Patents by Inventor Kazunori Taguchi

Kazunori Taguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230382057
    Abstract: An adhesive application device includes a coater and an air conditioning device. The coater includes a roll and a roll temperature control device. The roll has an elongated shape having an axis and outer surface and is rotatable around the axis. The roll holds thermosetting adhesive on the outer surface and applies the thermosetting adhesive to an application surface of a sheet member with the first roll being rotated and contacted with the sheet member. The roll temperature control device is disposed adjacent to the roll and configured to lower temperature of the outer surface of the roll to control viscosity of the thermosetting adhesive held by the roll to be appropriate application viscosity that is appropriate for application to the sheet member. The air conditioning device is configured to adjust temperature and humidity of air in a space near the coater.
    Type: Application
    Filed: May 18, 2023
    Publication date: November 30, 2023
    Applicant: TOYOTA BOSHOKU KABUSHIKI KAISHA
    Inventors: Yuji Kato, Kazunori TAGUCHI, Xuyang FANG, Yoshiki ITAKURA, Tadayoshi UMEMURA
  • Publication number: 20220005783
    Abstract: The present invention has an object to enhance manufacturability of a pressure-contact-type semiconductor device. A pressure-contact-type semiconductor device according to the present invention includes: a semiconductor chip, the semiconductor chip including a guard ring and a gate signal input/output part in the first main surface; a first external electrode being formed on a side of the first main surface of the semiconductor chip; a conductive pattern being formed on the first external electrode; a contact pin connecting the gate signal input/output part and the conductive pattern; a plate-like electrode being provided on the second main surface of the semiconductor chip; a disc spring being provided on the plate-like electrode; and a second external electrode being provided on the disc spring, the second external electrode and the first external electrode interposing the semiconductor chip.
    Type: Application
    Filed: January 23, 2019
    Publication date: January 6, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventors: Jun OKADA, Tetsuo MOTOMIYA, Kazunori TAGUCHI
  • Publication number: 20180127520
    Abstract: A method for producing a hydrogenated ring-opening metathesis polymer includes subjecting a cyclic olefin to ring-opening metathesis polymerization in the presence of a polymerization catalyst to produce a ring-opening metathesis polymer, and hydrogenating at least some of carbon-carbon double bonds of the ring-opening metathesis polymer, at least one ruthenium compound selected from a group made of a ruthenium compound represented by a formula (I), (II), (III), and (IV) being used as the polymerization catalyst; and a resin composition having a hydrogenated ring-opening metathesis polymer produced by this method. It is possible to industrially advantageously produce a hydrogenated ring-opening metathesis polymer that exhibits especially excellent light transmittance.
    Type: Application
    Filed: November 2, 2017
    Publication date: May 10, 2018
    Applicant: ZEON CORPORATION
    Inventors: Takashi TSUTSUMI, Kazunori TAGUCHI, Yumi OHSAKU
  • Patent number: 9850325
    Abstract: A method for producing a hydrogenated ring-opening metathesis polymer includes subjecting a cyclic olefin to ring-opening metathesis polymerization in the presence of a polymerization catalyst to produce a ring-opening metathesis polymer, and hydrogenating at least some of carbon-carbon double bonds of the ring-opening metathesis polymer, at least one ruthenium compound selected from a group made of a ruthenium compound represented by a formula (I), (II), (III), and (IV) being used as the polymerization catalyst; and a resin composition having a hydrogenated ring-opening metathesis polymer produced by this method. It is possible to industrially advantageously produce a hydrogenated ring-opening metathesis polymer that exhibits especially excellent light transmittance.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: December 26, 2017
    Assignee: ZEON CORPORATION
    Inventors: Takashi Tsutsumi, Kazunori Taguchi, Yumi Ohsaku
  • Publication number: 20150291074
    Abstract: The carpet is a tufted carpet for automobiles formed by implanting pile yarns into a base fabric, including: a high basis weight part having the pile yarns implanted at a high basis weight, a low basis weight part having the pile yarns implanted at a low basis weight lower than the high basis weight, and a middle basis weight part provided between the high basis weight part and the low basis weight part and having the pile yarns implanted at a basis weight between those of the high basis weight part and the low basis weight part. The basis weight of the middle basis weight part becomes smaller stepwise from the side adjacent to the high basis weight part toward the side adjacent to the low basis weight part.
    Type: Application
    Filed: December 2, 2013
    Publication date: October 15, 2015
    Applicants: TOYOTA BOSHOKU KABUSHIKI KAISHA, HASETORA SPINNING CO., LTD.
    Inventors: Kazunori Taguchi, Kengo Hatano, Atsuhiro Hattori, Kazuharu Hase
  • Publication number: 20150051353
    Abstract: A method for producing a hydrogenated ring-opening metathesis polymer includes subjecting a cyclic olefin to ring-opening metathesis polymerization in the presence of a polymerization catalyst to produce a ring-opening metathesis polymer, and hydrogenating at least some of carbon-carbon double bonds of the ring-opening metathesis polymer, at least one ruthenium compound selected from a group made of a ruthenium compound represented by a formula (I), (II), (III), and (IV) being used as the polymerization catalyst; and a resin composition having a hydrogenated ring-opening metathesis polymer produced by this method. It is possible to industrially advantageously produce a hydrogenated ring-opening metathesis polymer that exhibits especially excellent light transmittance.
    Type: Application
    Filed: March 14, 2013
    Publication date: February 19, 2015
    Inventors: Takashi Tsutsumi, Kazunori Taguchi, Yumi Ohsaku
  • Patent number: 8853739
    Abstract: A pressure contact semiconductor device includes a cathode post electrode and a gate electrode formed on a top surface of a substrate, an anode post electrode formed on a bottom surface thereof, a circuit substrate, a cathode flange overlapping the cathode post electrode and connected to the circuit substrate, a cathode fin electrode overlapping the cathode flange, an anode fin electrode underlapping and the anode post electrode, a gate flange connected to both the gate electrode and the circuit substrate, a securing member having a parallel portion parallel to the circuit substrate and a perpendicular portion perpendicular to the circuit substrate, the perpendicular portion being secured to a side of the cathode fin electrode, and a spacer formed from plate material and secured at the top to the parallel portion of the securing member and at the bottom to the circuit substrate.
    Type: Grant
    Filed: February 13, 2012
    Date of Patent: October 7, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventor: Kazunori Taguchi
  • Patent number: 8519223
    Abstract: As an effective means of controlling Aphanomyce cochlioides, to provide a method of highly accurately selecting an Aphanomyce cochlioides-resistant plant variety by using a molecular biological method without depending on the phenotype. To efficiently grow the resultant Aphanomyce cochlioides-resistant plant variety. A method of selecting an Aphanomyce cochlioides-resistant plant variety based on the AFLP method with the use of primers for selecting an Aphanomyce cochlioides-resistant plant variety which strongly link with the locus of an allele having the dominant phenotype of the resistance against Aphanomyce cochlioides.
    Type: Grant
    Filed: April 25, 2007
    Date of Patent: August 27, 2013
    Assignee: National Agriculture and Food Research Organization
    Inventors: Kazunori Taguchi, Naoki Oogata, Kazuyuki Okazaki, Keiji Nakatsuka, Hiroyuki Takahashi
  • Patent number: 8456001
    Abstract: A pressure-contact semiconductor device (100) includes thermal buffer plates (2) and main electrode blocks (3) having flanges (4), by which semiconductor substrate (1) having a pair of electrodes is sandwiched, disposed opposed to each side thereof, wherein the semiconductor substrate (1) is sealed in a gastight space by joining the flanges (4) to insulating container (5). The semiconductor device (100) is configured such that the outermost periphery of the semiconductor substrate (1) is enclosed by hollow cylindrical insulator (9) fitted on outer peripheries of the main electrode blocks (3) in the gastight space with O-rings (8) fitted between the main electrode blocks (3) and the cylindrical insulator (9), and sealed with reaction force from the O-rings (8).
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: June 4, 2013
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazunori Taguchi, Kenji Oota
  • Publication number: 20120326208
    Abstract: A pressure contact semiconductor device includes a cathode post electrode and a gate electrode formed on a top surface of a substrate, an anode post electrode formed on a bottom surface thereof, a circuit substrate, a cathode flange overlapping the cathode post electrode and connected to the circuit substrate, a cathode fin electrode overlapping the cathode flange, an anode fin electrode underlapping and the anode post electrode, a gate flange connected to both the gate electrode and the circuit substrate, a securing member having a parallel portion parallel to the circuit substrate and a perpendicular portion perpendicular to the circuit substrate, the perpendicular portion being secured to a side of the cathode fin electrode, and a spacer formed from plate material and secured at the top to the parallel portion of the securing member and at the bottom to the circuit substrate.
    Type: Application
    Filed: February 13, 2012
    Publication date: December 27, 2012
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Kazunori TAGUCHI
  • Publication number: 20090222941
    Abstract: As an effective means of controlling Aphanomyce cochlioides, to provide a method of highly accurately selecting an Aphanomyce cochlioides-resistant plant variety by using a molecular biological method without depending on the phenotype. To efficiently grow the resultant Aphanomyce cochlioides-resistant plant variety. A method of selecting an Aphanomyce cochlioides-resistant plant variety based on the AFLP method with the use of primers for selecting an Aphanomyce cochlioides-resistant plant variety which strongly link with the locus of an allele having the dominant phenotype of the resistance against Aphanomyce cochlioides.
    Type: Application
    Filed: April 25, 2007
    Publication date: September 3, 2009
    Inventors: Kazunori Taguchi, Naoki Oogata, Kazuyuki Okazaki, Keiji Nakatsuka, Hiroyuki Takahashi
  • Publication number: 20080073767
    Abstract: A pressure-contact semiconductor device (100) includes thermal buffer plates (2) and main electrode blocks (3) having flanges (4), by which semiconductor substrate (1) having a pair of electrodes is sandwiched, disposed opposed to each side thereof, wherein the semiconductor substrate (1) is sealed in a gastight space by joining the flanges (4) to insulating container (5). The semiconductor device (100) is configured such that the outermost periphery of the semiconductor substrate (1) is enclosed by hollow cylindrical insulator (9) fitted on outer peripheries of the main electrode blocks (3) in the gastight space with O-rings (8) fitted between the main electrode blocks (3) and the cylindrical insulator (9), and sealed with reaction force from the O-rings (8).
    Type: Application
    Filed: March 9, 2007
    Publication date: March 27, 2008
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kazunori TAGUCHI, Kenji OOTA
  • Patent number: 7037993
    Abstract: A norbornene ring-opened polymer which in the molecule has repeating units represented by the formula (1): wherein R1 represents Q, R2 represents Q or C(?O)R5, R3 represents Q or C(?O)R6, and R4 represents Q or X—C(?O)R7 (wherein Q represents hydrogen, a C1-10 hydrocarbon group, etc.; R5, R6 and R7 each represents hydroxyl, C1-10 alkoxyl, etc., provided that R6 and R7 may be bonded to each other to constitute oxygen, NH, etc.; X represents methylene, etc., provided that when R2 is Q, then R3 is C(?O)R6 and R4 is X—C(?O)R7 and that when R4 is Q, then R2 is C(?O)R5, R3 is C(?O)R6, and the configuration of R2 and R3 is trans, and m is 0 or 1), the polymer having a weight-average molecular weight as determined by gel permeation chromatography of 1,000 to 1,000,000. Also provided is a hydrogenation product of the norbornene ring-opened polymer. The norbornene ring-opened polymer and the hydrogenation product are excellent in heat resistance, electrical properties, etc.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: May 2, 2006
    Assignee: Zeon Corporation
    Inventors: Kazunori Taguchi, Seiji Okada, Yasuo Tsunogae
  • Patent number: 6995226
    Abstract: A ring-opened metathesis copolymer and its hydrogenated product having a desired monomer unit ratio and a high molecular weight and having hydroxyl groups or hydroxycarbonyl groups can be obtained by conducting a ring-opening metathesis copolymerization of a norbornene-type monomer having hydroxyl groups or hydroxycarbonyl groups with an unsubstituted norbornene-type monomer having at least three rings in the presence of a catalyst predominantly comprised of an organic ruthenium compound having coordinated therewith a neutral electron-donating ligand, and, if desired, hydrogenating the resulting copolymer. The thus-obtained ring-opened metathesis copolymer and its hydrogenation product are characterized by having a low water absorption, good adhesion to metal and other materials, good compatibility with a curing agent and other compounds, and high heat resistance, and exhibiting reduced signal retardation and signal noise.
    Type: Grant
    Filed: June 5, 2002
    Date of Patent: February 7, 2006
    Assignee: Zeon Corporation
    Inventors: Kazunori Taguchi, Yasuo Tsunogae, Hitomi Takeuchi, Yasuhiro Wakisaka, Kei Sakamoto
  • Publication number: 20050148746
    Abstract: A norbornene ring-opened polymer which in the molecule has repeating units represented by the formula (1): wherein R1 represents Q, R2 represents Q or C(?O)R5, R3 represents Q or C(?O)R6, and R4 represents Q or X—C(?O)R7 (wherein Q represents hydrogen, a C1-10 hydrocarbon group, etc.; R5, R6 and R7 each represents hydroxyl, C1-10 alkoxyl, etc., provided that R6 and R7 may be bonded to each other to constitute oxygen, NH, etc.; X represents methylene, etc., provided that when R2 is Q, then R3 is C(?O)R6 and R4 is X—C(?O)R7 and that when R4 is Q, then R2 is C(?O)R5, R3 is C(?O)R6, and the configuration of R2 and R3 is trans, and m is 0 or 1), the polymer having a weight-average molecular weight as determined by gel permeation chromatography of 1,000 to 1,000,000. Also provided is a hydrogenation product of the norbornene ring-opened polymer. The norbornene ring-opened polymer and the hydrogenation product are excellent in heat resistance, electrical properties, etc.
    Type: Application
    Filed: April 7, 2003
    Publication date: July 7, 2005
    Applicant: Zeon Corporation
    Inventors: Kazunori Taguchi, Seiji Okada, Yasuo Tsunogae
  • Patent number: 6908970
    Abstract: A process for producing a hydrogenated product of a polymer prepared through ring-opening polymerization which comprises a polymerization step of polymerizing a cyclic olefin through ring-opening polymerization in the presence of a polymerization catalyst comprising an organoruthenium compound or an organoosmium compound to prepare a polymer, and a hydrogenation step of adding a hydrogenation catalyst and hydrogen into a polymerization system resulting from the polymerization step to hydrogenate the carbon-carbon double bonds of the polymer prepared through the ring-opening polymerization. When the organoruthenium compound- or organoosmium compound-containing catalyst further comprises a carbene compound, the catalyst exhibits a higher activity for the ring-opening polymerization.
    Type: Grant
    Filed: October 7, 2002
    Date of Patent: June 21, 2005
    Assignee: Zeon Corporation
    Inventors: Yasuo Tsunogae, Masato Sakamoto, Masaharu Tokoro, Kazunori Taguchi
  • Publication number: 20040152843
    Abstract: A ring-opened metathesis copolymer and its hydrogenated product having a desired monomer unit ratio and a high molecular weight and having hydroxyl groups or hydroxycarbonyl groups can be obtained by conducting a ring-opening metathesis copolymerization of a norbornene-type monomer having hydroxyl groups or hydroxycarbonyl groups with an unsubstituted norbornene-type monomer having at least three rings in the presence of a catalyst predominantly comprised of an organic ruthenium compound having coordinated therewith a neutral electron-donating ligand, and, if desired, hydrogenating the resulting copolymer. The thus-obtained ring-opened metathesis copolymer and its hydrogenation product are characterized by having a low water absorption, good adhesion to metal and other materials, good compatibility with a curing agent and other compounds, and high heat resistance, and exhibiting reduced signal retardation and signal noise.
    Type: Application
    Filed: March 9, 2004
    Publication date: August 5, 2004
    Inventors: Kazunori Taguchi, Yasuo Tsunogae, Hitomi Takeuchi, Yasuhiro Wakisaka, Kei Sakamoto
  • Patent number: 6707144
    Abstract: A semiconductor device has a semiconductor element housed in a ceramic cylinder as an insulated vessel, and plural gate terminals. Plural through-holes are formed in the ceramic cylinder. Leads connected to gate terminals pass through their respective through-holes. The leads are connected to internal gate terminals (electrodes). Each internal gate terminal is provided for each lead and connected electrically to a gate electrode of the semiconductor element.
    Type: Grant
    Filed: September 24, 2002
    Date of Patent: March 16, 2004
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Kazunori Taguchi
  • Publication number: 20030183841
    Abstract: A semiconductor device has a semiconductor element housed in a ceramic cylinder as an insulated vessel, and plural gate terminals. Plural through-holes are formed in the ceramic cylinder. Leads connected to gate terminals pass through their respective through-holes. The leads are connected to internal gate terminals (electrodes). Each internal gate terminal is provided for each lead and connected electrically to a gate electrode of the semiconductor element.
    Type: Application
    Filed: September 24, 2002
    Publication date: October 2, 2003
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventor: Kazunori Taguchi
  • Patent number: 6624448
    Abstract: A semiconductor device having a supporting member that reduces a resonance phenomenon. A pair of reinforcing members is fixed on a gate drive substrate with spacers interposed there between and upright portions of the pair of reinforcing members are fastened with screws on a side wall of a cathode flange. A spacer is fixed on the gate drive substrate and a projection of the spacer is inserted in an engaging member fixed on the bottom of the cathode fin electrode and thus fixed on the bottom of the cathode fin electrode. The pair of upright portions as the first and second supporting points and the projection of the spacer as the third supporting point stably support the gate drive substrate on the cathode fin electrode without freedom of rotation at the three positions arranged to surround an opening.
    Type: Grant
    Filed: April 2, 2001
    Date of Patent: September 23, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kazunori Taguchi, Kazuhiro Morishita, Kenji Oota