Abstract: A resin composition of a saponified product of an ethylenic copolymer, which comprises 100 parts by weight of a saponified product of a copolymer of ethylene and vinyl acetate having 5 to 50 mol % of recurring units of --CH.sub.2 --CH.sub.2 -- based on the ethylene monomer and also having a saponification degree of about 80% or more and 5 to 150 parts by weight of a polyamide having a relative viscosity of 2.1 to 3.5 and being subjected to terminal end modification leaving carboxylic end groups of 3.times.10.sup.-5 equivalent/g or less.The resin composition of the present invention has the gas barrier property, rigidity and heat resistance, and also is improved in pinhole resistance or impact resistance, and therefore it can be suitably used as packaging materials or functional parts.