Abstract: The reflecting member for a surface light source according to the present invention is characterized by forming a white coating film on the surface of a molded metal part having a prescribed shape. According to the present invention, a reflecting member for a surface light source wherein a white coating film having sufficient reflecting properties is formed on a metal part even if a metal part having a curved part of a small curvature radius can be provided.

Abstract: A ceramic substrate comprising a metallic layer on its surface, wherein said metallic layer includes: a silver layer containing silver; a gold layer containing gold; and a nickel layer containing nickel, in this order from an outermost layer of said metallic layer.

Abstract: A method for fabricating a component board which includes forming a first main-face-side Au plating layer on surfaces of main-face-side connection terminals and a first back-face-side Au plating layer on surfaces of back-face-side connection terminals of the component board; covering the first main-face-side Au plating layer with a protection layer; forming a second back-face-side Au plating layer on the first back-face-side Au plating layer; and removing the protection layer after completing the second Au plating step. Alternatively, the first back-face-side Au plating layer may be removed after completing the masking step. Displacement Au plating is used as the first and second Au plating.

Abstract: A manufacturing method for a single crystal of calcium fluoride by which it is possible to obtain a single crystal of calcium fluoride with adequately small double refraction, which can be used in optical systems for photolithography, and in particular, a single crystal of calcium fluoride with a large diameter (ø200 mm or larger) having superior optical properties, which can be used for photolithography with a wavelength of 250 nm or less.

Abstract: An armature coil winder for winding coils at high density while restricting coil ends within a restricted space in an armature core assembly having a plurality of slots in an outer circumference thereof and a series of continuous coils, the coil winder including a fixed former for guiding one of the continuous coils into two of the slots, and a movable former for restricting a position of a coil end of one of the continuous coils between the two slots by moving in the fixed former along both end surfaces of the armature core assembly toward a center of the core assembly; a former slider including a flyer for winding one of the continuous coils around the fixed former; and a coil shaping mechanism including coil shaping blades for shaping one of the continuous coils in the slots relative to the armature core assembly. The use of such a winder to form coils of an armature core assembly is also described.

Abstract: A destructive device, wherein treated material (1) including a foam body is pre-compressed in thickness direction and fed to the opposed part of a pair of compression rolls (21, 22), partition walls forming independent air bubbles in the foam body is destructed by the compression rolls (21, 22) and foam gas is arrested into a cover (3) installed on the outlet side of the compression rolls (21, 22), the foam gas is liquefied and separated by a cooling and liquefying device (6) through a cooling device (15) after pressurized, together with medium gas (41) for collection, by a pressurizing device (5), and the medium gas for collection from which the foam gas is separated is returned into the cover (3), whereby, since the foam gas is liquefied and separated in pressurized state by the cooling and liquefying device (6) by arresting the foam gas in high density inside the cover (3), the device can be remarkably downsized and simplified, and a device cost and an operation cost can also be remarkably reduced.

Abstract: An Al—Mg—Si series alloy ingot consisting essentially of Si: 0.2 to 0.8 wt %, Mg: 0.3 to 0.9 wt %, Fe: 0.5 wt % or less, Cu: 0.20 wt % or less and the balance being aluminum and inevitable impurities, or an Al—Mg—Si series alloy ingot consisting essentially of Si: 0.2 to 0.8 wt %, Mg: 0.3 to 0.9 wt %, Fe: 0.5 wt % or less, Cu: 0.20 wt % or less, Zn: 0.5 wt % or less and the balance being aluminum and inevitable impurities, is prepared. The alloy ingot is homogenized, then subjected to rough hot rolling and finish hot rolling, and finally to cold rolling. One of plural passes performed at the rough hot rolling is controlled such that material temperature immediately before the aforementioned one of passes is from 350 to 440 ° C., cooling rate during the aforementioned one of plural passes is 50° C./min or more, material temperature immediately after the aforementioned one of passes is from 250 to 340° C.

Abstract: A method for manufacturing an Al—Mg—Si series alloy plate includes the steps of hot-rolling and subsequently cold-rolling an Al—Mg—Si series alloy ingot. The Al—Mg—Si series alloy ingot consists of Si: 0.2 to 0.8 mass %, Mg: 0.3 to 1 mass %, Fe: 0.5 mass % or less, Cu: 0.5 mass % or less, at least one of elements selected from the group consisting of Ti: 0.1 mass % or less and B: 0.1 mass % or less and the balance being Al and inevitable impurities. Heat-treating for holding a rolled ingot at 200 to 400° C. for 1 hour or more is performed after a completion of the hot-rolling but before a completion of the cold-rolling.

Abstract: An Al—Mg—Si series alloy ingot consisting essentially of Si:0.2-0.8 wt %, Mg:0.3-0.9 wt %, Fe:0.35 wt % or less, Cu:0.20 wt % or less and the balance of aluminum and inevitable impurities is prepared. The alloy ingot is homogenized, then subjected to rough hot rolling and finish hot rolling, and finally to cold rolling. One of the rough hot rolling is controlled such that material temperature immediately before one of the rough hot rolling is from 350 to 440° C., cooling rate between one of the rough hot rolling and rough hot rolling subsequent thereto is 50° C./min or more, material temperature immediately after one of the rough hot rolling is from 250 to 340° C. and plate thickness immediately after one of the rough hot rolling is 10 mm or less. The cold rolling is controlled such that rolling reduction is 30% or more.

Abstract: A printed circuit board includes a number of ball-shaped terminals provided on one main surface of the board. Each of the ball-shaped terminals includes a metallic ball brazed on a pad provided on the main surface of the board. A thin gold layer is deposited by plating on the surface of the metallic ball.

Abstract: Method and apparatus for short-term relining or construction of a blast furnace uses a grounding apparatus for grounding of ring-shaped blast furnace segments having shells and a casting floor present as a blast furnace floor for transferring the ring-shaped blocks or shells onto a foundation of the blast furnace, and capable of safely and precisely mounting the ring-like blocks on the casting floor, wherein the grounding apparatus is integrated with a jack system utilizing rod type lift jacks and a sliding apparatus installed with intermittently movable hydraulic cylinders for safe and precision mounting of the ring-shaped blocks or shells on the casting floor.

Abstract: In order to realize thinned armatures, a winder which winds coils at a high density while restricting coil ends within a restricted space is provided. An armature coil winder for winding coils in an armature core assembly having a plurality of slots in an outer circumference thereof comprising a winding former equipped with a fixed former which guides a coil into two slots and a movable former which restricts a position of a coil end between the slots by moving in the fixed former along both end surfaces of an armature core toward a center thereof, a former slider which shifts the movable former to a specified position, and coil shaping mechanism which is disposed at location other than that of the former slider and equipped with coil shaping blades functioning to shape the coil in the slots, thereby making it possible to wind coils at a high density by effectively utilizing winding spaces.

Abstract: In order to realize thinned armatures, a winder which winds coils at a high density while restricting coil ends within a restricted space is provided. An armature coil winder for winding coils in an armature core assembly having a plurality of slots in an outer circumference thereof comprising a winding former equipped with a fixed former which guides a coil into two slots and a movable former which restricts a position of a coil end between the slots by moving in the fixed former along both end surfaces of an armature core toward a center thereof, a former slider which shifts the movable former to a specified position, and coil shaping mechanism which is disposed at location other than that of the former slider and equipped with coil shaping blades functioning to shape the coil in the slots, thereby making it possible to wind coils at a high density by effectively utilizing winding spaces.

Abstract: A printed-wiring substrate 1 has main-face-side connection terminals 33 for solder-bonding to connection terminals 83 of an IC chip 81 on a main face 1A thereof and back-face-side connection terminals 41 for connecting, through mechanical contact, to connection terminals 93 of a motherboard 91 on a back face 1B thereof. The surface of each of the main-face-side connection terminals 33 is covered with a main-face-side displacement Au plating layer 45 having a thickness of 0.03 to 0.12 &mgr;m, and the surface of each of the back-face-side connection terminals 41 is covered with a back-face-side displacement Au plating layer 55, which is thicker than the main-face-side displacement Au plating layer 45 and has a thickness of 0.2 &mgr;m or greater.

Abstract: An Al—Mg—Si series alloy ingot consisting essentially of Si:0.2-0.8 wt %, Mg:0.3-0.9 wt %, Fe:0.35 wt % or less, Cu:0.20 wt % or less and the balance of aluminum and inevitable impurities is prepared. The alloy ingot is homogenized, then subjected to rough hot rolling and finish hot rolling, and finally to cold rolling. One of the rough hot rolling is controlled such that material temperature immediately before one of the rough hot rolling is from 350 to 440° C., cooling rate between one of the rough hot rolling and rough hot rolling subsequent thereto is 50° C./min or more, material temperature immediately after one of the rough hot rolling is from 250 to 340° C. and plate thickness immediately after one of the rough hot rolling is 10 mm or less. The cold rolling is controlled such that rolling reduction is 30% or more.

Abstract: An olefinic thermoplastic elastomer composition which does not exhibit problems due to a softening agent such as an oil is superior in molding processability. The thermoplastic elastomer composition is produced by a heat crosslinking process of a resin-rubber composition that contains an olefinic and/or diene rubber, an olefinic resin, and a vinyl copolymer. The vinyl copolymer is obtained by copolymerizing 20 wt % or more of a vinyl monomer represented by CH2═CHOCOR1 or CH2═CHOR2 wherein R1 and R2 are alkyl groups having 1-6 carbon atoms. The thermoplastic elastomer composition can include a vinyl copolymer that has not undergone a heat crosslinking process.

Abstract: A printed-wiring substrate 1 has main-face-side connection terminals 33 for solder-bonding to connection terminals 83 of an IC chip 81 on a main face 1A thereof and back-face-side connection terminals 41 for connecting, through mechanical contact, to connection terminals 93 of a motherboard 91 on a back face 1B thereof. The surface of each of the main-face-side connection terminals 33 is covered with a main-face-side displacement Au plating layer 45 having a thickness of 0.03 to 0.12 &mgr;m, and the surface of each of the back-face-side connection terminals 41 is covered with a back-face-side displacement Au plating layer 55, which is thicker than the main-face-side displacement Au plating layer 45 and has a thickness of 0.2 &mgr;m or greater.

Abstract: In order to realize thinned armatures, a winder which winds coils at a high density while restricting coil ends within a restricted space is provided. An armature coil winder for winding coils in an armature core assembly having a plurality of slots in an outer circumference thereof comprising a winding former equipped with a fixed former which guides a coil into two slots and a movable former which restricts a position of a coil end between the slots by moving in the fixed former along both end surfaces of an armature core toward a center thereof, a former slider which shifts the movable former to a specified position, and coil shaping mechanism which is disposed at location other than that of the former slider and equipped with coil shaping blades functioning to shape the coil in the slots, thereby making it possible to wind coils at a high density by effectively utilizing winding spaces.

Abstract: An image sensing apparatus for converting an object image into a video signal, including an diffraction grating optical low-pass filter having a diffraction grating surface (1h) for suppressing a fake signal caused by an interference of the pixel pitch of CCD (1i) and spatial frequency of the object image under high luminance condition. A control device (1n) incorporated in the image sensing apparatus controls the speed of electrical shutter of the CCD (1i) or it controls the insertion of an ND (Neutral Density) filter in an object image light path (3) to maintain the aperture of an iris device (1k) within the predetermined level to keep the aperture of an iris (1k) within a predetermined level in order to suppress the interference of the pixel pitch of CCD and the spatial frequency of the object image so that the fake signal can be suppressed.

Abstract: In a resinous circuit board having a circuitized substrate having conductive layers therewithin, a plurality of pin pads formed on a rear surface of the substrate, and a plurality of pins, each pin having a tip end portion and a head portion and soldered to the pin pad in such a manner as to contact at the head portion to the pin pad. The head portion of the pin consists of a flange section which is larger in diameter than the tip end portion, and a part-spherical abutment section bulging from the flange section in the direction opposite to the tip end portion and brought into contact with the pin pad. The part-spherical abutment section is made of eutectic silver solder which is lower in melting point than solder such as Sn—Ag solder which is used for soldering the pin to the pin pad. Since the silver solder and soft solder are present between the flange section and the pin pad, they can release the stress applied to the pin, thus making it possible to increase the joining strength considerably.