Patents by Inventor Kazuo Nakabayashi

Kazuo Nakabayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Selective plating apparatus and selective plating method
    Patent number: 7713398
    Abstract: A selective plating apparatus for applying selective electrolytic plating to a metal member includes: a mask member having a recess portion so that a space is formed to which predetermined parts of a surface of the metal member are exposed when the mask member is attached to the metal member, and having at least one supply opening for supplying electrolytic plating solution into the space and a discharge opening for discharging the electrolytic plating solution from the space both formed in a bottom portion of the recess portion; and at least one injection nozzle which injects the electrolytic plating solution in an oblique direction with respect to the predetermined parts of the surface of the metal member, and is arranged in vicinity of the supply opening.
    Type: Grant
    Filed: May 23, 2006
    Date of Patent: May 11, 2010
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Yoko Ogihara, Takeshi Takano, Kazuo Nakabayashi
  • SELECTIVE PLATING APPARATUS AND SELECTIVE PLATING METHOD
    Publication number: 20060283713
    Abstract: A selective plating apparatus for applying selective electrolytic plating to a metal member includes: a mask member having a recess portion so that a space is formed to which predetermined parts of a surface of the metal member are exposed when the mask member is attached to the metal member, and having at least one supply opening for supplying electrolytic plating solution into the space and a discharge opening for discharging the electrolytic plating solution from the space both formed in a bottom portion of the recess portion; and at least one injection nozzle which injects the electrolytic plating solution in an oblique direction with respect to the predetermined parts of the surface of the metal member, and is arranged in vicinity of the supply opening.
    Type: Application
    Filed: May 23, 2006
    Publication date: December 21, 2006
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Yoko Ogihara, Takeshi Takano, Kazuo Nakabayashi