Abstract: Dispersoids having metal-oxygen groups that are suitable for the production of metal oxide thin-films at a low temperature of 200° C. or below and for the production of homogeneous organic-inorganic hybrid materials. The dispersoid having metal-oxygen bonds may be obtained by mixing a metal compound having at least three hydrolyzable groups with at least 0.5 mole but less than 2 moles of water per mole of the metal compound in an organic solvent, in the absence of an acid, a base, and/or a dispersion stabilizer, and at a temperature at or below the temperature at which the metal compound begins to hydrolyze, then raising the temperature to at least the temperature at which hydrolysis begins.

Abstract: The invention provides dispersoids having metal-oxygen groups which are suitable for the production of metal oxide thin-films at a low temperature of 200° C. or below and for the production of homogeneous organic-inorganic hybrid materials. The invention also provides metal oxide thin-films and organic-inorganic hybrid materials endowed with various capabilities, particularly organic-inorganic hybrid materials having a high refractive index and high transparency. Use is made of a dispersoid having metal-oxygen bonds which is obtained by mixing a metal compound having at least three hydrolyzable groups with at least 0.5 mole but less than 2 moles of water per mole of the metal compound in an organic solvent, in the absence of an acid, a base and/or a dispersion stabilizer, and at a temperature at or below the temperature at which the metal compound begins to hydrolyze, then raising the temperature to at least the temperature at which hydrolysis begins.

Abstract: An object of the present invention is to provide an electro-acoustic transducer having the effects of absorbing vibration and high-frequency noise, reducing the number of components, and preventing heat conduction at the same time. An electro-acoustic transducer according to the present invention includes: an electrically conductive capsule having an opening for electrically connecting internal circuitry to an external object; terminals which protrude from the opening to the outside; and a raised part which is a portion of the capsule on the opening side and is spaced with a gap from the internal structure of the capsule. The raised part and the terminals are arranged in such a manner that the raised part and all of the terminals are able to be directly soldered to a wiring board. The raised part may extend toward the terminals in such a manner that the opening is narrowed. Furthermore, the raised part may have a slit extending to the boundary between the raised part and the other part of the capsule.

Abstract: A resistance variable memory reduces the nonuniformity of resistance values after programming, so that a rewrite operation can be performed on a memory cell at high speed. A reference resistor is connected in series with the resistance variable memory cell, and a sensor amplifier detects whether the potential at an intermediate node between the memory cell and the reference resistor exceeds a given threshold voltage, so as to stop the write operation based on a detection result.

Abstract: There is provided a condenser microphone that has improved portability and that can be realized at low costs.

Abstract: A resistance variable memory reduces the nonuniformity of resistance values after programming, so that a rewrite operation can be performed on a memory cell at high speed. A reference resistor is connected in series with the resistance variable memory cell, and a sensor amplifier detects whether the potential at an intermediate node between the memory cell and the reference resistor exceeds a given threshold voltage, so as to stop the write operation based on a detection result.

Abstract: It is to improve the storage stability of a sealant, to retain the flowability of the sealant when sealing, and to achieve an effective curing rate of the sealant by heating to be applicable as a sealant for delicate semiconductors. It is an epoxy resin composition for sealing a semiconductor, comprising the following component (A) and component (B). (A) an epoxy resin, (B) a clathrate complex comprising (b1) an aromatic carboxylic acid compound, and (b2) at least one imidazole compound represented by formula (II) (wherein R2 represents a hydrogen atom, etc.; R3 to R5 represent a hydrogen atom, etc.).

Abstract: In a feature matching method for recognizing an object in two-dimensional or three-dimensional image data, features in each of which a predetermined attribute in the two-dimensional or three-dimensional image data takes a local maximum and/or minimum are detected, and features existing along edges and line contours from the detected features are excluded. Thereafter, the remaining features are allocated to a plane, some features are selected from the allocated features by using local information, and feature matching for the selected features being set as objects is performed.

Abstract: To provide a mounting substrate that requires a reduced amount of solder and reduces a thermal effect of solder on the interior of an electronic component, and a microphone to be mounted on the substrate. A mounting substrate according to the present invention includes: a solder part formed on a part of an electrode formed on the mounting substrate; a resist film formed to prevent the solder of the solder part from flowing out of a predetermined range; and a gas-escape groove that is constituted by the absence of the electrode and the resist film and allows gas produced during soldering to escape.

Abstract: A technique for increasing rewriting current without increasing a power supply voltage and also reducing location dependency inside a memory array of a resistive state after the rewriting is provided in a resistance change memory in which the resistance value of a memory cell changes between logical values “1” and “0”. In the resistance change memory, bit lines are formed into a layered structure, the bit line select switches for connecting to the global bit line are provided at both ends of the local bit line, and a control method of the bit line select switches is changed in the writing and the reading, thereby realizing the optimum array configurations for each of them. More specifically, in the writing and the reading, two current paths are provided in parallel by turning ON the bit line select switches simultaneously.

Abstract: A resistance variable memory reduces the nonuniformity of resistance values after programming, so that a rewrite operation can be performed on a memory cell at high speed. A reference resistor is connected in series with the resistance variable memory cell, and a sensor amplifier detects whether the potential at an intermediate node between the memory cell and the reference resistor exceeds a given threshold voltage, so as to stop the write operation based on a detection result.

Abstract: A solid electrolyte memory involves a problem that stable rewriting is difficult since the amount of ions in the solid electrolyte and the shape of the electrode are changed by repeating rewriting. In a semiconductor device in which information is stored or the circuit connection is changed by the change of resistance of the solid electrolyte layer, the solid electrolyte layer includes a composition, for example, of Cu—Ta—S and an ion supply layer in adjacent or close therewith as Cu—Ta—O, in which ions supplied from the ion supply layer form a conduction path in the solid electrolyte layer thereby making it possible to store information by the level of the resistance and applying the electric pulse to change the resistance, in which the ion supply layer includes crystals having, for example, a compositional ratio of: Cu—Ta—O=1:2:6 and rewriting operation can be performed stably.

Abstract: The performance of a semiconductor device capable of storing information is improved. A memory layer of a memory element is formed by a first layer at a bottom electrode side and a second layer at a top electrode side. The first layer contains 20-70 atom % of at least one element of a first element group of Cu, Ag, Au, Al, Zn, and Cd, contains 3-40 atom % of at least one element of a second element group of V, Nb, Ta, Cr, Mo, W, Ti, Zr, Hf, Fe, Co, Ni, Pt, Pd, Rh, Ir, Ru, Os, and lanthanoid elements, and contains 20-60 atom % of at least one element of a third element group of S, Se, and Te. The second layer contains 5-50 atom % of at least one element of the first element group, 10-50 atom % of at least one element of the second element group, and 30-70 atom % of oxygen.

Abstract: A metallic or resinous material having excellent deodorant, antifouling, antibacterial, antifungal, and other effects which can be industrially efficiently provided by applying to a polymer resin film an adhesive coating fluid containing a silane coupling as a hardener, drying the coating to form an adhesive layer, applying a coating fluid for photocatalyst-layer formation, subsequently drying the coating to produce a photocatalyst-supporting film consisting of the polymer film and a photocatalyst layer deposited thereon through the adhesive layer, and laminating this photocatalyst-supporting film to the surface of a metallic plate or resin structure by heat pressing. The laminate may be processed into a complicated shape.

Abstract: A mobile application (13) and a matching processing section (21) execute template matching on an image input by an image input section (11), using classification templates (51) registered in a classification TP data management DB (22) and corresponding to classification information on markers. The mobile application (13) and matching processing section (21) further execute template matching on the image input by the image input section (11), using individual templates (52) corresponding to the classification template matched in the classification template matching and to detailed information on the markers.

Abstract: A microphone contains a capacitor in a capsule with a diaphragm serving as one of electrodes of the capacitor. The microphone is mounted on a mounting board when external terminals installed on an external surface of a circuit board which closes an opening of the capsule are connected face to face with connection terminals on the mounting board. A sound hole is formed in the circuit board and through-hole is formed in the mounting board, being placed in such a position as to avoid overlapping each other when the microphone is mounted. An enclosed space which communicates the through-hole and sound hole is formed when the external terminals are connected with the connection terminals on the mounting board.

Abstract: Based on an image input by an image input section (11), a mobile application (13) and a matching process section (21) use templates managed in a hierarchical manner to search a TP data management DB (22) for an image. At this time, the mobile application (13) and matching process section (21) perform template matching using a higher level hierarchical template (e.g., 1st-level hierarchical template 2221) and subsequent template matching using a lower level hierarchical template (e.g., 2nd-level hierarchical template 2222) to narrow down the number of images to be searched for and display images as narrowed down search results.

Abstract: A metallic or resinous material having excellent deodorant, antifouling, antibacterial, antifungal, and other effects which can be industrially efficiently provided by applying to a polymer resin film an adhesive coating fluid containing a silane coupling as a hardener, drying the coating to form an adhesive layer, applying a coating fluid for photocatalyst-layer formation, subsequently drying the coating to produce a photocatalyst-supporting film consisting of the polymer film and a photocatalyst layer deposited thereon through the adhesive layer, and laminating this photocatalyst-supporting film to the surface of a metallic plate or resin structure by heat pressing. The laminate may be processed into a complicated shape.

Abstract: A metallic or resinous material having excellent deodorant, antifouling, antibacterial, antifungal, and other effects which can be industrially efficiently provided by applying to a polymer resin film an adhesive coating fluid containing a silane coupling as a hardener, drying the coating to form an adhesive layer, applying a coating fluid for photocatalyst-layer formation, subsequently drying the coating to produce a photocatalyst-supporting film consisting of the polymer film and a photocatalyst layer deposited thereon through the adhesive layer, and laminating this photocatalyst-supporting film to the surface of a metallic plate or resin structure by heat pressing. The laminate may be processed into a complicated shape.

Abstract: To provide a mounting substrate that requires a reduced amount of solder and reduces a thermal effect of solder on the interior of an electronic component, and a microphone to be mounted on the substrate. A mounting substrate according to the present invention includes: a solder part formed on a part of an electrode formed on the mounting substrate; a resist film formed to prevent the solder of the solder part from flowing out of a predetermined range; and a gas-escape groove that is constituted by the absence of the electrode and the resist film and allows gas produced during soldering to escape. In the case where a component having a central terminal and a peripheral terminal is mounted on the mounting substrate, each part of the mounting substrate has the characteristics described below.