Abstract: A substrate processing apparatus includes a substrate processing part configured to process a substrate under a vacuum atmosphere, a substrate transfer part connected to the substrate processing part and configured to transfer the substrate under an air atmosphere, and a load lock part disposed between the substrate processing part and the substrate transfer part and configured to switch between the air atmosphere and the vacuum atmosphere. At least a part of the load lock part is disposed inside the substrate transfer part.

Abstract: A substrate processing apparatus includes a substrate processing part configured to process a substrate under a vacuum atmosphere, a substrate transfer part connected to the substrate processing part and configured to transfer the substrate under an air atmosphere, and a load lock part disposed between the substrate processing part and the substrate transfer part and configured to switch between the air atmosphere and the vacuum atmosphere. At least a part of the load lock part is disposed inside the substrate transfer part.

Abstract: Disclosed herein is a vertical heat treatment system capable of simplifying the structure of various mechanisms in the vicinity of an opening which is formed in a partition wall separating a housing-box transfer area from a treating-object transfer area (a wafer transfer area), and of contributing to space saving, when an object to be treated is carried in the vertical heat treatment system through the opening to carry out a predetermined treatment.

Abstract: An end of the slot plate of the microwave antenna, which constitutes a microwave plasma processing apparatus, is held and fixed by being held between a pair of metal bodies.

Abstract: There is provided a vertical heat treatment system capable of simplifying the structure of various mechanisms in the vicinity of an opening which is formed in a partition wall separating a housing-box transfer area from a treating-object transfer area (a wafer transfer area), and of contributing to space saving, when an object to be treated is carried in the vertical heat treatment system through the opening to carry out a predetermined treatment.

Abstract: A heat treatment system and method for cooling a loading chamber that includes a heat treatment furnace for heat-treating an object to be treated. The heat treatment furnace includes a throat for carrying the object in and out, and a cooling mechanism for cooling the vicinity of the throat. The cooling mechanism has a ventilating unit with a ventilating port for sending a cooling fluid toward the vicinity of the throat and a heat exchanger arranged so as to face the ventilating port in the vicinity of the throat. The cooling mechanism also has an intake fan for sucking the cooling fluid in the vicinity of the throat over the heat exchanger. When the object to be treated is carried in, the structure of various mechanisms in the vicinity of the throat is simplified, and space is saved.

Abstract: A processing system for an object to be processed has a housing defining a closed space. The housing is provided with an opening through which an airtight carrying box is carried in and carried out. The carrying box hermetically contains the object to be processed. A lid operating mechanism for opening and closing the lid of the carrying box is disposed near the opening. A contamination preventing duct covers a space around the lid of the carrying box and supplies a clean gas of a high cleanliness therein at least when the lid of the carrying box is opened.

Abstract: An opening and closing apparatus (52, 54) opens and closes an opening and closing lid (10) which closes an opening part (4) of an accommodating box (2) for accommodating an object (W) to be processed and is locked by a locking mechanism (12). A key member (26) is mounted to a base table (90) via a bearing mechanism (92) in a state in which the key member is rotatable with respect to the base table (90) and movable in a vertical direction with respect to a front surface of the base table (90). A part of the opening and closing lid (10) is held by being put between the key member (26) and an elastic member (98) provided on a front surface of the base table. Thereby, the opening and closing lid (10) is prevented from being displaced with respect to the base table (90) when the opening and closing lid (10) is removed from the accommodation box (2).

Abstract: A processing system for an object to be processed has a housing defining a closed space. The housing is provided with an opening through which an airtight carrying box is carried in and carried out. The carrying box hermetically contains the object to be processed. A lid operating mechanism for opening and closing the lid of the carrying box is disposed near the opening. A contamination preventing duct covers a space around the lid of the carrying box and supplies a clean gas of a high cleanliness therein at least when the lid of the carrying box is opened.

Abstract: There is provided a vertical heat treatment system capable of simplifying the structure of various mechanisms in the vicinity of an opening which is formed in a partition wall separating a housing-box transfer area from a treating-object transfer area (a wafer transfer area), and of contributing to space saving, when an object to be treated is carried in the vertical heat treatment system through the opening to carry out a predetermined treatment.

Abstract: A vertical heat treatment apparatus for semiconductor wafers (W) including a heat treating furnace (19) which is heated to 600.degree. C. or higher. In the heat treating furnace (19), the wafers (W) are subjected to batch treatment while they are placed on a boat (16). A preparatory vacuum chamber (102) is airtightly connected to a lower side of the heat treating furnace (19). Disposed in the preparatory vacuum chamber (102) are a horizontal transfer mechanism (201) and a vertical transfer mechanism (202) for transferring the boat (16). The two transfer mechanisms (201 and 202) are supported by support members (29a and 33a) mounted on a mechanical base (28). The preparatory vacuum chamber (102) and the support members (29a and 33a) are airtightly connected to each other by means of bellows.

Abstract: The vertical heat treatment apparatus for semiconductor wafers (W) includes a heat treatment furnace (19). In the heat treatment furnace (19), the wafers (W) are subjected to a batch treatment in a state mounted on a boat (16). To the lower side of the heat treatment furnace (19), a preparatory vacuum chamber (102) is airtightly connected through a manifold (33). The manifold (33) has first and second parts (33a and 33b) separably coupled to each other, which are connected to the heat treatment furnace (19) and the preparatory vacuum chamber (102), respectively. The second part (33b) defines a valve seat on which a lid (22) is seated to cut off the communication between the heat treatment furnace (19) and the preparatory vacuum chamber (102).

Abstract: A heat treatment apparatus comprising a holder, a hollow cylindrical cover, a flat plate, and a processing chamber. The holder holds disk-shaped objects, each having an orientation flat portion at circumference. The objects are arranged coaxially and spaced at predetermined intervals, with the orientation flat portions aligned with one another. The cover has gas ports and surrounds the objects held by the holder and is spaced from a circumference of each object by a predetermined distance. The flat plate is mounted on an inner surface of the cover and opposes the orientation flat portions of the objects. In the processing chamber, the objects held by the holder are processed by using a process gas.

Abstract: A vertical heat treatment system for heat treating a large number of semiconductor wafers housed in a boat at once includes a heat treatment unit having a boat loading/unloading port, a boat section communicating with the heat treatment unit through the boat loading/unloading port, an elevator mechanism for loading/unloading the boat between the boat section and the heat treatment unit through the boat loading/unloading port, a cassette section provided adjacent to the boat section, a wafer transfer mechanism for transferring wafers between a cassette and the boat, a gas supply mechanism for supplying a non-oxidization gas into the boat section, and a gas shower means for blowing the non-oxidization gas to the wafers in the vicinity of the boat loading/unloading port.

Abstract: A clean air apparatus includes a housing having an opening through which a carrier housing semiconductor wafers is supplied into the housing and an I/O port for supporting the carrier and a furnace for treating the wafer, provided in the upper portion of the housing. The carriers are at the same time supported by a first carrier stage provided in the upper portion of the housing and supported by a second carrier stage provided in the lower portion of the housing. The carrier or carriers are selectively moved between the I/O port and the first stage, between the I/O port and the second stage, and between the first stage and the second stage. A clean air is applied to the wafers in the carriers supported by the I/O port, the first stage and the second stage.

Abstract: A vertical heat treating apparatus comprises a casing having an opening through which articles to be processed are loaded and unloaded, a heat treating furnace provided in the casing, a loading and unloading mechanism provided under the heat treating furnace so as to load the articles to be processed in and unload the same from the heat treating furnace, and a clean air flow forming unit provided in a space which is formed in the casing and in which the loading and unloading mechanism is provided so as to form a clean air flow conducted from one side of the casing to the opposite side thereof.

Abstract: A vertical type of heat-treating apparatus is provided with a housing that has an opening portion for the carrying in of an object to be processed to the front surface, a heat-treating furnace for performing the required heat-treatment to the object to be processed and which is provided inside the housing, a standby space for the standby of the objects to be processed and carried into the heat-treating apparatus which is provided underneath the heat-treating furnace, a cleaning air introduction opening provided to a lower portion of the housing, a feed path separated from the standby space and connected to the cleaning air introduction opening, a recirculation path which makes one portion of cleaning gas passed the standby space to flow once again to the standby space, and an air exhaust opening for the exhaust to outside the housing of cleaning air which passes through the standby space.

Abstract: A clean air apparatus comprises a body in which clean air is supplied, an I/O port having an opening for carrying a carrier housing objects to be treated in/out of the body, a door which opens/closes the opening, and dust preventing device for preventing dusts from entering the body from the outside through the opening, when the door is opened.

Abstract: A heat processing apparatus of the vertical type includes a box which has a process tube in the upper half thereof and a space in the lower half thereof. A cap for the process tube can be moved up and down between an upper position where the cap closes the process tube while holding a wafer boat on it and a lower position in the space where it opens the process tube. Clean air is supplied into the space through a dust removing filter located on one side of the space and exhausted from the space through the other side of the space. The air thus exhausted is collected by a gas processing system, which serves to remove harmful components from the air thus collected. A scavenger is arranged enclosing the open bottom of the process tube. Gas remaining in the process tube after the heat process is sucked by the scavenger and collected by another gas processing system.

Abstract: A semiconductor processing apparatus comprises a main body having an air passage, a plurality of filter units connected in series with the air passage in the main body, each filter unit having an air intake port, an air otlet port and an air blower, the air intake port of each filter unit communicating with the air outlet ports of the filter units disposed upstream side of the air passage, and a mechanism for arranging articles to be processed close to the air outlet port of each filter unit such that air is supplied to the articles to be processed after the air has passed through the corresponding filter units.