Abstract: A medical diagnostic imaging apparatus includes an execution unit configured to execute a plurality of imaging protocols included in an examination; and a display control unit configured to display a first screen and a second screen, where the first screen selectably displays a plurality of image datasets collected based on the respective imaging protocols after execution of the plurality of imaging protocols as well as extracts and displays postprocessing applications applicable to individual ones of the image datasets while the second screen is brought up by transitioning from the first screen and used to perform postprocessing of the image datasets, wherein when an application associated with a predetermined image dataset is selected on the first screen, the display control unit starts the selected application and transitions from the first screen to the second screen to perform postprocessing of the predetermined image dataset.

Abstract: A medical image-processing apparatus includes a display unit configured to display a plurality of medical images obtained at different imaging positions, a setting unit configured to set a point of interest on each of the medical images in accordance with an operation of an operator, an alignment unit configured to align the medical images on the display unit, with the points of interest on the medical images made to coincide with each other, and a post-processing unit configured to perform post processing concerning the medical images aligned by the alignment unit.

Abstract: An electric stapler is operated by a paper bundle pinching step of relatively moving a table part and a driver unit and also pinching a paper bundle; a staple separation step of folding a staple into U-shape by a forming plate and also separating the folded U-shape staple from a staple sheet by moving a driver; a penetration step of penetrating legs of the staple into the paper bundle by further moving the driver; a clinch step of inward folding the legs by a clinch device; and a paper bundle releasing step. A relative movement of the table part and the driver unit, the forming plate, the driver, and the clinch device are powered by a single motor. A driving speed of the motor in the steps excluding the penetration step and the clinch step is slower than the driving speed of the motor in the penetration step and the clinch step.

Abstract: A staple leg cutting mechanism includes a fixed cutter interposed between staple legs penetrated through binding sheets and a pair of movable cutters disposed movable from the outside of the staple legs to the inside thereof, and a clincher mechanism that includes a pair of movable clinchers, respectively disposed on the lower surface side of their associated movable cutters. The staple legs penetrated through the binding sheets are formed in an inwardly curved manner by the movable clinchers and are then guided into and between the movable cutters and fixed cutter. The movable cutters are moved from the outside of the staple legs to the inside thereof to cut the leading end portions of the staple legs, and the staple legs are bent along the binding sheets by the movable clinchers.

Abstract: A nozzle plate includes: a nozzle for discharging a liquid as droplets; a liquid-repellent film suppressing attachment of the droplets on one surface of the nozzle plate; and a first bonding film formed on the other surface of the nozzle plate and bonded with a substrate. In the nozzle plate, the liquid-repellent film includes a first plasma polymerized film having a Si skeleton, which includes a siloxane (Si—O) bond and has a random atomic structure, and an elimination group bonded with the Si skeleton.

Abstract: A droplet ejection head comprises: a substrate having first through-holes forming reservoir chambers, a second through-hole forming a supply chamber, and a bonding film on one surface; a nozzle plate having nozzles for ejecting ejection liquid and one surface contacting the bonding film, the nozzle plate is bonded to the substrate through the bonding film to cover the first through-holes and the second through-hole; a sealing plate on another surface of the substrate covering the first through-holes, one surface of the sealing plate contacting the substrate's another surface; and piezoelectric means on another surface of the sealing plate for driving the droplet ejection head. The bonding film containing an Si-skeleton constituted of constituent atoms containing silicon atoms, with siloxane (Si—O) bonds and elimination groups bonded to the silicon atoms, the constituent atoms being randomly bonded together, and the elimination groups existing near a surface of the bonding film.

Abstract: A droplet ejection head comprises: a substrate having first through-holes forming reservoir chambers, a second through-hole forming a supply chamber, and a bonding film on one surface; a nozzle plate having nozzles for ejecting ejection liquid and a second bonding film on one surface, the first and second films being bonded together to cover the first through-holes and the second through-hole; a sealing plate on another surface of the substrate covering the first through-holes, one surface of the sealing plate contacting the substrate's another surface; and piezoelectric means on another surface of the sealing plate for driving the droplet ejection head. The bonding films contain an Si-skeleton of constituent atoms containing silicon atoms, with siloxane (Si—O) bonds and elimination groups bonded to the silicon atoms, the constituent atoms being randomly bonded together, and the elimination groups existing near a surface of the bonding films.

Abstract: A slide frame is mounted on a driver unit that can be vertically reversed on a base frame. A guide pin disposed in the slide frame engages with a concave portion of a cam plate portion formed in the base frame. When a fixation releasing handle of the driver unit is operated, a lever pushes the slide frame to slide the slide frame and the guide pin is deviated from the concave portion to rotate the driver unit. In a state where the driver unit is fixed in a regular posture, since the guide pin is pushing a switch lever, the detection switch is kept turned ON and thus an electric stapler is in an operable state. When the driver unit is rotated, the switch lever is released from the press of the guide pin and the detection switch is turned OFF, thereby cutting off the power.

Abstract: A staple leg cutting mechanism 5 is composed of a fixed cutter 6 interposed between staple legs S1 penetrated through binding sheets and a pair of movable cutters 7 disposed movable from the outside of the staple legs S1 to the inside thereof, and a clincher mechanism 10 is composed of a pair of movable clinchers 11 respectively disposed on the lower surface side of their associated movable cutters 7, whereby the staple legs S1 penetrated through the binding sheets are formed in an inwardly curved manner by the movable clinchers 11 and are then guided into and between the movable cutters 7 and fixed cutter 6, the movable cutters 7 are moved from the outside of the staple legs S1 to the inside thereof to thereby cut the leading end portions of the staple legs S1, and the staple legs S1 are bent along the binding sheets by the movable clinchers 11.

Abstract: A staple leg cutting mechanism 5 is composed of a fixed cutter 6 interposed between staple legs S1 penetrated through binding sheets and a pair of movable cutters 7 disposed movable from the outside of the staple legs S1 to the inside thereof, and a clincher mechanism 10 is composed of a pair of movable clinchers 11 respectively disposed on the lower surface side of their associated movable cutters 7, whereby the staple legs S1 penetrated through the binding sheets are formed in an inwardly curved manner by the movable clinchers 11 and are then guided into and between the movable cutters 7 and fixed cutter 6, the movable cutters 7 are moved from the outside of the staple legs S1 to the inside thereof to thereby cut the leading end portions of the staple legs S1, and the staple legs S1 are bent along the binding sheets by the movable clinchers 11.

Abstract: A stapler 1 is provided with a cutter unit 12 for cutting a leading end portion of a staple leg projected to a back face side of sheets. A staple cartridge 20 containing a number of staples is formed with a chip containing portion 23 for containing a chip of the staple leg. The chip of the staple leg cut by the cutter unit 12 is guided into the chip containing portion 23 of the staple cartridge 20 by a chute 22 formed on the cutter unit 12. The chip of the staple leg is collected in the staple cartridge 20.

Abstract: A forming plate and a driver plate are held at a front portion of a path of supplying connected staples in a laminated state. A staple in a C-shape formed at an inside of a strike out path formed between a front end face of a supply path and a back face of the face plate arranged on a front side of the supply path is pressed to supply to inside of the strike out path toward the face plate by a pusher urged by a spring. The staple is struck out by the driver plate. The pusher is made to constitute a first pusher, and a second pusher for pressing a leg portion of the staple to the face plate is aligned to be arranged to a side of a staple strike out port of the first pusher.

Abstract: A base member including a bonding film comprises a substrate; and the bonding film provided on the substrate. The base member is capable of bonding to an opposite substrate (object) through the bonding film. Such a bonding film contains a Si-skeleton constituted of constituent atoms containing silicon atoms and elimination groups bonded to the silicon atoms of the Si-skeleton. The Si-skeleton includes siloxane (Si—O) bonds. The constituent atoms are bonded to each other. Further, a crystallinity degree of the Si-skeleton is equal to or lower than 45%. Furthermore, in a case where energy is applied to at least a part region of the surface of the bonding film, the elimination groups existing on the surface and in the vicinity of the surface within the region are removed from the silicon atoms of the Si-skeleton so that the region develops a bonding property with respect to the opposite substrate.

Abstract: A base member including a bonding film comprises a substrate; and the bonding film provided on the substrate. The base member is capable of bonding to an opposite substrate (object) through the bonding film. Such a bonding film contains a Si-skeleton constituted of constituent atoms containing silicon atoms and elimination groups bonded to the silicon atoms of the Si-skeleton. The Si-skeleton includes siloxane (Si—O) bonds. The constituent atoms are bonded to each other. Further, the bonding film is formed by a plasma polymerization. Furthermore, in a case where energy is applied to at least a part region of the surface of the bonding film, the elimination groups existing on the surface and in the vicinity of the surface within the region are removed from the silicon atoms of the Si-skeleton so that the region develops a bonding property with respect to the opposite substrate.

Abstract: A cut chip of a staple leg cut by a cutter unit is discharged to a lower face side of the cutter unit by way of an opening formed at the cutter unit. The cut chip is guided in directions of both sides of the stapler by a pair of chutes arranged on a lower face side of the cutter unit to be continuous to the opening portion. The cut chip guided by the chutes is guided to a containing portion formed at a rear lower portion of the stapler by way of guide case portions formed at both side faces of the stapler.

Abstract: An electric stapler is operated by the steps of: a paper bundle pinching step of relatively moving a table part (10) and a driver unit (3) and also pinching a paper bundle (19); a staple separation step of folding a staple into U-shape by a forming plate (8) and also separating the folded U-shape staple (22) from a staple sheet (20) by moving a driver (7); a penetration step of penetrating legs (24) of the staple (22) into the paper bundle (19) by further moving the driver (7); a clinch step of inward folding the legs (24) penetrating through the paper bundle (19) by a clinch device (5); and a paper bundle releasing step of releasing the paper bundle (19). A relative movement of the table part (10) and the driver unit (3), the forming plate (8), the driver (7), and the clinch device are powered by a single motor (13). A driving speed of the motor (13) in the steps excluding the penetration step and the clinch step is slower than the driving speed of the motor (13) in the penetration step and the clinch step.

Abstract: A bonded body according to the present invention comprises a first object comprised of a first substrate and a first bonding film formed on the first substrate and a second object comprised of a second substrate and a second bonding film formed on the second substrate. The first and second bonding films contain a Si-skeleton constituted of constituent atoms containing silicon atoms and elimination groups bonded to the silicon atoms of the Si-skeleton. The Si-skeleton includes siloxane (Si—O) bonds. The constituent atoms are bonded to each other. When an energy is applied to at least a part region of the surface of each of the first and second bonding films, the elimination groups existing in the vicinity of the surface within the region are removed from the silicon atoms of the Si-skeleton so that each region develops a bonding property with respect to the other film to thereby bond the first and second objects together through the first and second bonding films.

Abstract: A staple cartridge provided with a cartridge main body and a refill contained with connected staples. The refill is interchangeably attached to the cartridge main body. A guide portion for guiding the connected staples at an inside of the refill to a staple strike out portion is provided between a refill mounting portion and the staple strike out portion. Lower portions of the guide portion and the refill mounting portion are respectively arranged with a first actuator operated in accordance with a presence/absence of the connected staples at an inside of the guide portion and a second actuator provided in accordance with a presence/absence of the connected staples at an inside of the refill mounting portion. The first actuator and the second actuator are interlocked.

Abstract: A droplet ejection head comprises: a substrate having first through-holes forming reservoir chambers, a second through-hole forming a supply chamber, and a bonding film on one surface; a nozzle plate having nozzles for ejecting ejection liquid and one surface contacting the bonding film, the nozzle plate is bonded to the substrate through the bonding film to cover the first through-holes and the second through-hole; a sealing plate on another surface of the substrate covering the first through-holes, one surface of the sealing plate contacting the substrate's another surface; and piezoelectric means on another surface of the sealing plate for driving the droplet ejection head. The bonding film containing an Si-skeleton constituted of constituent atoms containing silicon atoms, with siloxane (Si—O) bonds and elimination groups bonded to the silicon atoms, the constituent atoms being randomly bonded together, and the elimination groups existing near a surface of the bonding film.

Abstract: A droplet ejection head comprises: a substrate having first through-holes forming reservoir chambers, a second through-hole forming a supply chamber, and a bonding film on one surface; a nozzle plate having nozzles for ejecting ejection liquid and a second bonding film on one surface, the first and second films being bonded together to cover the first through-holes and the second through-hole; a sealing plate on another surface of the substrate covering the first through-holes, one surface of the sealing plate contacting the substrate's another surface; and piezoelectric means on another surface of the sealing plate for driving the droplet ejection head. The bonding films contain an Si-skeleton of constituent atoms containing silicon atoms, with siloxane (Si—O) bonds and elimination groups bonded to the silicon atoms, the constituent atoms being randomly bonded together, and the elimination groups existing near a surface of the bonding films.