Abstract: Provided is a method for producing a sintered body that forms a rare-earth permanent magnet, has a single sintered structure and an arbitrary shape, and has easy magnetization axis orientations of different directions applied to the magnet material particles in a plurality of arbitrary regions. This method forms a three-dimensional first molded article from a composite material formed by mixing a resin material and magnet material particles containing a rare-earth substance. The first molded article is then subjected to a deforming force and a second molded article is formed in which the orientation direction of the easy magnetization axis of the magnet material particles in at least the one section of the horizontal cross-section is changed to a direction which differs from the orientation direction of the first molded article. The second molded article is heated to a sintering temperature and kept at the temperature for a period of time.

Abstract: Provided is a method for producing a sintered body that forms a rare-earth permanent magnet, has a single sintered structure and an arbitrary shape, and has easy magnetization axis orientations of different directions applied to the magnet material particles in a plurality of arbitrary regions. This method forms a three-dimensional first molded article from a composite material formed by mixing a resin material and magnet material particles containing a rare-earth substance. The first molded article is then subjected to a deforming force and a second molded article is formed in which the orientation direction of the easy magnetization axis of the magnet material particles in at least the one section of the horizontal cross-section is changed to a direction which differs from the orientation direction of the first molded article. The second molded article is heated to a sintering temperature and kept at the temperature for a period of time.

Abstract: The present invention provides, as a separator for fuel cell which is lightweight, can be easily made thin, and which has superior corrosion resistance and shape stability, a fuel cell 100 containing a separator for fuel cell 10, wherein a conductor pattern 2 is formed on one principal plane 1A of an insulation layer 1 to form a groove for a gas flow path 3 sectioned by the conductor pattern 2 on this principal plane, a conductor terminal 4 is formed on the other principal plane 1B of the insulation layer 1, and this conductor terminal 4 and the conductor pattern 2 are electrically connected by a via hole 5 penetrating the insulation layer 1, and a membrane electrode assembly (complex having an electrolyte membrane and an electrode (fuel electrode, oxygen electrode) laminated thereon) 14 having the separator for fuel cell disposed on both surfaces.

Abstract: The invention provides a thin metal layers-having ceramic green sheet comprising: a base film; a first thin metal layer formed on the whole surface of the base film; a second thin metal layer formed on the first thin metal layer in the form of predetermined pattern; and a ceramic powder-dispersed layer which comprises a binder and a ceramic powder dispersed therein and which is formed on the metal films including the first thin metal layer and said second thin metal layer. Also disclosed is a method for producing a ceramic capacitor using a plurality of the thin metal layers-having ceramic green sheets.

Abstract: The present invention provides, as a separator for fuel cell which is lightweight, can be easily made thin, and which has superior corrosion resistance and shape stability, a fuel cell 100 containing a separator for fuel cell 10, wherein a conductor pattern 2 is formed on one principal plane 1A of an insulation layer 1 to form a groove for a gas flow path 3 sectioned by the conductor pattern 2 on this principal plane, a conductor terminal 4 is formed on the other principal plane 1B of the insulation layer 1, and this conductor terminal 4 and the conductor pattern 2 are electrically connected by a via hole 5 penetrating the insulation layer 1, and a membrane electrode assembly (complex having an electrolyte membrane and an electrode (fuel electrode, oxygen electrode) laminated thereon) 14 having the separator for fuel cell disposed on both surfaces.

Abstract: The present invention aims at providing a production method capable of efficiently producing an anisotropic conductive connector having a structure wherein the center line of plural conductive paths penetrating in the thickness direction of a film substrate forms an angle with a line perpendicular to the principal plane of the film substrate, which shows high reliability of connection with the target.

Abstract: A metal transfer sheet which is so low in peel-strength as to be transferred to an object to be transferred with ease and reliability; a producing method thereof; and a ceramic condenser producing method for producing a reliable, compact, thin-layer ceramic condenser with improved production efficiency by transferring a metal layer to the ceramic condenser by using the metal transfer sheet. After a first metal layer is formed on a carrier film in a sputtering or an electrolytic plating method, the member thus formed is dipped in plating solution and voltage is applied in such a way that the first metal layer side is anode, to form a passive film. Sequentially, with the polarity reversed, voltage is applied in such a way that the passive film side is cathode, to form the second metal layer. After this manner, a metal transfer sheet in which the first metal layer and the second metal layer are laminated through the passive film interposed therebetween is obtained.

Abstract: Circuit patterns are formed on the one surface of an insulating substrate, and an insulating layer is formed to cover the circuit patterns. The insulating layer is made of a photosensitive and thermally-melting type adhesive resin. In the insulating layer, through-holes are made by exposure/development processing to form conductive paths for contacts and contact portions. On the other surface of the insulating substrate, a conductive layer is formed and openings each passing through the conductive layer and insulating substrate are formed. Thus, a mounting substrate can be obtained which has a structure in which first circuit patterns each is exposed in each of the openings. A chip is mounted on the mounting substrate thus formed and heated. The insulating layer serves as an adhesive to seal the active face of the chip.

Abstract: In a method for manufacturing an interposer for CSP and its intermediate body, a first insulating layer is formed on a cathode substrate. An opening is formed at a position in the insulating layer where a contact is to be formed so that the surface of the substrate is exposed to the inner bottom of the opening. The opening is filled with metal by the electroplating using the cathode substrate as a cathode to form a conductive path. A circuit pattern which is contact with the conductive path is formed on the insulating layer. The cathode substrate is removed partially or entirely so that the end surface of the conductive path is exposed to form a contact. This permits a variation of the heights of a plurality of contacts to be reduced.

Abstract: In a film carrier with a conductive circuit formed, an opening is formed in a particular position relative to where the conductive path is to be formed. The opening is a through-hole, filled with a conductive material to form a conductive path. The conductive circuit has a concave face, provided according to certain formulae. The film carrier can cope with a fine-pitched and highly dense mounting, while prohibiting pulling out of the conductive path by an external force. The film carrier does not suffer from fallout of the conductive path, and has increased electrical connection reliability.

Abstract: A method for producing a circuit substrate having a bump contact point, comprising the steps of (a) disposing a positive electrode in a plating solution stored in a storage tank, (b) exposing a conductive circuit formed on an insulating substrate, above the surface of the plating solution, (c) disposing a jet stream opening below the surface of the plating solution, and (d) spouting out the plating solution from the jet stream opening toward the negative electrode for electroplating using said conductive circuit as a negative electrode, to form the bump contact point on the surface of the negative electrode, and a jet stream type plating apparatus used therefor. According to the present invention, mixing of air bubbles in the plating solution can be inhibited, which in turn enables suppression of oxidative decomposition of the brightener components. As a consequence, the bump contact point can have a mushroom shape, and variation in the height of the bump contact points can be minimized.

Abstract: Disclosed are a film carrier comprising an insulating layer having laid therein an electrically conductive circuit such that the circuit is not exposed on the surface thereof, wherein conductive passages from the conductive circuit to one surface of the insulating layer are formed in the insulating layer and via holes from said conductive circuit to the other surface of the insulating layer are formed and a semiconductor device prepared by mounting a semiconductor element on the insulating layer of the film carrier. The film carrier can sufficiently correspond to pitch-fining and high-density mounting of a semiconductor element wiring, can surely perform the connecting operation of inner lead bonding and outer lead bonding and gives the mounting area of as small as possible.

Abstract: In a film carrier with a conductive circuit formed, an opening is formed in a particular position relative to where the conductive path is to be formed. The opening is a through-hole, filled with a conductive material to form a conductive path. The conductive circuit has a concave face, provided according to certain formulae. The film carrier can cope with a fine-pitched and highly dense mounting, while prohibiting pulling out of the conductive path by an external force. The film carrier does not suffer from fallout of the conductive path, and has increased electrical connection reliability.

Abstract: A film carrier comprising, on a laminate of an insulating layer and a conductive circuit, a conductive part to be connected to an external substrate and an energy introduction part to supply an energy to connect a semiconductor element, a semiconductor device, and a method for mounting a semiconductor element. The present invention has enabled provision of fine-pitched or highly dense wiring of a semiconductor element, and assures easy and dependable electric construction of the present invention wherein an energy for connection is supplied from the energy introduction part to make a connection of a film carrier to semiconductor element is advantageous in that attenuation of the energy for connection due to an insulating layer occurs less, since the energy for connection can be directly introduced into conductive circuit, thus enabling efficient utilization of the energy, which in turn permits easy and efficient mounting of a semiconductor element.

Abstract: A connecting method comprising laminating a flexible circuit substrate having a plurality of bump contacts with a contact object having a plurality of portions to be contacted such that the respective bump contacts face to the portions to be contacted at a joined surface, correspondingly each other to form a laminate, and applying pressure to the entire surface of the laminate in a compressing direction with pressurizing means provided so as to pinch the laminate in a laminating direction to contact the plural bump contacts mounted on the flexible circuit substrate with the plural portions to be contacted corresponding thereto mounted on the contact object, respectively.

Abstract: A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed. The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer.

Abstract: A printed circuit substrate with projected electrode and a connection method using the same are disclosed. The printed circuit substrate comprises an insulating substrate having formed on one surface or both surfaces thereof an electrically conductive circuit, wherein at least one projected electrode comprising a metallic substance is formed at the side of the end portion of the electrically conductive circuit.

Abstract: An anisotropic conductive film is disclosed, comprising an insulating film having fine through-holes independently piercing the film in the thickness direction, each of the through-holes being filled with a metallic substance in such a manner that at least one end of each through-hole has a bump-like projection of said metallic substance having a bottom area larger than the opening of the through-hole. The metallic substance serving as a conducting path is prevented from falling off, and sufficient conductivity can be thus assured.

Abstract: An anisotropic conductive film is disclosed, comprising an insulating film having fine through-holes independently piercing the film in the thickness direction, each of the through-holes being filled with a metallic substance in such a manner that at least one end of each through-hole has a bump-like projection of said metallic substance having a bottom area larger than the opening of the through-hole. The metallic substance serving as a conducting path is prevented from falling off, and sufficient conductivity can be thus assured.

Abstract: A wiring substrate, a film carrier, a semiconductor device made by using the film carrier, and a mounting structure comprising the semiconductor device are disclosed.The wiring substrate comprises:a conductor pattern which has a bonding pad and is formed on the rear surface of an insulating support;at least one of minute through-holes which are provided in a region of the insulating support where the bonding pad is in contact therewith, or which are provided a region of the insulating support where the bonding pad is in contact therewith and in the vicinity of the region, the through-holes running in the direction of the thickness of the insulating support;a conductive passage which is made of a metal material and which is formed in the through-holes that are provided in a region of the insulating support where the bonding pad is in contact therewith; anda bump-like metal protrusion which is formed on the conductive passage and which is protruded from the front surface of the insulating support.