Abstract: A photo-electronic device including a package having a main body portion containing parts including a photoelectric conversion element at inside thereof and a guide portion a front end of which faces the photoelectric conversion element for guiding, in a penetrated state, an optical fiber for transmitting and receiving light to and from the photoelectric conversion element, in which the optical fiber is fixed to the guide portion by adhering agent at the guide portion and portions of the main body portion including the photoelectric conversion element and a front end portion of the optical fiber are covered by a protective film formed by a resin transparent to the light and a dam is provided between the protective film and the adhering agent such that the protective film and the adhering agent are not brought into contact with each other.

Abstract: A photo-electronic device including a package having a main body portion containing parts including a photoelectric conversion element at inside thereof and a guide portion a front end of which faces the photoelectric conversion element for guiding, in a penetrated state, an optical fiber for transmitting and receiving light to and from the photoelectric conversion element, in which the optical fiber is fixed to the guide portion by adhering agent at the guide portion and portions of the main body portion including the photoelectric conversion element and a front end portion of the optical fiber are covered by a protective film formed by a resin transparent to the light and a dam is provided between the protective film and the adhering agent such that the protective film and the adhering agent are not brought into contact with each other.

Abstract: It is a subject to realize an optoelectronic device for reliably monitoring a laser optical beam intensity by a photodetector. In the optoelectric device, a semiconductor laser chip, an optical fiber for taking a front laser beam of the semiconductor laser chip from the top end surface and a photodetector for receiving a rear laser beam of the semiconductor laser chip are fixed on a main surface of a platform, and each of the optical parts and portions including an optical channels between each of the optical parts are covered with a silicone gel, wherein a portion of the main surface of the platform between the top end of the optical fiber and the semiconductor laser chip and between the photodetector and the semiconductor laser chip has concaves so that voids are not formed upon curing of the silicone gel. The edge of the concave on the side of the semiconductor laser chip is situated closer to the semiconductor laser chip than to the emitting facet of the semiconductor laser chip.

Abstract: Modified HV1-type hirudinin which valine at the N-terminal end of the HV1-type hirudin and aspartic acid at the 5th residue of the N-terminal end were replaced with alanine and glutamic acid, respectively. A secretion plasmid into which a DNA sequence coding for a precursor with an addition of a secretion signal of neutral protease of Bacillus amyloliquefaciens at the N-terminal end of this modified HV1-type hirudin is integrated is introduced into bacteria of the genus Bacillus and the precursor is expressed intracellularly. The modified HV1-type hirudin can be efficiently secreted extracellularly while maintaining its high thrombin inhibiting activity.