Patents by Inventor Kazuno Shoji

Kazuno Shoji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three-dimensionally formed circuit sheet, component and method for manufacturing the same
    Patent number: 7262489
    Abstract: A three-dimensionally formed circuit sheet comprises a resin film and a circuit pattern formed of an electrically conductive paste on the resin film. The electrically conductive paste contains, as a binder, a resin that is three-dimensionally formable. The resin film and the circuit pattern are formed in a three-dimensional shape. A method for manufacturing the three-dimensionally formed circuit sheet is also provided. The method comprises forming a circuit pattern on a resin film using an electrically conductive paste by means of printing, wherein the electrically conductive paste contains a resin that is three-dimensionally formable, and press molding the resin film including the circuit pattern into a three-dimensional shape. Additionally, a three-dimensionally formed circuit component comprising a three-dimensionally formed circuit sheet and a base member and a method for manufacturing the same are disclosed.
    Type: Grant
    Filed: November 8, 2004
    Date of Patent: August 28, 2007
    Assignee: Polymatech Co., Ltd.
    Inventor: Kazuno Shoji
  • Three-dimensionally formed circuit sheet, component and method for manufacturing the same
    Publication number: 20050098857
    Abstract: A three-dimensionally formed circuit sheet comprises a resin film and a circuit pattern formed of an electrically conductive paste on the resin film. The electrically conductive paste contains, as a binder, a resin that is three-dimensionally formable. The resin film and the circuit pattern are formed in a three-dimensional shape. A method for manufacturing the three-dimensionally formed circuit sheet is also provided. The method comprises forming a circuit pattern on a resin film using an electrically conductive paste by means of printing, wherein the electrically conductive paste contains a resin that is three-dimensionally formable, and press molding the resin film including the circuit pattern into a three-dimensional shape. Additionally, a three-dimensionally formed circuit component comprising a three-dimensionally formed circuit sheet and a base member and a method for manufacturing the same are disclosed.
    Type: Application
    Filed: November 8, 2004
    Publication date: May 12, 2005
    Inventor: Kazuno Shoji