Abstract: In one embodiment of the present invention, a significance test of pixel values is performed between a region where functions could be deteriorated in a disease-specific manner and a region where functions could be preserved even in cases of diseases using brain functional images. Then, the mean pixel value of the functionally preserved site is significantly greater than the mean pixel value of the functionally deteriorated site according to the significance test is determined as an a image including a neurodegenerative disorder. According to this embodiment, it becomes possible to objectively detect images of neurodegenerative disorders without using a database for healthy subjects.

Abstract: In a method for thermal stabilization of a probe card, a probe card is adjusted to a prescribed temperature in a short time by making a heat source directly contact the probe card and is accurately determined whether the probe card is thermally stable. A heat transfer substrate is mounted on a mounting table. The temperature of the heat transfer substrate is adjusted through the mounting table. The mounting table is raised, and a plurality of probes is brought into contact with the heat transfer substrate at a prescribed target load. The contact load between the heat transfer substrate and the probes, which changes according to the thermal changes in the probe card, is detected. The mounting table is controlled vertically through a vertical drive mechanism such that the contact load becomes the target load until the probe card is thermally stable.

Abstract: Disclosed is a method to set contact parameters, which can simulate the entire contact process of devices of a semiconductor wafer with probes while visually checking the contact parameters. The method includes preparing a coordinate graph including a time axis and a height axis, and setting contact parameters of the semiconductor wafer by specifying a plurality of points on the coordinate graph by a plurality of upward/downward movement positions of the semiconductor wafer during electrical contact of the electrode pads of the semiconductor wafer with the plurality of probes or separation of the electrode pads of the semiconductor wafer from the plurality of probes, and time required for the semiconductor wafer to move until reaching the upward/downward movement positions, respectively, and displaying a broken-line graph through connecting the specified points with straight-lines.

Abstract: A method of detecting a neurodegenerative disease includes (a) a standardization step of creating a first image by applying anatomical standardization to a brain nuclear medical image; (b) a conversion step of creating a second image by converting the pixel value of each pixel of an image based on the first image into a z score or a t value; (c) an addition step of calculating the sum of the pixel values of individual pixels in a predetermined region of interest in the second image; and (d) a detection step of obtaining the results of the detection of the neurodegenerative disease through an operation of comparison of the sum with a predetermined threshold.

Abstract: A method for correcting inclination of a wafer chuck includes obtaining in advance a correction amount for each of the semiconductor chips which corrects the inclination of the wafer chuck in the case of applying a contact load to at least each one of the semiconductor chips and storing each of the correction amounts in a data storage unit; calculating a total correction amount for correcting the inclination of the wafer chuck by calculating the correction amount of each of the semiconductor chips bringing into contact with the probes when the semiconductor wafer comes into electrical contact with the probes and adding the calculated correction amounts; and correcting the inclination of the wafer chuck based on the total correction amount.

Abstract: A method is for calculating a height of a chuck top. A height of the top surface of the chuck top which corresponds to an arbitrary position specified on the XY coordinate plane by a computer is calculated in each of the four quadrants based on a coordinate transformation formulas. The method includes setting, by using the computer, a conical model in which two adjacent points other than the center point of the chuck top which correspond to the specified coordinates in a predetermined quadrant of the XY coordinate plane are obtained on a circumference having the center point of the chuck top as the origin and specifying an arbitrary point in the predetermined quadrant by using the computer and calculating a height of the arbitrary point of the chuck top based on the conical model, the coordinate transformation formulas and the specified coordinates.

Abstract: In one embodiment of the present invention, a significance test of pixel values is performed between a region where functions could be deteriorated in a disease-specific manner and a region where functions could be preserved even in cases of diseases using brain functional images. Then, the mean pixel value of the functionally preserved site is significantly greater than the mean pixel value of the functionally deteriorated site according to the significance test is determined as an a image including a neurodegenerative disorder. According to this embodiment, it becomes possible to objectively detect images of neurodegenerative disorders without using a database for healthy subjects.

Abstract: Disclosed is a method to set contact parameters, which can simulate the entire contact process of devices of a semiconductor wafer with probes while visually checking the contact parameters. The method includes preparing a coordinate graph including a time axis and a height axis, and setting contact parameters of the semiconductor wafer by specifying a plurality of points on the coordinate graph by a plurality of upward/downward movement positions of the semiconductor wafer during electrical contact of the electrode pads of the semiconductor wafer with the plurality of probes or separation of the electrode pads of the semiconductor wafer from the plurality of probes, and time required for the semiconductor wafer to move until reaching the upward/downward movement positions, respectively, and displaying a broken-line graph through connecting the specified points with straight-lines.

Abstract: A probe card registration method is for registering a probe card for use in inspecting electrical characteristics of a target object in a probe apparatus for performing the inspecting. The probe card registration method includes detecting a height of a load sensor provided at a mounting table for mounting thereon the target object by using a first imaging unit disposed above the mounting table; contacting the load sensor with a probe by moving the load sensor by the mounting table; and stopping the movement of the load sensor when the load sensor starts to make contact with the probe. The method further includes calculating a height of a needle of the probe based on a height of the load sensor and a stop height thereof.

Abstract: A probing method measures electrical characteristics of an object to be inspected by bringing a probe needle to make a contact with an electrode pad of the object, the probe needle formed to be vertically pointing the object. The method includes the steps of: mounting the object on a mounting table; aligning the object and the probe needle; thereafter, contacting the probe needle with the electrode pad by moving the mounting table upwards, and then moving the mounting table vertically upwards while moving same horizontally to rend an oxide film formed on a surface of the electrode pad, so that a tip of the probe needle is stuck into the electrode pad and the probe needle and the electrode pad to conduct with each other.

Abstract: A method of detecting a neurodegenerative disease includes (a) a standardization step of creating a first image by applying anatomical standardization to a brain nuclear medical image; (b) a conversion step of creating a second image by converting the pixel value of each pixel of an image based on the first image into a z score or a t value; (c) an addition step of calculating the sum of the pixel values of individual pixels in a predetermined region of interest in the second image; and (d) a detection step of obtaining the results of the detection of the neurodegenerative disease through an operation of comparison of the sum with a predetermined threshold.

Abstract: A probe card registration method is for registering a probe card for use in inspecting electrical characteristics of a target object in a probe apparatus for performing the inspecting. The probe card registration method includes detecting a height of a load sensor provided at a mounting table for mounting thereon the target object by using a first imaging unit disposed above the mounting table; contacting the load sensor with a probe by moving the load sensor by the mounting table; and stopping the movement of the load sensor when the load sensor starts to make contact with the probe. The method further includes calculating a height of a needle of the probe based on a height of the load sensor and a stop height thereof.

Abstract: A probing method measures electrical characteristics of an object to be inspected by bringing a probe needle to make a contact with an electrode pad of the object, the probe needle formed to be vertically pointing the object. The method includes the steps of: mounting the object on a mounting table; aligning the object and the probe needle; thereafter, contacting the probe needle with the electrode pad by moving the mounting table upwards, and then moving the mounting table vertically upwards while moving same horizontally to rend an oxide film formed on a surface of the electrode pad, so that a tip of the probe needle is stuck into the electrode pad and the probe needle and the electrode pad to conduct with each other.

Abstract: A method is for calculating a height of a chuck top. A height of the top surface of the chuck top which corresponds to an arbitrary position specified on the XY coordinate plane by a computer is calculated in each of the four quadrants based on a coordinate transformation formulas. The method includes setting, by using the computer, a conical model in which two adjacent points other than the center point of the chuck top which correspond to the specified coordinates in a predetermined quadrant of the XY coordinate plane are obtained on a circumference having the center point of the chuck top as the origin and specifying an arbitrary point in the predetermined quadrant by using the computer and calculating a height of the arbitrary point of the chuck top based on the conical model, the coordinate transformation formulas and the specified coordinates.

Abstract: Disclosed is a probing method comprising steps of moving a main chuck to align an object of inspection on the main chuck with probes of a probe card located over the main chuck, moving the main chuck toward the probe card, thereby bringing electrodes of the object of inspection into contact with the probes, overdriving the main chuck toward the probe card while measuring a load applied to the object of inspection by contact with the probes and controlling the movement of the main chuck in accordance with the measured load, and inspecting the electrical properties of the object of inspection by means of the probes.

Abstract: Disclosed is a probing method comprising steps of moving a main chuck to align an object of inspection on the main chuck with probes of a probe card located over the main chuck, moving the main chuck toward the probe card, thereby bringing electrodes of the object of inspection into contact with the probes, overdriving the main chuck toward the probe card while measuring a load applied to the object of inspection by contact with the probes and controlling the movement of the main chuck in accordance with the measured load, and inspecting the electrical properties of the object of inspection by means of the probes.

Abstract: A probing method including the steps of moving a main chuck to align an object of inspection on the main chuck with probes of a probe card located over the main chuck. The method includes moving the main chuck toward the probe card, thereby bringing electrodes of the object of inspection into contact with the probes, and overdriving the main chuck toward the probe card while measuring a load applied to the object of inspection by contact with the probe and controlling the movement of the main chuck in accordance with the measured load. The method also includes inspecting the electrical properties of the object of inspection using the probes.

Abstract: With a probe-test method and a prober for examining certain electric characteristics of an object of examination, a main chuck is adapted to be driven to move in the X-, Y-, Z- and &thgr;-directions in order to bring the object into contact with the probes of the prober and then the shaft of the support of the main chuck is warped under the contact pressure applied by the probes to tilt the main chuck. The position where each of the probes contacts the corresponding one of the electrodes on the object is displaced (moved) in the X-, Y- and Z-directions by the tilt. The displacement is predicted by an operation. unit and the main chuck is moved in the X-, Y- and Z-directions to correct the displacement.

Abstract: A connector for connecting a column with two beams in a building unit constructed with a plurality of columns and beams connected to each other comprises a core portion having the same sectional shape as the column and a branch portion having a web and parallel flanges enclosing the web in a right angles state, so that two surfaces of said core portion relate to the web and flanges in a state contacting to each other at right angles.