Patents by Inventor Kazunori Nakata

Kazunori Nakata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat-generating component cooling structure
    Patent number: 7315450
    Abstract: A heat-generating component cooling structure includes a hollow heat sink having a portion made of a thermally conductive material. The heat sink has an interior path extending from first to second ends of the heat sink. A fan device is disposed at the first end of the heat sink and is adapted to cause air to flow through the interior path. Fins are disposed in the path in the heat sink. Heat-generating components of an electrical circuit are mounted on an outer surface of the heat sink.
    Type: Grant
    Filed: August 31, 2005
    Date of Patent: January 1, 2008
    Assignee: Sansha Electric Manufacturing Company, Limited
    Inventors: Hideo Ishii, Masao Katooka, Kazunori Nakata, Yuji Ikejiri
  • Power supply apparatus
    Patent number: 7256994
    Abstract: An opening is formed in a case. Air is caused to flow through the interior of the case. A panel closes the opening. A printed circuit board is disposed behind the panel within the case. A plurality of components, including a control device which can be operated on the front surface of the panel and a display device providing a display viewable on the front surface of the panel, are mounted on the printed circuit board. The printed circuit board is enclosed in a closed receptacle disposed within the case.
    Type: Grant
    Filed: October 14, 2005
    Date of Patent: August 14, 2007
    Assignee: Sansha Electric Manufacturing Company, Limited
    Inventors: Hideo Ishii, Masao Katooka, Kazunori Nakata, Takeshi Morimoto, Yuji Ikejiri
  • Power supply apparatus
    Publication number: 20070086159
    Abstract: An opening is formed in a case. Air is caused to flow through the interior of the case. A panel closes the opening. A printed circuit board is disposed behind the panel within the case. A plurality of components, including a control device which can be operated on the front surface of the panel and a display device providing a display viewable on the front surface of the panel, are mounted on the printed circuit board. The printed circuit board is enclosed in a closed receptacle disposed within the case.
    Type: Application
    Filed: October 14, 2005
    Publication date: April 19, 2007
    Inventors: Hideo Ishii, Masao Katooka, Kazunori Nakata, Takeshi Morimoto, Yuji Ikejiri
  • Heat-generating component cooling structure
    Publication number: 20050286226
    Abstract: A heat-generating component cooling structure includes a hollow heat sink having a portion made of a thermally conductive material. The heat sink has an interior path extending from first to second ends of the heat sink. A fan device is disposed at the first end of the heat sink and is adapted to cause air to flow through the interior path. Fins are disposed in the path in the heat sink. Heat-generating components of an electrical circuit are mounted on an outer surface of the heat sink.
    Type: Application
    Filed: August 31, 2005
    Publication date: December 29, 2005
    Inventors: Hideo Ishii, Masao Katooka, Kazunori Nakata, Yuji Ikejiri