Abstract: A resin composition containing: (A) a modified polyphenylene ether having a main chain modified at a terminal end with a functional group having a carbon-carbon double bond; (B) a crosslinking agent; (C) a crosslinking aid; and (D) an organic peroxide. The crosslinking aid (C) is a compound having a specific structure.

Abstract: A resin composition containing: (A) a modified polyphenylene ether having a main chain modified at a terminal end with a functional group having a carbon-carbon double bond; (B) a crosslinking agent; (C) a crosslinking aid; and (D) an organic peroxide. The crosslinking aid (C) is a compound having a specific structure.

Abstract: Provided are: a prepreg with low dielectric constant, low dielectric loss tangent, and improved adhesiveness to glass cloth; and a laminate for a circuit board. The prepreg is formed of the glass cloth serving as a base material and a semi-cured product of a thermosetting resin composition impregnated into the glass cloth, where the glass cloth comprises a treated surface treated by at least one type of silane coupling agent selected from methacryl-based silane coupling agents, acryl-based silane coupling agents, and isocyanate-based silane coupling agents, and the thermosetting resin composition contains polyphenyleneether having a terminal hydroxyl group modified with an ethylenically unsaturated compound in a main chain of the polyphenyleneether. The laminate for the circuit board is obtained by laminating the prepreg and a conductor layer.

Abstract: A resin composition contains a component (A) being a polyphenylene ether in which the hydroxy group at an end of the main chain thereof has been modified with an ethylenically unsaturated compound, a component (B) being at least one of triallyl isocyanurate and triallyl cyanurate, and a component (C) being an organic peroxide containing no benzene ring. The component (C) is contained with a proportion of 0.1% to 7% by mass relative to 100% by mass of the total mass of the components (A), (B), and (C).

Abstract: Provided are: a prepreg with low dielectric constant, low dielectric loss tangent, and improved adhesiveness to glass cloth; and a laminate for a circuit board. The prepreg is formed of the glass cloth serving as a base material and a semi-cured product of a thermosetting resin composition impregnated into the glass cloth, where the glass cloth comprises a treated surface treated by at least one type of silane coupling agent selected from methacryl-based silane coupling agents, acryl-based silane coupling agents, and isocyanate-based silane coupling agents, and the thermosetting resin composition contains polyphenyleneether having a terminal hydroxyl group modified with an ethylenically unsaturated compound in a main chain of the polyphenyleneether. The laminate for the circuit board is obtained by laminating the prepreg and a conductor layer.

Abstract: There are provided a wiring substrate having a low dielectric constant and a low dielectric loss tangent, and an adhesive-attached copper foil and a copper-clad laminate that are suitable for manufacture of the wiring substrate and have improved adhesiveness to a copper foil. An adhesive-attached copper foil includes: a copper foil on one surface; and an adhesive layer provided on one surface of the copper foil, in which this copper foil has a roughened surface that is surface-treated by methacrylic silane, acrylic silane, or isocyanurate silane, and the adhesive layer is formed on the roughened surface and is made of a resin composition containing, as a main component thereof, modified polyphenylene ether resulting from modification of a hydroxyl group present at the end of the main chain with an ethylenically unsaturated compound.

Abstract: There are provided a wiring substrate having a low dielectric constant and a low dielectric loss tangent, and an adhesive-attached copper foil and a copper-clad laminate that are suitable for manufacture of the wiring substrate and have improved adhesiveness to a copper foil. An adhesive-attached copper foil includes: a copper foil on one surface; and an adhesive layer provided on one surface of the copper foil, in which this copper foil has a roughened surface that is surface-treated by methacrylic silane, acrylic silane, or isocyanurate silane, and the adhesive layer is formed on the roughened surface and is made of a resin composition containing, as a main component thereof, modified polyphenylene ether resulting from modification of a hydroxyl group present at the end of the main chain with an ethylenically unsaturated compound.

Abstract: A resin composition contains a component (A) being a polyphenylene ether in which the hydroxy group at an end of the main chain thereof has been modified with an ethylenically unsaturated compound, a component (B) being at least one of triallyl isocyanurate and triallyl cyanurate, and a component (C) being an organic peroxide containing no benzene ring. The component (C) is contained with a proportion of 0.1% to 7% by mass relative to 100% by mass of the total mass of the components (A), (B), and (C).

Abstract: A method for preparing a high-purity p-isobutylstyrene is here disclosed which comprises the first step of reacting o- and/or m-isobutylethylbenzene, if necessary, together with isobutylbenzene, in the presence of an acid catalyst in a liquid phase at a reaction temperature of -10.degree. to 600.degree. C. so that the production of sec-butylethylbenzene in butylethylbenzene may not exceed 20% by weight, in order to form a mixture of p-isobutylethylbenzene and sec-butylethylbenzene; and the second step of bringing the mixture of p-isobutylethylbenzene and sec-butylethylbenzene recovered from the first step into contact with a dehydrogenation metal catalyst containing at least one metal selected from the groups Ib, IIb, VIa, VIIa and VIII of the periodic table at a reaction temperature of 300.degree. to 650.degree. C. under a reaction pressure of 50 kg/cm.sup.2 or less in a gaseous phase.

Abstract: A method for preparing .alpha.-(4-isobutylphenyl)propionic acid or its precursor is here disclosed which comprises a step (I) of dehydrogenating p-isobutylethylbenzene in a gaseous phase in the presence of a dehydrogenating metal catalyst to form p-isobutylstyrene and at least one unsaturated hydrocarbon compound selected from a group A defined in Claim 1; a step (II) of reacting p-isobutylstyrene obtained in the step (I) with carbon monoxide and hydrogen or with carbon monoxide and water or a lower alcohol in the presence of a transition metal complex carbonylating catalyst to form .alpha.-(4-isobutylphenyl)propionic acid or its precursor; and a step (III) of hydrogenating at least one unsaturated hydrocarbon compound selected from the group A obtained in the dehydrogenation step (I) to form p-isobutylethylbenzene, and recycling the thus formed p-isobutylethylbenzene through the step (I) as the raw material of the step (I).

Abstract: A method for preparing .alpha.-(4-isobutylphenyl)propionic acid or its precursor is here disclosed which comprises a step A of forming p-isobutylstyrene from p-isobutylethylbenzene and a step B of forming .alpha.-(4-isobutylphenyl)propionaldehyde from p-isobutylstyrene or a step C of forming .alpha.-(4-isobutylphenyl)propionic acid or its alkyl ester from p-isobutylstyrene.Furthermore, a method for preparing said p-isobutylethylbenzene is also disclosed which comprises alkylating isobutylbenzene or 4-ethyltoluene with ethylene or propylene.

Abstract: A method for producing arylethylene comprising four steps of: (I) bringing 1,1-diarylethane into contact with an acid catalyst in the presence of an inert gas to crack said compound into arylethylenes and alkylbenzenes; (II) separating the reaction mixture obtained in the above cracking step (I) into at least a fraction mainly containing 1,1-diarylethane; (III) bringing said fraction mainly containing 1,1-diarylethane into contact with hydrogen gas in the presence of a hydrogenation catalyst; and (IV) re-cracking hydrogenated fraction obtained in the preceding hydrogenation step (III) by bringing it into said cracking step (I).Particularly, this method is useful for producing p-isobutylstyrene which is a starting material for preparing a valuable medicine of ibuprofen.

Abstract: A method for producing efficiently a highly pure 1-(m-ethylphenyl)-1-phenylethane or m-ethylphenylphenylmethane which are used as the starting materials for preparing medicines and other organic compounds. The method comprises the step of reacting a diaryl compound with benzene or alkylbenzene in the presence of an acid catalyst selected from the group consisting of AlCl.sub.3, AlBr.sub.3, HF.BF.sub.3 complex and Y-type zeolites.

Abstract: A method for producing p-isobutylstyrene which is characterized in that starting materials are inexpensive, processes are easy to be done and products are highly pure. The method comprises the step of catalytically cracking 1,1-bis(p-isobutylphenyl)ethane at temperatures in the range of 200.degree. to 650.degree. C. in the presence of a protonic acid catalyst and/or a solid acid catalyst to produce p-isobutylstyrene and isobutylbenzene, and at least a portion of said isobutylbenzene is recycled to produce said 1,1-bis(p-isobutylphenyl)ethane by reaction with acetaldehyde in the presence of sulfuric acid.

Abstract: A method for producing .alpha.-(p-isobutylphenyl)propionic acid or its alkyl esters which is characterized in that starting materials are inexpensive, processes are easy to be done and products are highly pure. The method comprises the steps of (I): catalytically cracking 1,1-bis(p-isobutylphenyl)ethane at temperatures in the range of 200.degree. to 650.degree. C. in the presence of a protonic acid catalyst and/or a solid acid catalyst to produce isobutylbenzene and p-isobutylstyrene; and (II): reacting said p-isobutylstyrene with carbon monoxide and water or alcohol at temperatures in the range of 40.degree. to 150.degree. C. in the presence of a metal complex carbonylation catalyst to produce .alpha.-(p-isobutylphenyl)propionic acid or its alkyl ester; or (III): reacting said p-isobutylstyrene with carbon monoxide and hydrogen at temperatures in the range of 40.degree. to 150.degree. C. in the presence of a metal complex carbonylation catalyst to produce .alpha.

Abstract: A method for producing an aromatic hydrocarbon easily and safely without the use of carrier-supported catalyst and is characterized in that an unsaturated compound having a double bond or bonds that are conjugated with the benzene ring is allowed to coexist in the process to alkylate a substituted aromatic hydrocarbon with olefins in the presence of 5 mM or more of metallic sodium and potassium compound to provide 3 mM or more of potassium ions relative to 1 mole of the substituted aromatic hydrocarbon, said substituted aromatic hydrocarbon having at least one alkyl group or alkylene group which has at least one hydrogen atom in the .alpha.-position relative to the aromatic ring of said substituted aromatic hydrocarbon.