Abstract: To provide a map information output apparatus and a map information output method which can reduce a time lag of the positional shift correction of the map information acquired corresponding to the position coordinate of the ego vehicle, when traveling the curve road. A map information output apparatus acquires map information corresponding to a position coordinate of an ego vehicle from map data; acquires a map road shape corresponding to a road where the ego vehicle is traveling; detects a detection road shape where the ego vehicle is traveling based on detection information of a periphery monitoring apparatus; and corrects position information of the map information with respect to a position of the ego vehicle, based on map curvature information which is curvature information included in the map road shape, and detection curvature information which is curvature information included in the detection road shape.

Abstract: A problem to be solved is to provide an exhaust promotion method, an exhaust promotion device, and an exhaust system improvement method for an internal combustion engine capable of further improving the exhaust efficiency by high-speed exhaust of exhaust gas. What is characteristic is that an exhaust gas discharged from the internal combustion engine is expanded in multiple stages repeatedly to reduce a temperature thereof, and thus exhaustion is performed while suppressing a behavior derived from a thermal energy of the exhaust gas.

Abstract: A problem to be solved is to provide an exhaust promotion method, an exhaust promotion device, and an exhaust system improvement method for an internal combustion engine capable of further improving the exhaust efficiency by high-speed exhaust of exhaust gas. What is characteristic is that an exhaust gas discharged from the internal combustion engine is expanded in multiple stages repeatedly to reduce a temperature thereof, and thus exhaustion is performed while suppressing a behavior derived from a thermal energy of the exhaust gas.

Abstract: Embodiments are generally directed to a swaging process for complex integrated heat spreaders. An embodiment of an integrated heat spreader includes components, each of the components including one or more swage points; and a multiple swage joints, each swage joint including a swage pin joining two or more components, wherein components are joined into a single integrated heat spreader unit by the swage joints.

Abstract: An antenna of the present invention includes a laminate body including a conductor core, an insulator layer, and a conductor pattern. The conductor pattern is a conductor layer formed of a conducting body disposed on a radially outer side of the insulator layer. The conductor core and the conductor pattern are connected to each other in such a manner that a current is made to flow in a direction from the conductor core to the conductor pattern or in a direction opposite thereto so as to coincide with a power supply direction.

Abstract: An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.

Abstract: An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.

Abstract: An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.

Abstract: An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.

Abstract: An antenna of the present invention includes a laminate body including a conductor core, an insulator layer, and a conductor pattern. The conductor pattern is a conductor layer formed of a conducting body disposed on a radially outer side of the insulator layer. The conductor core and the conductor pattern are connected to each other in such a manner that a current is made to flow in a direction from the conductor core to the conductor pattern or in a direction opposite thereto so as to coincide with a power supply direction.

Abstract: The image forming apparatus reads an original conveyed in the image forming apparatus, analyzes a feature value of information about an original image on the read original, generates an image to overwrite the original image with, using image data having the feature value obtained based on an analysis result, sets a predetermined area on the original image, and overwrites the predetermined area on the original image with the generated image.

Abstract: An integrated heat spreader is disclosed in which grooves are formed in a recess of the heat spreader to enhance the stiffness and strength of the integrated heat spreader without increasing production costs or complexity. The integrated heat spreader may be fabricated by providing a metal strip having raised portions thereon to provide a recess therebetween, forming grooves on a bottom surface of the recess, where the grooves extend along a periphery of the bottom surface which is substantially free of the raised portions, and subsequently singulating an integrated heat spreader from the metal strip.

Abstract: An integrated heat spreader comprising a heat spreader frame that has a plurality of openings formed therethrough and a plurality of thermally conductive structures secured within the heat spreader frame openings. The thermally conductive structures can be formed to have various thicknesses which compensate for varying heights between at least two microelectronic devices in a multi-chip package. The thermally conductive structures can be secured in the heat spreader frame by sizing the openings and the thermally conductive structures such that the thermally conductive structures can be secured within the openings without requiring welding or adhesives.

Abstract: The image forming apparatus reads an original conveyed in the image forming apparatus, analyzes a feature value of information about an original image on the read original, generates an image to overwrite the original image with, using image data having the feature value obtained based on an analysis result, sets a predetermined area on the original image, and overwrites the predetermined area on the original image with the generated image.

Abstract: An integrated heat spreader is disclosed in which grooves are formed in a recess of the heat spreader to enhance the stiffness and strength of the integrated heat spreader without increasing production costs or complexity. The integrated heat spreader may be fabricated by providing a metal strip having raised portions thereon to provide a recess therebetween, forming grooves on a bottom surface of the recess, where the grooves extend along a periphery of the bottom surface which is substantially free of the raised portions, and subsequently singulating an integrated heat spreader from the metal strip.

Abstract: An integrated heat spreader is disclosed in which grooves are formed in a recess of the heat spreader to enhance the stiffness and strength of the integrated heat spreader without increasing production costs or complexity. The integrated heat spreader may be fabricated by providing a metal strip having raised portions thereon to provide a recess therebetween, forming grooves on a bottom surface of the recess, where the grooves extend along a periphery of the bottom surface which is substantially free of the raised portions, and subsequently singulating an integrated heat spreader from the metal strip.

Abstract: An integrated heat spreader is disclosed in which grooves are formed in a recess of the heat spreader to enhance the stiffness and strength of the integrated heat spreader without increasing production costs or complexity. The integrated heat spreader may be fabricated by providing a metal strip having raised portions thereon to provide a recess therebetween, forming grooves on a bottom surface of the recess, where the grooves extend along a periphery of the bottom surface which is substantially free of the raised portions, and subsequently singulating an integrated heat spreader from the metal strip.

Abstract: In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic substrate, an interposer coupled with a surface of the organic substrate, the interposer having cavities to accept bumps of a die, and a flexible tape layer coupled with a surface of the interposer, the flexible tape layer to couple with bumps of the die. Other embodiments are also disclosed and claimed.

Abstract: In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic substrate, an interposer coupled with a surface of the organic substrate, the interposer having cavities to accept bumps of a die, and a flexible tape layer coupled with a surface of the interposer, the flexible tape layer to couple with bumps of the die. Other embodiments are also disclosed and claimed.