portions of the lead frame by ultrasonic Al wire bonding, and the prevention of shortcircuit between the semiconductor dies etc due to a remaining portion of the outer frame of the lead frame after the outer frame is cut. By extending the wire-bonding portion etc on the lead frame in a wire-bonding direction and connecting the wire-bonding portion etc to the outer frame of the lead frame through a connection lead etc, the ultrasonic vibration force in the ultrasonic Al wire bonding is prevented from dispersing and the Al wire and the wire-bonding portion etc are firmly bonded. The outer frame is cut after a resin sealing process is completed.Type: ApplicationFiled: September 3, 2015Publication date: December 31, 2015Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Takeshi Susaki, Masahito Shindo, Kazumi Onda
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Patent number: 9171761Abstract: The invention is directed to firm bonding between semiconductor dies etc bonded to a lead frame and wire-bonding portions of the lead frame by ultrasonic Al wire bonding, and the prevention of shortcircuit between the semiconductor dies etc due to a remaining portion of the outer frame of the lead frame after the outer frame is cut. By extending the wire-bonding portion etc on the lead frame in a wire-bonding direction and connecting the wire-bonding portion etc to the outer frame of the lead frame through a connection lead etc, the ultrasonic vibration force in the ultrasonic Al wire bonding is prevented from dispersing and the Al wire and the wire-bonding portion etc are firmly bonded. The outer frame is cut after a resin sealing process is completed.Type: GrantFiled: February 27, 2014Date of Patent: October 27, 2015Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Takeshi Sasaki, Masahiro Shindo, Kazumi Onda
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Patent number: 9136174Abstract: The invention is directed to firm bonding between semiconductor dies etc bonded to a lead frame and wire-bonding portions of the lead frame by ultrasonic Al wire bonding, and the prevention of shortcircuit between the semiconductor dies etc due to a remaining portion of the outer frame of the lead frame after the outer frame is cut. By extending the wire-bonding portion etc on the lead frame in a wire-bonding direction and connecting the wire-bonding portion etc to the outer frame of the lead frame through a connection lead etc, the ultrasonic vibration force in the ultrasonic Al wire bonding is prevented from dispersing and the Al wire and the wire-bonding portion etc are firmly bonded. The outer frame is cut after a resin sealing process is completed.Type: GrantFiled: February 27, 2014Date of Patent: September 15, 2015Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Takeshi Sasaki, Masahiro Shindo, Kazumi Onda
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Publication number: 20140220739Abstract: A semiconductor device includes: a semiconductor substrate; a heat sink mounted on an upper surface of the semiconductor substrate; wirings formed on a lower surface of the semiconductor substrate; and the like. The heat sink is mounted on the upper surface of the semiconductor substrate, and a planar size thereof is approximately the same as that of the semiconductor substrate. Moreover, the heat sink has a thickness of 500 ?m to 2 mm, and may be formed to be thicker than the semiconductor substrate. By using the heat sink to reinforce the substrate, a thickness of the semiconductor substrate can be reduced to, for example, about 50 ?m. As a result, a thickness of the entire semiconductor device can be reduced.Type: ApplicationFiled: April 8, 2014Publication date: August 7, 2014Applicant: Semiconductor Components Industries, LLC.Inventors: Hideaki Yoshimi, Mitsuo Umemoto, Kazumi Onda, Kazumi Horinaka
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Publication number: 20140179063Abstract: The invention is directed to firm bonding between semiconductor dies etc bonded to a lead frame and wire-bonding portions of the lead frame by ultrasonic Al wire bonding, and the prevention of shortcircuit between the semiconductor dies etc due to a remaining portion of the outer frame of the lead frame after the outer frame is cut. By extending the wire-bonding portion etc on the lead frame in a wire-bonding direction and connecting the wire-bonding portion etc to the outer frame of the lead frame through a connection lead etc, the ultrasonic vibration force in the ultrasonic Al wire bonding is prevented from dispersing and the Al wire and the wire-bonding portion etc are firmly bonded. The outer frame is cut after a resin sealing process is completed.Type: ApplicationFiled: February 27, 2014Publication date: June 26, 2014Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLCInventors: Takeshi Sasaki, Masahiro Shindo, Kazumi Onda
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Patent number: 8736047Abstract: A semiconductor device includes: a semiconductor substrate; a heat sink mounted on an upper surface of the semiconductor substrate; wirings formed on a lower surface of the semiconductor substrate; and the like. The heat sink is mounted on the upper surface of the semiconductor substrate, and a planar size thereof is approximately the same as that of the semiconductor substrate. Moreover, the heat sink has a thickness of 500 ?m to 2 mm, and may be formed to be thicker than the semiconductor substrate. By using the heat sink to reinforce the substrate, a thickness of the semiconductor substrate can be reduced to, for example, about 50 ?m. As a result, a thickness of the entire semiconductor device can be reduced.Type: GrantFiled: March 28, 2007Date of Patent: May 27, 2014Assignee: Semiconductor Components Industries, LLCInventors: Hideaki Yoshimi, Mitsuo Umemoto, Kazumi Onda, Kazumi Horinaka
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Patent number: 8704342Abstract: The invention is directed to firm bonding between semiconductor dies etc bonded to a lead frame and wire-bonding portions of the lead frame by ultrasonic Al wire bonding, and the prevention of shortcircuit between the semiconductor dies etc due to a remaining portion of the outer frame of the lead frame after the outer frame is cut. By extending the wire-bonding portion etc on the lead frame in a wire-bonding direction and connecting the wire-bonding portion etc to the outer frame of the lead frame through a connection lead etc, the ultrasonic vibration force in the ultrasonic Al wire bonding is prevented from dispersing and the Al wire and the wire-bonding portion etc are firmly bonded. The outer frame is cut after a resin sealing process is completed.Type: GrantFiled: August 28, 2009Date of Patent: April 22, 2014Assignee: Semiconductor Components Industries, LLCInventors: Takeshi Sasaki, Masahiro Shindo, Kazumi Onda
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Publication number: 20100052125Abstract: The invention is directed to firm bonding between semiconductor dies etc bonded to a lead frame and wire-bonding portions of the lead frame by ultrasonic Al wire bonding, and the prevention of shortcircuit between the semiconductor dies etc due to a remaining portion of the outer frame of the lead frame after the outer frame is cut. By extending the wire-bonding portion etc on the lead frame in a wire-bonding direction and connecting the wire-bonding portion etc to the outer frame of the lead frame through a connection lead etc, the ultrasonic vibration force in the ultrasonic Al wire bonding is prevented from dispersing and the Al wire and the wire-bonding portion etc are firmly bonded. The outer frame is cut after a resin sealing process is completed.Type: ApplicationFiled: August 28, 2009Publication date: March 4, 2010Applicants: SANYO Electric Co., Ltd., SANYO Semiconductor Co., Ltd.Inventors: Takeshi Sasaki, Masahiro Shindo, Kazumi Onda
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Patent number: 7326041Abstract: The preferred embodiments provide a lead frame wherein a first air vent 29 and a second air vent 30 are formed in an air vent forming region 32. When resin-molding, one end of this first air vent 29 is disposed within the cavity, whereby air in the cavity when resin-molding can be completely released to the outside of the cavity. As a result, a package after resin-molding includes no unfilled regions or voids, whereby a semiconductor device with excellent product quality can be provided. In the background, air in cavities could not be completely released when resin-molding since, for instance, one air vent was provided at a position apart from the cavity region, and unfilled regions or voids were created.Type: GrantFiled: February 6, 2004Date of Patent: February 5, 2008Assignee: Sanyo Electric Co., Ltd.Inventors: Isao Ochiai, Kazumi Onda
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Publication number: 20070228554Abstract: A semiconductor device includes: a semiconductor substrate; a heat sink mounted on an upper surface of the semiconductor substrate; wirings formed on a lower surface of the semiconductor substrate; and the like. The heat sink is mounted on the upper surface of the semiconductor substrate, and a planar size thereof is approximately the same as that of the semiconductor substrate. Moreover, the heat sink has a thickness of 500 ?m to 2 mm, and may be formed to be thicker than the semiconductor substrate. By using the heat sink to reinforce the substrate, a thickness of the semiconductor substrate can be reduced to, for example, about 50 ?m. As a result, a thickness of the entire semiconductor device can be reduced.Type: ApplicationFiled: March 28, 2007Publication date: October 4, 2007Applicant: Sanyo Electric Co., Ltd.Inventors: Hideaki Yoshimi, Mitsuo Umemoto, Kazumi Onda, Kazumi Horinaka
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Publication number: 20040155365Abstract: The preferred embodiments provide a lead frame wherein a first air vent 29 and a second air vent 30 are formed in an air vent forming region 32. When resin-molding, one end of this first air vent 29 is disposed within the cavity, whereby air in the cavity when resin-molding can be completely released to the outside of the cavity. As a result, a package after resin-molding includes no unfilled regions or voids, whereby a semiconductor device with excellent product quality can be provided. In the background, air in cavities could not be completely released when resin-molding since, for instance, one air vent was provided at a position apart from the cavity region, and unfilled regions or voids were created.Type: ApplicationFiled: February 6, 2004Publication date: August 12, 2004Applicant: Sanyo Electric Co., Ltd.Inventors: Isao Ochiai, Kazumi Onda
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Patent number: 6724072Abstract: The preferred embodiments provide a lead frame wherein a first air vent 29 and a second air vent 30 are formed in an air vent forming region 32. When resin-molding, one end of this first air vent 29 is disposed within the cavity, whereby air in the cavity when resin-molding can be completely released to the outside of the cavity. As a result, a package after resin-molding includes no unfilled regions or voids, whereby a semiconductor device with excellent product quality can be provided. In the background, air in cavities could not be completely released when resin-molding since, for instance, one air vent was provided at a position apart from the cavity region, and unfilled regions or voids were created.Type: GrantFiled: November 12, 2002Date of Patent: April 20, 2004Assignee: Sanyo Electric Co., Ltd.Inventors: Isao Ochiai, Kazumi Onda
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Publication number: 20030090877Abstract: The preferred embodiments provide a lead frame wherein a first air vent 29 and a second air vent 30 are formed in an air vent forming region 32. When resin-molding, one end of this first air vent 29 is disposed within the cavity, whereby air in the cavity when resin-molding can be completely released to the outside of the cavity. As a result, a package after resin-molding includes no unfilled regions or voids, whereby a semiconductor device with excellent product quality can be provided. In the background, air in cavities could not be completely released when resin-molding since, for instance, one air vent was provided at a position apart from the cavity region, and unfilled regions or voids were created.Type: ApplicationFiled: November 12, 2002Publication date: May 15, 2003Inventors: Isao Ochiai, Kazumi Onda
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Patent number: 3959114Abstract: An apparatus for arranging materials at uniform intervals comprising a number of distance bars each consisting of a pair of bar units which are adapted to travel on guide rails and move toward and away from each other.Type: GrantFiled: March 6, 1974Date of Patent: May 25, 1976Assignee: Nikkei Aluminium Company, Ltd.Inventors: Hisao Kirino, Kazumi Onda