Abstract: A composite conductive particle according to the present invention includes a first conductive particle having a particle diameter of greater than or equal to 0.1 ?m and less than or equal to 50 ?m; and a second conductive particle adhering to the surface of the first conductive particle and having a particle diameter of greater than or equal to 50 nm and less than or equal to 1000 nm, and the first conductive particle is composed of a first particle and a first metal coating covering the surface of the first particle, the second conductive particle is composed of a second particle and a second metal coating covering the surface of the second particle, a particle diameter of the first conductive particle is larger than a particle diameter of the second conductive particle, and an adhering rate of the second conductive particle.

Abstract: The present invention relates to a method for manufacturing a circuit board including the steps of preparing a substrate containing silicon at least at a surface, applying a paste containing aluminum particles onto the substrate, forming a conductor layer on the substrate by firing the substrate to which the paste has been applied, forming a resist film having a specific pattern on the conductor layer, and removing with an etchant, the conductor layer in a portion where the resist film has not been formed, the etchant containing fluoride ions and metal ions of a metal M of which standard electrode potential is higher in value than a standard electrode potential of aluminum, and to a circuit board which can be manufactured with such a method.

Abstract: The present invention relates to conductive particles. The conductive particles contain core particles containing aluminum and a metal film covering the core particles, the metal film is higher in conductivity than the core particles, and a surface coverage of the core particles with the metal film is not lower than 80%.

Abstract: To provide a high-frequency-vibration-assisted electrolytic grinding method and a device therefor in which micro abrasive grains can be used so as to improve the grinding accuracy and efficiency. A high-frequency-vibration-assisted electrolytic grinding method in which a work is grinded by a grinding stone while electrolytic reaction is performed by applying a voltage between the grinding stone and the work through an electrolytic solution and high-frequency vibration is transmitted to the grinding stone or the work wherein; the grinding stone has non-conductive micro abrasive grains with grain sizes of less than #400 in accordance with the JIS R6001 standard of grinding stones for precision polishing projecting from its surface formed of conductive binding material, and the distance between the grinding stone and the work, which is regulated by the projecting lengths of the micro abrasive grains from the base of the grinding stone, is set to less than 0.02 mm.

Abstract: The present invention relates to a method for manufacturing a circuit board including the steps of preparing a substrate containing silicon at least at a surface, applying a paste containing aluminum particles onto the substrate, forming a conductor layer on the substrate by firing the substrate to which the paste has been applied, forming a resist film having a specific pattern on the conductor layer, and removing with an etchant, the conductor layer in a portion where the resist film has not been formed, the etchant containing fluoride ions and metal ions of a metal M of which standard electrode potential is higher in value than a standard electrode potential of aluminum, and to a circuit board which can be manufactured with such a method.

Abstract: A composite conductive particle according to the present invention includes a first conductive particle having a particle diameter of greater than or equal to 0.1 ?m and less than or equal to 50 ?m; and a second conductive particle adhering to the surface of the first conductive particle and having a particle diameter of greater than or equal to 50 nm and less than or equal to 1000 nm, and the first conductive particle is composed of a first particle and a first metal coating covering the surface of the first particle, the second conductive particle is composed of a second particle and a second metal coating covering the surface of the second particle, a particle diameter of the first conductive particle is larger than a particle diameter of the second conductive particle, and an adhering rate of the second conductive particle.

Abstract: The present invention relates to conductive particles. The conductive particles contain core particles containing aluminum and a metal film covering the core particles, the metal film is higher in conductivity than the core particles, and a surface coverage of the core particles with the metal film is not lower than 80%.

Abstract: To provide a high-frequency-vibration-assisted electrolytic grinding method and a device therefor in which micro abrasive grains can be used so as to improve the grinding accuracy and efficiency. A high-frequency-vibration-assisted electrolytic grinding method in which a work is grinded by a grinding stone while electrolytic reaction is performed by applying a voltage between the grinding stone and the work through an electrolytic solution and high-frequency vibration is transmitted to the grinding stone or the work wherein; the grinding stone has non-conductive micro abrasive grains with grain sizes of less than #400 in accordance with the JIS R6001 standard of grinding stones for precision polishing projecting from its surface formed of conductive binding material, and the distance between the grinding stone and the work, which is regulated by the projecting lengths of the micro abrasive grains from the base of the grinding stone, is set to less than 0.02 mm.

Abstract: The present invention provides a flake-form conductive filler which is easy and low-cost to produce and has a high conductivity. The flake-form conductive filler of the present invention includes a flake-form base material and a silver coating covering the entire surface of the flake-form base material. The flake-form base material contains copper. The flake-form conductive filler has a ratio a/b between a peak intensity “a” derived from a silver (111) plane and a peak intensity “b” derived from a silver (220) plane at 2 or less in the powder X-ray diffraction measurement.

Abstract: Provided are an electrically conductive paste composition capable of easily and inexpensively forming, on a variety of substrates or in electronic devices, an electrically conductive film such as electrodes and wires excellent in electrical conductivity, surface smoothness properties, and properties of adhesion with a base material; and an electrically conductive film formed by using the above-mentioned electrically conductive paste composition. The electrically conductive paste composition includes flaky aluminum particles as an electrically conductive powder, an average thickness of the flaky aluminum particles is less than or equal to 0.8 ?m, and a ratio of an oxygen content to a unit surface area of the flaky aluminum particles is less than or equal to 15 mg/m2.

Abstract: A method of generating exposure data includes the steps of generating first exposure data representing a common portion shared by different exposure images, generating second exposure data representing portions which differ between the different exposure images, and defining at least one non-exposure area with regard to the first exposure data, the at least one non-exposure area corresponding to the portions that differ between the different exposure images and defining an area where no exposure is performed by the first exposure data.

Abstract: Grouping is performed by classifying the data of features having same shapes and sizes in the same layer into the same group. In the grouping, a feature size having lengths of two adjacent sides of a rectangle inscribed by the feature is obtained to attach the size to the feature data, and if feature data has the same kind, layer and size, the same group name is attached to the feature data. When a feature data is selected by an operator to modify it, the other feature data having the same group name are automatically modified in the same manner.

Abstract: Grouping is performed by classifying the data of features having same shapes and sizes in the same layer into the same group. In the grouping, a feature size having lengths of two adjacent sides of a rectangle inscribed by the feature is obtained to attach the size to the feature data, and if feature data has the same kind, layer and size, the same group name is attached to the feature data. When a feature data is selected by an operator to modify it, the other feature data having the same group name are automatically modified in the same manner.